This invention relates generally to uses of novel nanomaterial composition and the systems in which they are used, and more particularly to nanomaterial compositions generally comprising carbon and a metal, which composition can be exposed to pulsed emissions to react, activate, combine, or sinter the nanomaterial composition. The nanomaterial compositions can alternatively be utilized at ambient temperature or under other means to cause such reaction, activation, combination, or sintering to occur.

The present invention discloses a conductive line repairing method, which at least includes the following steps: a placing step, in which an object having at least one line breaking site is placed on a platform unit of a jet-coating module; a jetting step, in which the jet-coating module is operated to jet and coat a conductive material on the line breaking site; and a solidifying step, in which a solidifying module is operated to have the conductive material solidified, wherein the conductive material, after the solidification, makes the line breaking site conducting. In present invention, the conductive material is jetted and coated on the line breaking site of the object and then solidified to repair a circuit having the line breaking site and to resume the function of electrical conduction thereof to thereby reduce rejected products and restore production yield, achieving an effect of environmental protection.

A semiconductor package includes a wiring board and a semiconductor element mounted on the wiring board. The wiring board includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring. The metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

Methods for filling a recessed feature on a substrate employing metal sequential infiltration synthesis processes are disclosed. The disclosed methods include forming an organic layer within a recessed feature and introducing metal species into the organic layer to allow the formation of a metal seed layer. A bulk metal layer can subsequently be formed from the metal seed layer to fill the recessed feature.

Disclosed are a thin, stretchable and flexible printed circuit and a manufacturing method therefor. The manufacturing method comprise: attaching an adhesion-reducing carrier film to a first side of a flexible circuit board provided with a circuit layer and two protective films, wherein the adhesion-reducing carrier film has a large first preset adhesive force; and attaching a first elastomer composite film, and then performing an adhesion-reducing operation on the adhesion-reducing carrier film to allow the adhesion-reducing carrier film to have a small second preset adhesive force. The elastomer composite film is formed by two polymer films with different melting points. The invention can increase the product yield in mass production based on the adhesion-reducing carrier film and can wrap a serpentine circuit by means of the elasticity of a composite structure of the polymer films to realize thin and light design and miniaturization.

The present invention relates to an ink composition, a kit comprising components of the ink composition, a method of manufacturing a deformable conductor utilizing the ink composition, a deformable conductor obtainable by the method, an electronic device, in particular a wearable and/or stretchable electronic device, comprising the deformable conductor, a method of manufactuing a conductor, a conductor obtainable by the method and an electronic device comprising the conductor. The ink composition comprises a source of transition metal ions, a reducing agent and a polymer and/or a polymer precursor, the polymer precursor comprising a polymerizable terminal multiple bond. The method of manufacturing a deformable conductor comprises the steps of applying the ink composition on at least a part of a surface of a deformable substrate and thermally treating and/or irradiating the ink composition.