An antenna module of the present disclosure includes a control substrate having a flat plate shape and configured to house or mount a semiconductor element; a frame substrate bonded to an upper surface of the control substrate via bonding members and exposing a center portion of the upper surface of the control substrate; and an antenna substrate having a flat plate shape, bonded to an upper surface of the frame substrate via the bonding members so as to face the control substrate, and provided with a plurality of antenna patterns disposed along a main surface of the antenna substrate. The frame substrate includes a frame main body and a crosspiece. Between the frame main body/the crosspiece and the control substrate as well as the antenna substrate, projecting portions that come into contact with the opposing control substrate, frame substrate, and antenna substrate are provided at a fixed height.

A method is provided for manufacturing an electrical connection assembly includes preparing a connector (CN) in which each terminal (20) has a conductor connection surface (27a) exposed from an insulating housing (30), bringing parts of conductors and the conductor connection surfaces (27a) corresponding thereto into contact and connecting both while tension is applied to a wiring material (10). The method further includes fixing the wiring material (10) to the insulating housing (30) by bringing the wiring material (10) and the insulating housing (30) into contact with each other at the fixing positions separated in the longitudinal direction of the wiring material (10) from the parts to be connected and solidifying the fixing portions (34) of the insulating housing (30) after melting the fixing portions at the fixing positions.

An electronic device is provided. The electronic device includes a first insulating layer, a second insulating layer, an adhesive layer, and a functional layer. The first insulating layer has a side surface and at least one recess adjacent to the side surface. The second insulating layer is disposed on the first insulating layer and filled in the at least one recess. The adhesive layer is disposed on the second insulating layer. The functional layer is disposed on the adhesive layer. In addition, in a cross-sectional view of the electronic device, the second insulating layer has a thickness at a first position, and a thickness of the adhesive layer corresponding to the first position is greater than the thickness of the second insulating layer.

A circuit board includes: a base body formed of ceramics or sapphire, the base body being provided with a through hole which penetrates therethrough from one principal face to another principal face of the base body; a through conductor containing silver as a major constituent, the through conductor being located inside the through hole of the base body; metallic wiring layers located on the respective principal faces of the base body and on the through conductor; and regions in which a compound containing at least one substance selected from Sn, Cu, and Ni is present between the through conductor and the metallic wiring layers.

A method may involve: forming a first bio-compatible layer; forming an etch stop over a portion of the first bio-compatible layer; forming a conductive pattern over the etch stop and the first bio-compatible layer, wherein the conductive pattern defines an antenna, sensor electrodes, electrical contacts, and one or more electrical interconnects; mounting an electronic component to the electrical contacts; forming a second bio-compatible layer over the electronic component, the antenna, the sensor electrodes, the electrical contacts, the one or more electrical interconnects, and the etch stop; and etching, using an etchant, a portion of the second bio-compatible layer to form an opening in the second bio-compatible layer and thereby expose the sensor electrodes, wherein the etch stop inhibits etching of the portion of the first bio-compatible layer by the etchant.

An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.

To provide a card capable of improving external appearance, and a card production method. A card (1) is provided with: a module substrate (30); a lower layer (10) and an upper layer (50) arranged above and below the module substrate (30), the layers having an outline larger than the outline of the module substrate (30); and thickness adjustment layers (11, 51) for adjusting the thickness in a substrate outward region (S1), the thickness adjustment layers being provided between the lower layer (10) and the upper layer (50) and to the substrate outward region (S1) further outward than the outline of the module substrate (30), and being provided by printing to at least one layer among the layers that form the card (1).

A liquid discharge head includes an element substrate to which an electric signal is supplied, an electrical wiring board that is connected to the element substrate and that is capable of supplying the electric signal to the element substrate, and a printed circuit board that includes a wiring line and an insulating layer covering the wiring line and that is capable of supplying the electric signal to the element substrate via the wiring line. A protruding structure that has a thickness approximately equal to a thickness of the wiring line and that is covered with the insulating layer is disposed along the wiring line on the printed circuit board, and a portion of the electrical wiring board is bonded to a portion of the insulating layer located on the wiring line disposed on the printed circuit board.

A photovoltaic module includes: a flexible printed circuit; and a plurality of power generating elements mounted on the flexible printed circuit, wherein the flexible printed circuit includes a turning portion, and strip-shaped portions of the flexible printed circuit which are located on opposite sides of the turning portion are aligned so as to oppose each other.

A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.