Disclosed is a machine for transferring electronic components onto electronic cards (4), including: a conveyor (1) on which the electronic cards (4) file past in succession, and sensors (3) disposed along the conveyor in such a way as to determine the position of the electronic cards (4) filing along the conveyor (1). The density of the sensors (3) along the conveyor (1) is sufficiently high such that an electronic card (4) does not leave the field of a sensor (3) before it has entered the field of another sensor (3), over at least a part of the length of the conveyor (1).

Disclosed is a machine for transferring electronic components onto electronic cards (4), including: a conveyor (1) on which the electronic cards (4) file past in succession, and sensors (3) disposed along the conveyor in such a way as to determine the position of the electronic cards (4) filing along the conveyor (1). The density of the sensors (3) along the conveyor (1) is sufficiently high such that an electronic card (4) does not leave the field of a sensor (3) before it has entered the field of another sensor (3), over at least a part of the length of the conveyor (1).

A work head unit that detects the rotational position of suction nozzle with first Q-axis encoder positioned facing component holding section that holds a component. With the work head unit, it is desirable to detect the orientation of component holding section at two locations: suction nozzle and syringe member.

Control device 80 of component mounter 11 performs control such that after a component supplied by reel unit 56 is picked up by nozzle 40 of mounting head 24 and before the component is mounted on board 12, the component is temporarily placed at a specified position of temporary placement surface 71. Also, control device 80, after performing control such that the component is temporarily placed at the specified position, determines whether the component has actually been temporarily placed at the specified position based on the pressure state at a hole provided at the specified position of temporary placement surface 71 to which negative pressure is being supplied, and performs processing according to the determination result. Because the determination of whether the component has actually been temporarily placed is based on the pressure state of the hole provided in temporary placement surface 71, the determination is performed rapidly compared to a case in which the presence of the component is checked by analyzing an image of temporary placement surface 71 captured from above.

A component mounter is provided with a characteristic value measuring device that measures a characteristic value of first component, and head that mounts each of first component and second component on board. Second component is a digital potentiometer provided with receiver section that receives information from head, variable resistance section for which the resistance is variable, and control section that controls the resistance value of variable resistance section. Head is provided with receiver section that receives information from characteristic value measuring device, sender section that sends information to second component, power source that supplies electric current to variable resistance section, memory section that memorizes the resistance value of second component according to the characteristic value of first component, and control section.

A component mounter is provided with a characteristic value measuring device that measures a characteristic value of first component, and head that mounts each of first component and second component on board. Second component is a digital potentiometer provided with receiver section that receives information from head, variable resistance section for which the resistance is variable, and control section that controls the resistance value of variable resistance section. Head is provided with receiver section that receives information from characteristic value measuring device, sender section that sends information to second component, power source that supplies electric current to variable resistance section, memory section that memorizes the resistance value of second component according to the characteristic value of first component, and control section.

A method for mounting an electronic component onto a circuit board. The method may include preparing a mounting device including a rotatable mounting head, a holding means to hold the electronic component, a component recognition camera, a memory device, and a microcomputer, the electronic component being mounted onto the circuit board based on a result of performing recognition processing with respect to an acquired image, determining a mid-operation instruction action mode at start of a production operation, executing an instruction of obtaining an offset value relative to a rotation center of the rotatable mounting head and storing the offset value in the memory device at a time interval according to the determined mid-operation instruction action mode, and executing the instruction at a longer time interval when the instruction has continuously met a required accuracy more than once.

An equipment element maintenance management method for managing a maintenance operation for an equipment element that is attached to manufacturing equipment for manufacturing a product includes: acquiring operation history information of the manufacturing equipment at a predetermined timing; analyzing a tendency of a state of the equipment element based on the acquired operation history information; performing the maintenance operation for the equipment element of which the state is worse than a predetermined state; creating maintenance result information which is a result of the maintenance operation; and creating a repair operation instruction for performing an instruction of a repair operation for the equipment element of which the state after the maintenance operation is not more improved than the predetermined state based on the maintenance result information.

An equipment element maintenance management method for managing a maintenance operation for an equipment element that is attached to manufacturing equipment for manufacturing a product includes: acquiring operation history information of the manufacturing equipment at a predetermined timing; analyzing a tendency of a state of the equipment element based on the acquired operation history information; performing the maintenance operation for the equipment element of which the state is worse than a predetermined state; creating maintenance result information which is a result of the maintenance operation; and creating a repair operation instruction for performing an instruction of a repair operation for the equipment element of which the state after the maintenance operation is not more improved than the predetermined state based on the maintenance result information.

A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.