A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.

A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.

A tape erroneous mounting detection system includes sensors provided to the plurality of tape feeders, a reader configured to read identification information from a recording part which is provided to a reel, and a memory part configured to store part verification information. The tape erroneous mounting detection system also includes a part verification part configured to determine whether or not the tape is mounted on the tape feeder at the set position, and to perform verification updating processing, and a tape erroneous mounting detection part configured to perform erroneous mounting detection processing where the tape erroneous mounting detection part identifies the tape feeder on which the tape is mounted based on the tape presence or absence information and the output from the sensor, and the tape erroneous mounting detection part detects that the tape mounted on the tape feeder is erroneously mounted.

A tape ejection guide structure (8) is a structure which guides ejection of a component storing tape (100) ejected from a tape ejection port (23) of a component supply unit (1A), and includes a guide body (81), and a pair of restraining portions (83). The guide body (81) guides an upper surface portion (100A) of the component storing tape (100) which is ejected from the tape ejection port (23) in a tape ejection direction (H2). A pair of restraining portions (83) is connected to both end portions of the guide body (81) in a tape width direction (H3) respectively, and restrains the displacement in the tape width direction (H3) of the component storing tape (100) which is ejected in a state where the upper surface (100A) is guided by the guide body (81).

A control system of a tape feeder that includes a reel on which is wound component supply tape, and a tape feeding device configured to draw out the component supply tape from the reel to a component pickup position, the control system including a sensor configured to detect information relating to a remaining amount of the tape on the reel; and a motor control section configured to change an operation parameter of a motor that is a drive source of the tape feeding device based on the tape remaining amount information detected by the sensor. Specifically, the motor control section changes the operation parameter of the motor so as to reduce the motor torque as the tape remaining amount on the reel decreases, based on the tape remaining amount information detected by the sensor.

An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.

The present invention provides a mounting tool tip arranged for being releasably mounted to mounting tool of a component mounting machine, said mounting tool being rotatably arranged in said component mounting machine around a vertical rotational axis. The mounting tool tip comprises a tip portion at a first end and arranged for engagement with a component to be mounted in a component mounting machine; engagement means for mounting said mounting tool tip to said mounting tool. Further, the engagement means is arranged at a second end opposite said first end and further configured such that said tip portion is off-center in a horizontal direction compared to said rotational axis when the mounting tool tip is mounted to said mounting tool. The present invention further provides a mounting tool, a mount head, a component mounting machine as well as method for simultaneously picking at least two components arranged in adjacent component tapes in a component mounting machine.

An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.

A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

The unloading operation of winding the carrier tape on the component supply reel by driving the component supply reel to extract the component supply reel from the tape feeder is performed. That is, the carrier tape removed from the tape feeder is wound on the component supply reel. Thus, it is possible to suppress the interference of the preceding tape removed from the tape feeder with the succeeding tape.