A display device includes an optical filter substrate including: a substrate; a first color filter on the substrate; a second color filter on the substrate, the second color filter spaced apart from the first color filter; a first color conversion element on the first color filter, the first color conversion element converting incident light into light of a first color; a second color conversion element on the second color filter, the second color conversion element converting the incident light into light of a second color; and a black matrix located between the first color conversion element and the second color conversion element, and between the first color filter and the second color filter.

A display device comprises a display panel and a cover plate stacked with the display panel. An antistatic layer is provided on a side of the cover plate facing toward the display panel. The antistatic layer surrounds a display region (AA) of the display device, and the antistatic layer is grounded. The display device can achieve the antistatic protection function without reducing the light transmittance while meeting the requirement of the narrow bazel display device.

A display device includes a first substrate having a display area and a first peripheral area, a second substrate having a second peripheral area, a first filler between the first substrate and the second substrate, and a first adhesive outside the first filler. The first adhesive bonds the first peripheral area and the second peripheral area. The first substrate has a first bent portion in the first peripheral area. The second substrate has a second bent portion in the second peripheral area.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A method for fabricating at least a portion of a complementary circuit, such as a complementary inverter circuit, includes fabricating a first sheet and a second sheet. Each of the sheets includes metal layers, a dielectric layer, and a semiconductor channel layer, configured so as to form a plurality of transistors of a respective polarity (i.e., P-type for one sheet, N-type for the other). The method also includes placing a layer of conductive material, such as anisotropic conducting glue (ACG) or anisotropic conducting foil (ACF), on the first sheet, and bonding at least a portion of the second sheet to the first sheet such that the conductive material is disposed between and in contact with the top-most metal layers of the first and second sheets. Separately fabricating the two sheets of different polarity may improve yields and/or decrease costs as compared to fabricating both polarities on a single substrate.

To improve the yield in a peeling process and improve the yield in a manufacturing process of a flexible light-emitting device or the like, a peeling method includes a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled including a first layer in contact with the peeling layer over the peeling layer, a third step of curing a bonding layer in an overlapping manner with the peeling layer and the layer to be peeled, a fourth step of removing part of the first layer overlapping with the peeled layer and the bonding layer to form a peeling starting point, and a fifth step of separating the peeling layer and the layer to be peeled. The peeling starting point is preferably formed by laser light irradiation.

A flexible wireless communication device with high position accuracy and low cost by a simple process is described, including a wireless communication device and a method for manufacturing a wireless communication device formed by bonding a first film substrate on which at least a circuit is formed and a second film substrate on which an antenna is formed, in which the circuit includes a transistor, and the transistor is formed by a step of forming a conductive pattern on the first film substrate, a step of forming an insulating layer on the film substrate on which the conductive pattern is formed, and a step of applying a solution including an organic semiconductor and/or a carbon material on the insulating layer and drying the solution to form a semiconductor layer.

Transfer films, articles made therewith, and methods of making and using transfer films to form bridged nanostructures are disclosed.

Simple and high-precision processing, and narrowing of the frame are to be facilitated at the time of preparing display panels by multiple formation. After bonding a first substrate layer in which a plurality of element substrates is formed on a support plate and a second substrate layer in which a plurality of counter substrates is formed on a support plate, these substrate layers are divided into a plurality of display panels. Ridge-like ribs of a covalently or ionically bonding inorganic material are formed along edges of the element substrate and the counter substrate. The dividing includes scribing the support plates along the ribs, and flexing and breaking the support plates.

A display device includes a display area, a test pad, a plurality of first test transistors, and at least one outline. The display area includes pixels coupled to data lines and scan lines. The test pad receives a test signal. The first test transistors are coupled between the data lines of the display area and the test pad. The at least one outline is coupled between one of the first test transistors and the test pad. The at least one outline is located in a non-display area outside the display area.