In a material verification method, information of newly loaded materials in a production line is obtained. It is determined whether the information has been verified. If the information has not been verified, it is determined whether a tray supporting the newly loaded materials has been switched from use in producing a first product to use in producing a second product. If the tray supporting the newly loaded materials is not switched to use in producing the second product, the information of the newly loaded materials is presented to a user for material verification. A system for administering such method and a device applying the method are also disclosed.

A substrate height measuring device includes an imaging section, a setting section, and a measurement section. The imaging section allows an imaging device to image a region of at least a part of a clamped substrate, the region including a measurement planned position at which a height of the substrate is to be measured. The setting section allows a display device to display a substrate image imaged by the imaging section and adjusts a measurement position at which the height of the substrate is actually measured based on the measurement planned position of the substrate image displayed on the display device to set the measurement position. The measurement section allows a measurement device to measure the height of the substrate at the measurement position set by the setting section.

A substrate height measuring device includes an imaging section, a setting section, and a measurement section. The imaging section allows an imaging device to image a region of at least a part of a clamped substrate, the region including a measurement planned position at which a height of the substrate is to be measured. The setting section allows a display device to display a substrate image imaged by the imaging section and adjusts a measurement position at which the height of the substrate is actually measured based on the measurement planned position of the substrate image displayed on the display device to set the measurement position. The measurement section allows a measurement device to measure the height of the substrate at the measurement position set by the setting section.

The simulation device includes a simulation section and an output section. The simulation section is configured to simulate an operating status of a board work machine configured to perform predetermined board work on a board and produce a board product, and an operating status of an article moving device configured to supply an article needed for production of the board product to the board work machine based on a production plan of the board product. The output section is configured to output time series information indicating a temporal change of the operating status of the board work machine and a temporal change of the operating status of the article moving device, which are results of simulation by the simulation section.

A device for handling components that is designed and equipped to handle components with multiple lateral surfaces and/or edges of the lateral surfaces. The device has at least one receiving tool, which is arranged on a turning device, for a respective component of the components, where the receiving tool is designed and equipped to receive the respective component on one of the component cover surfaces. The turning device is designed and equipped to rotate the receiving tool on a turning plane about a turning axis, and in the process optionally convey a component located on the receiving tool from a receiving position to one or more orientation positions, optionally one or more inspecting positions, a setting-down position, and optionally an ejecting position. The device also has a holding and supplying device, which faces the receiving position, for a component supply, and a discharge device.

A suction position adjustment device of a component mounter which includes a head having multiple pickup members and that executes simultaneous suction control for substantially simultaneously picking up multiple components with the multiple pickup members by moving the head to a target position that is determined to locate the multiple pickup members on the multiple components supplied from multiple feeders to a supply position. The suction position adjustment device includes an imaging device configured to image the supply position of the feeder from above, a display device, and a control device. The control device configured to control the imaging device so that an upper surface, at the supply position, in the multiple feeders of adjustment targets is captured and display, on the display device, captured multiple upper surface images and multiple pointers superimposed on the multiple upper surface images, when the target position is adjusted.

A component mounting machine includes an imaging device configured to image a supply position, to which a component is supplied from a component supply device, from above, a component detecting sensor configured to detect the component. A control device acquires component information related to the component supplied by the component supply device when a predetermined determination condition is established. Then the control device selects from multiple processing including first determination processing for determining presence or absence of a component shortage of the component supply device by determining presence or absence of the component at the supply position based on a captured image, and second determination processing for determining presence or absence of a component shortage of the component supply device by detecting the presence or absence of the component at the supply position by the component detecting sensor.

A substrate work machine for repeatedly performing substrate work, the substrate work machine including a data storing section configured to store component data used in the substrate work, the component data including shape data related to a shape of an electronic component to be mounted on a substrate, a reference value and a tolerance; a data determining section configured to determine whether a difference between measurement data acquired by measuring the electronic component during the substrate work and the reference value of the component data is within a range of the tolerance; a quality information acquiring section configured to acquire work quality information related to a performance condition of a second substrate work machine; and a data correcting section configured to correct at least one of the reference value and the tolerance in accordance with the work quality information.

A component supply device including an accommodation body installation unit in which one or more accommodation bodies each accommodating components are installable, the component supply device sequentially operates the one or more accommodation bodies to supply each of the components to a predetermined component supply position. The component supply device comprises a supply state detector which detects a supply state of components in total accommodated in the one or more accommodation bodies installed on the accommodation body installation unit, a determination unit which determines, based on the supply state, a state of the accommodation body installation unit among (i) an installation disabled state, (ii) an installation enabled state, and (iii) an installation required state, and a notifier which notifies a worker of the state of the accommodation body installation unit determined by the determination unit.

A carrier tape holding electrical components to a reel around which the carrier tape is wound is provided. Furthermore, the present disclosure is related to a pick-and-place apparatus for receiving this carrier tape and for picking and placing the electrical components arranged in the carrier tape. The carrier tape according to an aspect of the present disclosure includes an adhesive film that forms a bottom wall of the cavities in which a plurality of electrical components is arranged. The adhesive of the adhesive film is configured to substantially release the attachment of the electrical component as a result of heating the adhesive and/or as a result of irradiating the adhesive using light, such as visible light, infrared light, or ultraviolet light, for the purpose of allowing the electrical component to be removed from the cavity using a pick-and-place apparatus.