Methods of manufacturing heterojunction bipolar transistors are described herein. An exemplary method can include providing an emitter/base stack comprising a substrate, a base over the substrate, and/or an emitter over the base. The exemplary method further can include forming a collector. The exemplary method also can include wafer bonding the base to the collector. Other embodiments are also disclosed herein.

A method of manufacturing a display apparatus includes: forming a plurality of displays including a light-emitting diode on a surface of a first mother substrate; preparing a second mother substrate; forming a first sealed area on a surface of at least one of the first mother substrate or the second mother substrate, wherein the first sealed area surrounds each of the plurality of displays and includes a frit; firstly bonding the first mother substrate to the second mother substrate by melting the frit in the first sealed area by radiating a first laser beam; and secondly bonding the first mother substrate to the second mother substrate by forming a second sealed area in which the frit and the first mother substrate, and/or the frit and the second mother substrate, are melted and mixed with each other by radiating a second laser beam partially in the first sealed area.

A display device includes a display panel, a backlight under the display panel, and an adhesive placed so as to extend over a side face of the display panel and a side face of the backlight. An outer face of the adhesive opposite to a face of the adhesive bonded to the side face of the display panel and the side face of the backlight is formed as a flat face along one or both of the side face of the display panel and the side face of the backlight.

A display panel includes a display substrate, an opposite substrate, and a hydrophobic bonding portion disposed between the display substrate and the opposite substrate. The hydrophobic bonding portion is configured to bond the display substrate and the opposite substrate together, and an orthographic projection of the hydrophobic bonding portion on the display substrate is located outside a display region of the display substrate.

The present application relates to a surface protective film, a method for preparing a surface protective film, and a method for manufacturing an organic light emitting electronic device.

A laminate including an optical film, a touch sensor layer, and a pressure-sensitive adhesive layer, the laminate being excellent in flexibility and high in response speed, is provided. A flexible laminate is provided, the flexible laminate including an optical film and a touch sensor layer including a transparent electrode layer, the flexible laminate being provided with a pressure-sensitive adhesive layer on a surface of the touch sensor layer opposite to the optical film, the flexible laminate satisfying conditions of surface resistance of the transparent electrode layer being ≤90 Ω/□, relative permittivity of the pressure-sensitive adhesive layer at a frequency of 100 kHz being ≤4.5, and 5 μm≤a thickness of the pressure-sensitive adhesive layer≤90 μm.

A method of providing a display device includes preparing a display panel including a first area, a bending area extending from the first area, and a second area extending from the bending area, attaching an impact absorbing layer to the display panel, removing a first removal portion of a first release film which overlaps the second area, among portions of the first release film disposed on the impact absorbing layer, and providing a cover tape on a first portion of the impact absorbing layer from which the first removal portion is removed.

An organic electronic optoelectronic device comprises a substrate, a first electrode positioned over the substrate, a first organic buffer layer positioned over the first electrode, and a first inorganic emissive layer positioned over the first organic buffer layer. A method of fabricating an organic optoelectronic device is also disclosed.

The invention relates to: a light-emitting device which includes a first flexible substrate having a first electrode, a light-emitting layer over the first electrode, and a second electrode with a projecting portion over the light-emitting layer and a second flexible substrate having a semiconductor circuit and a third electrode electrically connected to the semiconductor circuit, in which the projecting portion of the second electrode and the third electrode are electrically connected to each other; a method for manufacturing the light-emitting device; and a cellular phone which includes a housing incorporating the light-emitting device and having a longitudinal direction and a lateral direction, in which the light-emitting device is disposed on a front side and in an upper portion in the longitudinal direction of the housing.

A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.