H05K2201/05

DISPLAY PANEL AND DISPLAY DEVICE

The present application discloses a display panel and a display device. The display panel includes a display panel main body, a flexible wiring board, and a printed circuit board. The display panel main body includes a plurality of wires, and the display panel main body is connected to an end of the flexible wiring board. The printed circuit board is connected to another end of the flexible wiring board. The printed circuit board includes a driver chip, and the driver chip is electrically connected to the wires.

TEMPERATURE MEASURING DEVICE

The present disclosure relates to a temperature measuring device for measuring a temperature of a pin-shaped electrical contact element, which includes a flexible circuit board with a first thermally conducting and electrically insulating substrate layer. The first substrate layer includes a contact surface that is configured to lie flat against a flange of the pin-shaped electrical contact element and an opening disposed in the contact surface. The pin-shaped electrical contact element is disposed at least partially in the opening. The flexible circuit board further includes a second thermally and electrically conducting layer that is disposed on a sensor surface opposite the contact surface of the first substrate layer and includes a sensor element connected to the sensor surface. The sensor element is configured to record a temperature of the pin-shaped electrical contact element when the pin-shaped electrical contact element is at least partially disposed in the opening.

Conductive trace interconnection tape

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

FLEXIBLE PRINTED CIRCUIT CABLE ASSEMBLY WITH ELECTROMAGNETIC SHIELDING

An FPC cable assembly is provided that includes a first ground layer, a second ground layer, and at least one signal line sandwiched by the first and second ground layers. The FPC cable assembly further includes an electromagnetic shielding structure including a first magnetic layer at least partially covering and electrically grounded to the first ground layer, a second magnetic layer at least partially covering and electrically grounded to the second ground layer, and a plurality of magnetic rings magnetically engaged with and electrically contacting the first magnetic layer and the second magnetic layer so as to surround the first and second ground layers, the at least one signal line, and the first and second magnetic layers, thereby providing electromagnetic shielding of the at least one signals line.

CONDUCTIVE TRACE INTERCONNECTION TAPE

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

Flexible circuit board including bending part with improved shielding properties and manufacturing method thereof

An antenna carrier includes a flexible circuit board, the flexible circuit board comprising: a first dielectric formed to include a width direction and a length direction; a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric; a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric; a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric; a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric; a first ground; and a second ground.

Display device

A display device is provided, including: a display panel; a backlight module; a circuit board, arranged on a side of the backlight module facing away from the display panel; a flexible circuit board, connected to the circuit board and the display panel, where the flexible circuit board includes a bending portion arranged on a side of the backlight module and extending from the display panel to the circuit board; a circuit board protective frame, arranged around the circuit board and the flexible circuit board, where an opening is provided on a first portion of the circuit board protective frame, and the first portion is a portion of the circuit board protective frame facing the bending portion; and a buffer structure, fixed on the circuit board protective frame, arranged parallel to the circuit board protective frame, and covering the opening.

Camera module
11412110 · 2022-08-09 · ·

A camera module includes a housing, a lens, an assembly, a terminal, and an electronic component. The housing includes a front surface part, a rear surface part on the opposite side to that, and a side surface part connecting the front surface part and the rear surface part. The lens is exposed from the front surface part. The assembly includes an image sensor and is located on the rear surface part side relative to the lens. The terminal is located at the rear surface part for connection with an outside part. A flexible board includes a part extending from the assembly toward the terminal. The electronic component is mounted on the flexible board.

Fixing jig

A fixing jig is provided, including a supporting base, a fixing plate, and a fixing component. The supporting base includes a first upper surface. The fixing plate is disposed on the supporting base. A side of the fixing plate is pivotally connected to the supporting base and includes a second upper surface, a bottom surface, and via a hole. The fixing component presses the fixing plate on the second upper surface. The fixing jig can fix an object pending testing and allows one flexible electric circuit board of the object pending testing to be exposed outside of the fixing jig, so that when performing a pull force test, this can allow an angle between two flexible electric circuit boards to be 90 degrees, thereby improving accuracy of an experimental result.

CONNECTOR FOR PRINTED CIRCUIT BOARD (PCB) MEMORY DRIVE
20220271456 · 2022-08-25 ·

A data storage device including a first printed circuit board (PCB) and a second PCB. The first PCB includes a controller, an interface configured to interface with a host device, and a first connector. The second PCB includes a non-volatile memory and a second connector. The second connector is configured to couple to the first connector to establish a communication connection between the controller and the non-volatile memory.