A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

A method includes providing a printed circuit board (PCB) supporting a solderable component, and supporting a first fuse on the PCB, where the first fuse includes a first temperature-sensitive element that measurably changes in response to exposure to ambient thermal conditions exceeding a first threshold temperature. The PCB, the solderable component, and the first fuse define an apparatus. The method includes performing a PCB assembly manufacturing process, and then testing the first fuse to determine whether, during the PCB assembly manufacturing process, the first fuse was exposed to ambient thermal conditions exceeding a first threshold temperature. The first threshold temperature is a minimum temperature where the PCB assembly manufacturing process is to be carried out, a maximum temperature at which the PCB assembly manufacturing process is to occur, or a first intermediate temperature between the minimum and maximum temperatures.

An apparatus according to the invention may include one or more fuses placed on a printed circuit board on which an printed circuit board assembly is formed. Each fuse changes in response to ambient thermal conditions beyond a threshold temperature. The change can be detected with a testing apparatus such as in in-circuit tester after a process such as a solder assembly process to determine whether the process was performed within the desire temperature range. Fuses may be positioned at different locations on the printed circuit board to provide localized and differentiated temperature measurements. An array of fuses may be designed to change at a progressing sequence of ambient temperatures to enable trends in the process temperature to be recorded. Temperature data may be recorded and linked to an identifier on the apparatus such as a product serial number.

A bonded body includes a ceramic substrate and a copper plate, in which the copper plate is bonded to the ceramic substrate via a bonding layer, the copper plate includes a surface perpendicular to a direction in which the ceramic substrate and the copper plate are bonded, and a number percentage of copper crystal grains having major diameters greater than 400 m in three 5 mm5 mm regions included in the surface is not less than 0% and not more than 5%. The bonding temperature is favorably not more than 800 C. The number percentage of the copper crystal grains having major diameters greater than 400 m is favorably not more than 1%.

A soldering device comprising: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode; and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component.

An electronic device includes a bottom case, an accommodation unit, an electromagnetic induction module, a heat-dissipating component, an elastic clip, a printed wiring board, and an electronic component. The accommodation unit is disposed on the bottom case. At least one portion of the electromagnetic induction module is disposed in the accommodation unit. The heat-dissipating component is disposed on the bottom case and is separated from the accommodation unit. The elastic clip is partially mounted on the heat-dissipating component. The printed wiring board has a first surface and a second surface, and the first surface faces the accommodation unit. The electronic component includes a main body and pin feet. The pin feet are electrically connected to the printed wiring board, and the main body is clamped between the heat-dissipating component and the elastic clip.

A PCB adaptation for a solar lamp, characterized in that, at least one slot is set on the PCB, both sides of the slot comprises a pad, the pad connects to an inner circuit on the PCB, two leads of a leaded component is respectively soldered to the pad which is located on the both skies of the slot. By cutting a slot on the PCB in the present invention, auto surface-mount technology can be implemented to automatically solder the leaded component to the PCB. Low-cost leaded component and surface-mount technology are used in above technical solution, which can decrease the cost and increase the productivity and product quality.

A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and openings in the photoresist layer are filled with solder to form solder bumps. The barrier layer may be removed from within the openings prior to filling the openings with solder. The process is applicable to fine pitch architectures and chip size packaging substrates. The photoresist layer and portions of the barrier layer outside of the openings are removed following solder fill.

An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.