The present disclosure relates to a method that includes positioning a stack that includes at least one of the following layers between a first surface and a second surface: a first perovskite layer and/or a second perovskite layer; and treating the stack for a period of time by at least one of heating the stack or pressurizing the stack, where a device that includes the first surface and the second surface provides the heating and the pressurizing of the stack.

A display panel is provided and includes: a first substrate; an electrode arranged on the first substrate; an organic light-emitting layer arranged on a side of the electrode away from the first substrate; a photo-curable adhesive layer covering the organic light-emitting layer; a second substrate arranged on a side of the photo-curable adhesive layer away from the first substrate; and a light shielding structure located on a side of the second substrate facing the first substrate and located in an edge area which is located a side of the second substrate facing the electrode; wherein an orthographic projection of the light shielding structure on the first substrate does not overlap the orthographic projection of the organic light-emitting layer on the first substrate. A display device and a method for manufacturing a display panel are further provided.

The disclosure provides an organic light-emitting display screen and a manufacturing method thereof. The organic light-emitting display screen includes a filter substrate, and further includes a color filter layer, a cathode layer, an organic light-emitting layer and an anode array sequentially formed on the filter substrate. The anode array includes a number of anode units spaced apart from each other, the color filter layer includes a number of filter units, and each of the anode units corresponds to each of the filter units.

The present invention relates to a method for laminating solar cell modules comprising a plurality of solar cells electrically connected in series. The method comprises: providing a first and a second flexible substrate portion suitable for roll-to-roll deposition; providing a plurality of first electronic conductors on said first substrate portion and a plurality of second electrodes on said second substrate portion, wherein said plurality of first and second electrodes are provided as stripes spatially separated such that a plurality of gaps is formed; depositing an electronic conductor on one end of the first and second electrodes and depositing a continuous or discontinuous active layer on said plurality of first electrodes or said plurality of second electrodes, wherein said continuous or discontinuous active layer is an organic active layer; laminating by means of heat and pressure said first and said second substrate portions together in a roll-to-roll process such that the electronic conductors are brought into physical contact with the respective electronic conductor arranged on the opposite substrate, and that the active layer is brought into physical contact with the other one of said plurality first electrodes or said plurality of second electrodes and such that the active layer is brought into electrical contact with said plurality of first electrodes and said plurality of second electrodes. The plurality of first electrodes is arranged off-set relative said plurality of second electrodes such that each of said plurality of gaps between said plurality of second electrodes are partly or fully covered at least in one direction by respective one of said plurality of first electrodes. The present invention also relates to a solar cell module.

A display device for reducing a stress applied to a display panel in a folded state is provided. The display device includes a display panel and a panel support portion. The display panel includes a bendable area. The panel support portion is combined to the display panel and includes a multi-joint member supporting the bendable area. The multi-joint member includes joint portions that are sequentially arranged, and a sliding member passing through the joint portions and moving inside the panel support portion. The sliding member includes a plate portion for arranging the joint portions, and a hook-shaped portion connected to a side of the plate portion and arranging the joint portions in a circular arc shape.

A manufacturing method for an organic electronic device according to a mode includes a device substrate manufacturing step S01 of manufacturing a device substrate 12 in which a first electrode layer 18, a device function portion 20 including an organic layer, and a second electrode layer 22 are sequentially laminated in each of a plurality of device formation regions DA virtually set in a flexible support substrate 16 and having at least one corner, a bonding step S02 of bonding a sealing member 14 including a sealing base 24 and an adhesive layer 26 laminated on the sealing base to a side of the second electrode layer of the device substrate via the adhesive layer such that the sealing member is not disposed at corners c1 to c4 of the device formation region, and a dicing step S03 of dicing the device substrate, to which the sealing member is bonded, for each of the device formation regions to obtain an organic electronic device 10.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.

A display device includes: a resin layer on the circuit layer including a groove surrounding and separating a display area; light-emitting elements on an upper surface of the resin layer so as to emit light with luminances controlled by the currents; a sealing layer covering the light-emitting elements; a second substrate above the sealing layer; a sealing material provided between the sealing layer and the second substrate sc as to surround the display area and the groove; and a filling layer surrounded by the sealing material between the sealing layer and the second substrate. The groove is formed along a line describing a shape that is inscribed in a rectangle and not in contact with corners of the rectangle as viewed in a direction vertical to the upper surface of the resin layer.

A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.