A printed circuit board includes a substrate with first through-portion; a magnetic layer disposed in at least a portion of the first through-portion and having a second through-portion; an electronic component having at least a portion disposed in the second through-portion; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first through-via having at least a portion surrounded by the magnetic layer, and including a first via pattern connecting the first and second wiring patterns to each other.

An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (VLSI) circuits.

A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.

A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

A circuit board includes two first circuit substrates, two second circuit substrates, a magnetic assembly, a first component, and a second component. The first circuit substrate includes a first coil. Two second circuit substrates are disposed between the two first circuit substrates and electrically connects the two first circuit substrates. The second circuit substrate includes a second coil. Two grooves are defined on second circuit substrate. The magnetic assembly is disposed between the two first circuit substrates and between the two second circuit substrates. The magnetic assembly includes a magnetic member. The first circuit substrate can be bent by an interaction of a magnetic field generated by the magnetic assembly and a magnetic field generated by the first coil or the second coil. The present disclosure further provides method for manufacturing the circuit board and a terminal device.

An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

A power converter comprises a stack of circuit layers, a magnetic core, an area of the stack of circuit layers, and power converter circuit components mounted on the stack of circuit layers. The stack of circuit layers has a hole which extends through each of the circuit layers. A portion of the circuit layers form an energy transfer element that comprises an input winding and an output winding. Each winding includes at least one winding layer having a planar winding and connections for electrical connectivity. The magnetic core is positioned within the hole substantially perpendicular to the stack. The area of the stack of circuit layers encompasses the windings and connections for electrical connectivity of the input and output windings. The power converter circuit components are mounted within the area of the stack and external to the magnetic core.

A printed circuit board includes a magnetic structure including a magnetic layer having a through-hole, an insulating film disposed on a wall surface of the through-hole, the insulating film including an inorganic insulating material, and a conductor layer disposed on the insulating film, the conductor layer filling at least a portion of the through-hole, the conductor layer including a metal, an insulating layer covering at least a portion of the magnetic structure, a wiring layer disposed on or in the insulating layer, and a via layer disposed in the insulating layer, the via layer including a first connection via connecting the conductor layer to the wiring layer.

A conductive substrate with a filtering function is manufactured by a process including preparing a core layer and forming first and second conductive holes in the core layer, forming a sacrificial copper layer on the first conductive hole and on the core layer, forming a metal layer on the second conductive hole, forming a metal post in the first conductive hole, forming a lower insulating layer on the core layer, forming a lower insulative post in the second conductive hole, forming a magnet wrapping around the metal post to obtain a first conductive post, forming an upper insulating layer on the core layer, forming an upper insulative post in the second conductive hole to obtain a second conductive post, removing the upper insulating layer, the lower insulating layer, and the remaining sacrificial copper post layer, followed by flattening.

A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.