A component feeding system including: a stage configured to support components in a scattered state; a holding tool configured to pick up and hold the component scattered on the stage; an imaging device configured to image the components scattered on the stage; and a control device configured to acquire, based on image data of the imaging device, a pickup possible component quantity that is a quantity of components that can be picked up by the holding tool from among the components scattered on the stage.

Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.

A component mounting machine includes a base material device to convey a circuit base material, a component mounting device to mount an electronic component, an imaging device to capture a predetermined region including the circuit base material, a first detection section to detect at least one device mark provided on the base material device and at least one base material mark provided on the circuit base material, a calculation section to calculate a position on the circuit base material where the electronic component is to be mounted, based on the device mark and the base material mark detected by the first detection section, and a feedback section configured to feed back, as a correction value for correcting a position on the circuit base material to be calculated next by the calculation section, a part of the deviation amount detected by a second detection section.

Provided is a method for populating printed circuit boards, which includes the steps of acquiring jobs, in each case relating to populating printed circuit boards of a printed circuit board type on the pick-and-place line, and associated probabilities by a job is to be executed in each case, assigning printed circuit board types of the jobs to set-up families, determining for each set-up family the characteristic number which comprises the sum of probabilities of those jobs, the printed circuit board types of which are comprised by the set-up family, optimizing the assignment in such a way that the characteristic numbers of different set-up families are as different as possible, providing a set-up from one of the determined set-up families on the pick-and-place line, and populating printed circuit boards on the pick-and place line.

A component mounting machine includes a board conveyance device, a component supply device, a component transfer device which includes a mounting head and a head driving mechanism, and a mounting order control device. The component mounting machine partitions a long printed circuit board of a length exceeding a mounting station into a plurality of mounting areas, sequentially positions each mounting area in the mounting station, and mounts the electronic components. The mounting order control device performs control to change the mounting order of the electronic components.

A method and an apparatus of inspecting a substrate with a component mounted thereon, which are capable of inspecting whether the component is properly mounted or not without additional setting or changing inspection condition, are provided. The method comprises measuring a three-dimensional shape by irradiating the pattern image toward the substrate through at least one illumination unit and by taking a reflected image through an imaging unit, extracting a shield region from the three-dimensional shape, and inspecting a component mounting defect in an area excluding the shield region in the three-dimensional shape.

A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.

A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.

The component mounting device includes a component supply part on which a component supply unit that supplies a component stored in a carrier tape is detachably mounted; a feeder information acquisition part that acquires feeder information including a type of the component supply unit mounted on the component supply part; a component mounting part that mounts the component supplied from the component supply unit onto a substrate; and a unit controller that controls the component supply unit based on the feeder information.

An electronic component mounting apparatus includes: a transfer unit picking up an upper surface of a light emitting device package having a front surface on which a light emitting diode chip is disposed, and transferring the light emitting device package to a printed circuit board, a light source unit disposed on a transfer path of the light emitting device package, and irradiating measurement light onto the front surface of the light emitting device package, a camera capturing an image of the light emitting device package to which the measurement light is irradiated, and a control unit image-processing the image to identify excitation light, emitted when the measurement light is excited from the light emitting diode chip, in the image, and controlling the transfer unit to mount the light emitting device package on the printed circuit board when identifying the excitation light.