A circuit board is provided and the circuit board is used for being attached to a matching board. The circuit board includes a first circuit pattern and an attaching state inspection area, and the attaching state inspection area further includes a third circuit pattern. A liquid crystal display device is further provided, including the circuit board and the matching board, the matching board includes a second circuit pattern matching the circuit board. It is more accurate to judge the attaching state between the circuit board and the matching board by detecting the deformation state of the conductive particles in vacant areas at different locations after the circuit board is attached to the matching board.

A printed circuit board and a display device are provided. The printed circuit board includes a plurality of insulation layers; at least one metal layer between the plurality of insulation layers; and a fixing member fixed to a surface of one of the at least one metal layer and passing through an outermost one of insulation layers to protrude to the outside.

Disclosed is an electronic device. An electronic device according to an embodiment may include: a housing including a first plate oriented in a first direction, a second plate oriented in a second direction opposite the first direction, and a side face surrounding a space between the first plate and the second plate; a first PCB disposed in the space and including a first face oriented in the first direction, a second face oriented in the second direction, and a first electrical connector disposed on the first face; a second PCB disposed in the space closer to the second plate than the first PCB, and including a second electrical connector; a third electrical connector detachably coupled to the first electrical connector; a fourth electrical connector detachably coupled to the second electrical connector; an FPCB electrically connected between the third connector and the fourth electrical connector, and including a first portion facing the second face; and a flexible conductive member comprising a conductor disposed between the second face and the first portion.

An electronic device is provided. The electronic device includes a housing, a first printed circuit board seated inside the housing, and a second printed circuit board seated inside the housing such that a height of the second printed circuit board from the second surface is different from that of the first printed circuit board, wherein the first printed circuit board includes a mounting part on which at least one component is mounted, a first connector which extends from a first part of the mounting part. A portion of the first connector being substantially perpendicular to the mounting part and configured to be connected to the second printed circuit board, and a second connector which extends from a second part of the mounting part and configured to be connected to the second printed circuit board.

A flexible connector includes a unitary connector block having first and second board-facing areas. The first and second board-facing areas are longitudinally spaced from each other on a chosen surface of the connector block. The connector block includes a block body transversely separating the chosen surface from an opposing surface oppositely facing from the chosen surface. The connector block includes a flexible connector bridge longitudinally interposed between the first and second board-facing areas. A first connector port is located within the first board-facing area. A second connector port is located within the second board-facing area. A connector trace extends through at least a portion of the block body between the first and second board-facing areas. The connector trace electrically connects the first and second connector ports. Methods of making and using the flexible connector are also included.

A video transcoding card includes a first transcoding assembly and a second transcoding assembly. The first transcoding assembly includes a first circuit board, first transcoding boards, and a first main electrical connector. The first transcoding boards and the first main electrical connector are disposed on the first circuit board and are electrically connected to the first circuit board. The second transcoding assembly includes a second circuit board, second transcoding boards and a second main electrical connector. The second transcoding boards and the second main electrical connector are disposed on the second circuit board and are electrically connected to the second circuit board. The first main electrical connector and the second main electrical connector are connected to each other, and the second transcoding boards are electrically connected to the first circuit board via the second circuit board, the second main electrical connector, and the first main electrical connector.

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be perpendicular to principal surfaces of the individual substrates, and that can provide ceramic substrates with high form accuracy; an individual ceramic substrate obtained from the mother ceramic substrate; a module component including the ceramic substrate; and a method of manufacturing a mother ceramic substrate. In a mother ceramic substrate that can be divided at a predetermined position and separated into a plurality of individual substrates, a dividing groove that defines a division position is formed in a principal surface on one side, and a protruding thread is formed on a principal surface on another side at a position corresponding to a position of the dividing groove formed in the principal surface on the one side in view in a thickness direction of the mother ceramic substrate.

A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile.

A circuit board module includes a first circuit board, a second circuit board and a connection layer. The first circuit board includes two first conductive layers, a first dielectric core layer and a first conductive via, the first dielectric core layer is formed between the two first conductive layers, and the first conductive via connects the two first conductive layers. The second circuit board includes two second conductive layers, a second dielectric core layer and a second conductive via, the second dielectric core layer is formed between the two second conductive layers, and the second conductive via connect the two second conductive layers. The connection layer is formed between the first circuit board and the second circuit board and combines the first circuit board with the second circuit board. The second circuit board is disposed on a side of the first circuit board.