An electronic device is provided. The electronic device includes an insulating layer, an organic layer, an adhesive layer, and a functional layer. The insulating layer has a through hole and a side surface adjacent to the through hole. The organic layer is disposed on the insulating layer. The adhesive layer is disposed on the organic layer. The functional layer is disposed on the adhesive layer. In a cross-sectional view of the electronic device, at the side surface of the insulating layer, a first thickness of the adhesive layer is greater than a first thickness of the organic layer.