A manufacturing system for applying a material to a workpiece comprising a blade unit having a blade element for selectively moving along first and second axes for applying the material to the workpiece. A reciprocating motor is coupled to the blade unit for reciprocating the blade element along the first axis concurrent with movement of the blade element along the second axis, and a vibration detector is coupled to the blade unit for detecting the vibrational movement of the blade element. The vibration detector generates an output signal corresponding to the vibrational movement of the blade element. A control unit is coupled to the vibration detector for generating an output signal in response to the vibration detector signal, and a regulating device adjusts a parameter of the reciprocating motor in response to the output signal of the control unit.

A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask.

A positioning device is adapted for positioning a tool at a setpoint position on a flat substrate in an X-Y plane, the tool exerting a process force in its axial direction perpendicularly onto the substrate. The tool includes a multicomponent force sensor to measure unwanted process-force components in the lateral direction. The setpoint position of the tool is correctable by the positioning device such that the lateral process-force components are minimized.

According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate and a metal plate, the brazing material has an endothermic peak within a range of not less than 550 C. and not more than 700 C. in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550 C. and not more than 650 C. in the heating process.

A wave soldering device, a manufacturing method thereof and a printed circuit board are provided. The wave soldering device includes: a substrate including a front surface and a back surface opposite to each other; a target hole group including a pad through-hole, a plurality of pad through-holes are provided and distributed at intervals along a first direction, the plurality of pad through-holes penetrate through the front surface and the back surface of the substrate; a virtual hole group including a virtual hole, a plurality of virtual holes are provided, the plurality of virtual holes penetrate through the back surface of the substrate, the plurality of virtual holes are located on the same side of the plurality of pad through-holes in a one-to-one correspondence, a diameter of the virtual hole is less than a diameter of the pad through-hole.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

An insulated metal substrate (1) for a power semiconductor device is specified, comprising a metal base (2), a dielectric layer (3) arranged on the metal base (2), an electrically conductive layer (4) arranged on the dielectric layer (3), and a reinforcement structure (5), wherein the reinforcement structure (5) is arranged in a peripheral region of the insulated metal substrate (1) at least partially surrounding a central region of the insulated metal substrate (1). Furthermore, a method for producing an insulated metal substrate is specified.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.