The present disclosure relates to a printed circuit board including: a magnetic layer; a plurality of through-vias respectively penetrating through the magnetic layer; a plurality of first pads disposed on upper surfaces of the plurality of through-vias, respectively; a plurality of second pads disposed on lower surfaces of the plurality of through-vias, respectively; a first insulating layer covering at least portions of the plurality of first pads; a second insulating layer covering at least portions of the plurality of second pads. At least a portion of a side surface of the magnetic layer is substantially coplanar with at least a portion of one or more of a side surface of the first insulating layer and a side surface of the second insulating layer.

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

A connection structure includes: a first connection part provided on a surface of a first member, the first member including at least one conductor pattern; and a second connection part provided on a surface of a second member, the second member having at least one conductive pad formed on a surface thereof and configured to be coupled to a surface of the first connection part by a magnetic force so that at least one conductor pattern and at least one conductive pad are electrically connected to each other.

A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.

An inductive device with flux paths through a substrate may be made by depositing a malleable magnetically permeable material into a hole in the substrate and curing the malleable magnetically permeable material to form a substantially solid magnetic plug. Deposition of the malleable magnetically permeable material may comprise stencil-printing followed by use of a flexible runner. A uniform extension of the plug above an outer surface of the substrate may be provided by a spacer on the outer surface. The spacer may, e.g., be a conductive layer and/or a non-conductive material on the surface. Magnetic plates spanning two or more plugs may form a closed magnetic flux path. A plug may be surrounded by a winding on a layer of the substrate. Extension of the plug above an outer surface of the substrate may ensure the integrity of an essentially gap-free connection between the end of the magnetic plug and a mating surfaces of a magnetic plate. The plug may be reduced for co-planarity with the substrate surface, or to form a recess below the substrate surface, e.g. to form controlled gaps in the permeable medium.

A magnetic electronic component includes a circuit board, a functional part, at least one magnet and at least one conductive fixing member. The circuit board has a circuit pattern. The functional part is arranged on the circuit board and are electrically connected to the circuit pattern. The magnet is located at one side of the circuit board. The conductive fixing member is configured to electrically connect the circuit pattern of the circuit board and fix the magnet.

A system and method for integrating a magnetic component within a power converter includes a coil integrated on a PCB. The PCB includes multiple layers and traces on each layer to form a single coil or to form multiple coils on the magnetic component. The PCB further includes at least one opening in the PCB through which a core component may pass, such that the magnetic component is defined by the coils and the core material. To reduce eddy currents built up within the traces, the dimensions of traces on a layer are varied and the position of traces between layers of the PCB are varied. The widths and locations of individual traces are selected to reduce coupling of the trace to leakage fluxes within the magnetic component. A floating conductive layer may also be provided to still further reduce the magnitude of eddy currents induced within the coil.