A bonded body includes a ceramic substrate and a copper plate, in which the copper plate is bonded to the ceramic substrate via a bonding layer, the copper plate includes a surface perpendicular to a direction in which the ceramic substrate and the copper plate are bonded, and a number percentage of copper crystal grains having major diameters greater than 400 μm in three 5 mm×5 mm regions included in the surface is not less than 0% and not more than 5%. The bonding temperature is favorably not more than 800° C. The number percentage of the copper crystal grains having major diameters greater than 400 μm is favorably not more than 1%.

According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate and a metal plate, the brazing material has an endothermic peak within a range of not less than 550° C. and not more than 700° C. in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550° C. and not more than 650° C. in the heating process.

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 μm or less.

Provided is a vehicle camera module including a lens, circuit board having an image sensor, front housing, and rear housing. The lens has a lens barrel and lens elements assembled. The front housing has front and rear sides to which the lens and the circuit board are assembled, respectively. The rear housing is coupled rearwardly of the front housing to seal the lens and circuit board. The front housing includes posts protruding rearward and a pin protruding distally of the post and having a smaller cross-sectional area than the post. The circuit board includes a plated through-hole configured to at least partially receive the pin. The front housing and circuit board are pre-assembled such that pin and plated through-hole have an assembly clearance, the io lens and image sensor are optically aligned in a pre-assembled state, and the assembly clearance is fixedly soldered through a laser solder-jet bonding process.

An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

A camera includes: (a) a lens mount; (b) an image sensor for sensing images; and (c) a holder for fixedly holding the image sensor unmoveable relative to the lens mount at an aligned position after being aligned by gripping the image sensor.

The same or different camera includes: (a) a printed circuit board supporting a first circuit component; (b) a second printed circuit board; (c) a PCB holder for holding the printed circuit boards spaced apart from each other and pivotable relative to each other; and (d) a housing for enclosing the printed circuit boards and the PCB holder, the PCB holder being dimensioned for fastening to the housing such that the printed circuit boards are not parallel to each other and the first circuit component is placed in thermal communication with the housing.

Methods of installing the image sensor and an image processing assembly are provided.

A PCB structure and a method and apparatus for forming the PCB structure are disclosed. The PCB structure further includes a metal plate configured between a first PCB and a second PCB by soldering. Therefore, the PCB structure is easy to be produced and the feasibility can be improved with a cheap solution.

An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

A camera includes: (a) a lens mount; (b) an image sensor for sensing images; and (c) a holder for fixedly holding the image sensor unmoveable relative to the lens mount at an aligned position after being aligned by gripping the image sensor.

The same or different camera includes: (a) a printed circuit board supporting a first circuit component; (b) a second printed circuit board; (c) a PCB holder for holding the printed circuit boards spaced apart from each other and pivotable relative to each other; and (d) a housing for enclosing the printed circuit boards and the PCB holder, the PCB holder being dimensioned for fastening to the housing such that the printed circuit boards are not parallel to each other and the first circuit component is placed in thermal communication with the housing.

Methods of installing the image sensor and an image processing assembly are provided.