An image processing device for processing an image of a tape in which multiple cavities for accommodating a component are provided along a predetermined feeding direction includes a generation section configured to extract brightnesses of pixels of a line along the feeding direction from the image and to generate a brightness waveform of the line, and a recognition section configured to execute a periodic analysis of a brightness change from the brightness waveform and to recognize a pitch of the cavities based on a wavelength obtained by the periodic analysis.

A method for detecting errors or malfunctions in electrical or electronic components of circuits, wherein each of the circuits is located on a circuit board and wherein a plurality of circuit boards border one another on a circuit board panel, includes populating each of the circuit boards of the circuit board panel with electrical or electronic components corresponding to the circuits; for each of the analog, electrical or electronic components used for the construction of the circuits, placing a corresponding test component in an edge region of the circuit board panel; providing the analog, electrical or electronic test components placed in the edge region of the circuit board panel with test points; and checking for the correct function value and/or the correct poling of the analog, electrical or electronic test components provided with test points and located in the edge region of the circuit board panel.

A component mounting system includes a component mounter group, a storage section configured to store multiple production jobs, and a grouping execution section configured to allocate, when grouping the multiple production jobs, production jobs having a degree of commonality in type of components included in each production job satisfying a predetermined determination criterion to the same group, in which the group is set to perform an individual exchange of the component supply device without performing a collective exchange of a pallet of each component mounter when processing the production job belonging to the same group, and to perform the collective exchange of the pallet of each component mounter and not to perform the individual exchange of the component supply device when processing the production job belonging to different groups.

An allowance setting system, a substrate inspection device, an allowance setting method, and a substrate inspection method that can set an appropriate inspection allowance are provided in which a normal mounting position of electronic component on a component mounting surface of substrate is defined as normal position. A deviation of an actual mounting position of electronic component in a surface direction of the component mounting surface with respect to the normal position is defined as surface direction deviation. A deviation of the actual mounting position of electronic component in a rotation direction within the component mounting surface with respect to normal position is defined as angular deviation. Allowance setting system sets multiple surface direction inspection allowances according to angular deviation for evaluating surface direction deviation in a substrate inspection before reflow.

A mounting device of the present disclosure used in a mounting system, includes a supply section configured to hold a component, a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target, an inspection/imaging section configured to capture an image of the mounting target, and a control section configured to execute a missing component inspection process of detecting whether a component on the mounting target is missing or not by using a captured image of the mounting target, and, when a component is missing, control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.

In an electrical characteristic acquisition apparatus, a condition under which an electrical characteristic of a target object is acquired can be inputted by an operator, and an electrical characteristic of the target object is acquired under the input condition. In a case where a condition is inputted as a condition under which an electrical characteristic of the target object is acquired, an erroneous determination is made due to the different conditions that the target object is not an electrical component which complies with the nominal value, or, in a case where a difference between a value representing an electrical characteristic of the target object and a nominal value of the target object is larger than a permissible tolerance, an erroneous determination is made that the target object is defective. Here, these erroneous determinations are prevented from being made.

A component shortage detection device detects a component shortage of a tape feeder installed in a component mounting device. The component shortage detection device includes a sensor, configured to detect the tape, and provided at a position that is a midpoint of a tape transportation path of the tape feeder and upstream of a component extraction position by a component mounting head in a tape transportation direction. The component shortage detection device further includes a residual quantity calculation unit configured to calculate a component residual quantity of the tape during a mounting operation; and a determination unit configured to determine whether a component shortage occurs on a basis of output information from the sensor and the component residual quantity when the head fails in extraction of the component.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of controllers being configured to control a respective one of the plurality of pipettes.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The component placement system also includes a vacuum source for providing vacuum to each of the plurality of pipettes for holding a component. The component placement system also includes a positive fluid source for selectively providing a positive fluid pressure for releasing the component from a respective one of the plurality of pipettes.

In a component replenishment management system, a setting unit sets work allowable time of an operator in a work area, a replenishment target identification unit identifies component replenishment target devices which are targets of component replenishment work by the operator, and a work progress determination unit determines a progress state of the component replenishment work. Then, an extraction unit extracts the component replenishment target devices for which the component replenishment work is to be performed before work time in the work area by the operator reaches the work allowable time among the component replenishment target devices whose progress state of the component replenishment work is work not performed.