The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.

The image-capturing unit includes an imaging section; a holding section configured to hold a subject to be imaged by the imaging section; a light irradiation section configured to select light of one or more light sources out of multiple light sources having different wavelengths, and to irradiate the subject held in the holding section with the light; a storage section configured to store a correspondence among a color of the light emitted for irradiating the subject by the light irradiation section, a material of an irradiation surface irradiated with the light, and a resolution representing the number of pixels per unit length; and an image processing section configured to obtain the resolution from the correspondence, based on the color of the light emitted for irradiating the subject and the material of the irradiation surface of the subject, and to process a subject image by using the resolution.

An image processing device for processing an image of a tape having provided therein multiple cavities for receiving a component as a supply target includes a feature amount acquisition section configured to extract brightnesses of pixels within a predetermined range which can include a bottom surface of the cavity and a component inside the cavity using the image and acquire a value indicating scatter of the extracted brightnesses as a feature amount, and a determination section configured to determine on existence or non-existence of a component inside the cavity based on a determination threshold determined based on the feature amount for each of a case in which a component exists inside the cavity and a case in which no component exists inside the cavity and the feature amount acquired from the image.

An image processing device for processing an image of a tape having provided therein multiple cavities for receiving a component as a supply target includes a feature amount acquisition section configured to extract brightnesses of pixels within a predetermined range which can include a bottom surface of the cavity and a component inside the cavity using the image and acquire a value indicating scatter of the extracted brightnesses as a feature amount, and a determination section configured to determine on existence or non-existence of a component inside the cavity based on a determination threshold determined based on the feature amount for each of a case in which a component exists inside the cavity and a case in which no component exists inside the cavity and the feature amount acquired from the image.

A component mounting system includes a mounting machine configured to perform a mounting process of a component on a board by an operation of a unit for the mounting process, an inspector configured to perform an inspection process by using an image of the board after the mounting process and output abnormality information capable of specifying a defective board having an abnormality detected in the inspection process, a camera configured to image the operation of the unit in the mounting machine during the mounting process in a video to store image data in a memory, and a data output section configured to extract image data during the mounting process of the defective board from the memory based on the abnormality information and output the image data to an outside.

It is an object of the present invention to provide a production system and a control method for the production system that can suppress erroneous mounting when a tape feeder is shared and used even when latest tape feeder information is not shared among multiple production lines in a production system having multiple production lines. Information that matches the tape feeder database stored by the line management device is stored in the tape feeder. When the tape feeder is mounted on the mounting machine, the information stored in the tape feeder is read, and when it is determined that the information does not match the tape feeder database, mounting of the electronic component supplied from the tape feeder is stopped.

A mounting device comprises: a mounting head having multiple pickup members configured to pick up components; a mounting control section configured to cause a second component to be picked up later when a first component, held by the mounting head at a predetermined height, and the second component, held by the mounting head at a lowered position lower than the predetermined height, are picked up with the mounting head; the mounting control section being configured to cause the second component to be released earlier when the mounting head, having picked up the first component and the second component, releases a component.

The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.

A tray-type component supply device includes an exchanging table configured to lift and lowered between an upper position and a lower position, a conveyance section configured to receive a tray from the exchanging table and convey the tray, and a control section configured to receive a detection signal from the detection sensor and cause the driving section to operate the exchanging table, the control section including an abnormality detecting section configured to detect an abnormal state in which a height position of the exchanging table becomes unidentified, a retraction operating section configured to cause the exchanging table to move to the retraction position at a low speed when the abnormal state is detected, and a calibration and restoration section configured to calibrate the height position of the exchanging table to restore a normal state.