H05K2201/03

3-D Printed Devices Formed With Magnetic Inks and Methods of Making Graded Index Structures

A 3-D printed device comprising one or more structures, the structures comprising a plurality of magnetically responsive particles and one or more diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer. These 3-D printed devices may be formed using a method that comprises providing a magnetic ink composition; applying the magnetic ink composition to a substrate in a 3-D solvent cast printing process to form one or more structures; and drying the one or more structures formed from the magnetic ink composition. The dried structures can exhibit one or more regions of magnetic permeability greater than 1.310.sup.6 H/m.

Transparent electrode member, method of manufacturing the same, and capacitive sensor that uses transparent electrode member

A transparent electrode member has a transparent base material, a transparent electrode placed on the first surface of the base material, and an insulating layer placed in an insulating region positioned in at least part of the circumference of a region in which the transparent electrode is placed, when viewed from the direction of the normal to the first surface. The transparent electrode has a dispersion layer that includes a matrix composed of an insulating material and also includes conductive nanowires dispersed in the matrix. The transparent electrode also has a region composed of the conductive part and regions composed of optical adjustment parts when viewed from the direction of the normal to the first surface. The conductive region has conductivity higher than the optical adjustment part. In the dispersion layer, the dispersion density of conductive nanowires in the optical adjustment part is lower than that in the conductive part.

TRANSPARENT ELECTRODE MEMBER, METHOD OF MANUFACTURING THE SAME, AND CAPACITIVE SENSOR THAT USES TRANSPARENT ELECTRODE MEMBER

A transparent electrode member has a transparent electrode layer formed of a dispersion layer which includes a matrix and conductive nanowires dispersed therein to provide an optical adjustment region including a conductive portion having a first dispersion density and an optical adjustment portion having a second dispersion density smaller than the first dispersion density. The transparent electrode layer includes a plurality of first and second electrodes each having the optical adjustment region, and a first wire provided between and electrically connecting two adjacent first electrodes. A region of an insulating layer is formed between the first wire and the second electrodes, and between the first electrodes and the second electrodes. The first wire and a part of the first electrodes in a vicinity of the first wire are formed of a non-adjustment region of the dispersion layer including the conductive portion while lacking the optical adjustment portion.

Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes

A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.

HOUSING OF ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING
20190352769 · 2019-11-21 ·

A method for manufacturing a housing of an electronic device includes providing a substrate, forming a metal plating on a surface of the substrate, and laser-etching the metal plating to form a conductive layer. The conductive layer serves as an antenna radiator or a conductive circuit.

SEMICONDUCTOR PACKAGES

A semiconductor package includes an electrical connection structure. The electrical connection structure includes: a first conductive layer; a second conductive layer on the first conductive layer; and a conductive cap between the first conductive layer and the second conductive layer, the conductive cap having a hardness greater than a hardness of the first conductive layer.

TRANSPARENT ELECTRODE MEMBER, METHOD OF MANUFACTURING THE SAME, AND CAPACITIVE SENSOR THAT USES TRANSPARENT ELECTRODE MEMBER

A transparent electrode member has a transparent base material, a transparent electrode placed on the first surface of the base material, and an insulating layer placed in an insulating region positioned in at least part of the circumference of a region in which the transparent electrode is placed, when viewed from the direction of the normal to the first surface. The transparent electrode has a dispersion layer that includes a matrix composed of an insulating material and also includes conductive nanowires dispersed in the matrix. The transparent electrode also has a region composed of the conductive part and regions composed of optical adjustment parts when viewed from the direction of the normal to the first surface. The conductive region has conductivity higher than the optical adjustment part. In the dispersion layer, the dispersion density of conductive nanowires in the optical adjustment part is lower than that in the conductive part.

Bezel structure of touch screen and method for manufacturing the same, touch screen and display device

A bezel structure of a touch screen is disclosed by the invention. A touch screen having the bezel structure, a display device having the touch screen, and a method for manufacturing the bezel structure of the touch screen are also disclosed by the invention.

BEZEL STRUCTURE OF TOUCH SCREEN AND METHOD FOR MANUFACTURING THE SAME, TOUCH SCREEN AND DISPLAY DEVICE
20170177105 · 2017-06-22 ·

A bezel structure of a touch screen is disclosed by the invention, including: a BM portion provided at an end on a back surface of the substrate; a bonding area arranged on the BM portion and provided with a plurality of metal leads and a plurality of transparent conductive solder pads, each of the plurality of transparent conductive solder pads being electrically connected with corresponding one metal lead of the plurality of metal leads; a first insulating photoresist layer arranged between the plurality of transparent conductive solder pads and the plurality of metal leads in a thickness direction of the substrate, the transparent conductive solder pads being electrically connected with corresponding metal leads via jumper holes provided in the first insulating photoresist layer; and a plurality of transparent conductive edge-routing wires arranged on the back surface of the substrate, at both lateral sides thereof, each of the plurality of transparent conductive edge-routing wires extending to the bonding area and being constructed at a terminal end thereof as corresponding one of the plurality of transparent conductive solder pads located within the bonding area. A touch screen having the bezel structure, a display device having the touch screen, and a method for manufacturing the bezel structure of the touch screen are also disclosed by the invention. Transparent conductive material is formed as edge-routing wires so as to realize a bezel-free technology, providing an improved user experience.

Printed circuit board with mold adhesion boundary for die attach pad
12274006 · 2025-04-08 · ·

A printed circuit board for use in an electronics package has a die attach pad and one or more adhesion strips outside the die attach pad. The adhesion strip(s) facilitate adhesion of a mold compound over the die attach pad and die and inhibits (e.g., prevents) delamination of the mold compound from the die attach pad.