Disclosed is an organic light emitting diode (OLED) display comprising a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer formed on the substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate.

The present disclosure provides an article including a layer having a nanostructured first surface including nanofeatures and an opposing second surface, and an inorganic layer including a major surface bonded to a portion of the nanostructured first surface. The nanostructured first surface includes protruding features that are formed of a single composition and/or recessed features. The article includes at least one enclosed void defined in part by the nanostructured first surface. The present disclosure also provides a method of making the article including treating a major surface of an inorganic layer with a coupling agent, contacting a nanostructured surface of a layer with the treated inorganic layer, and securing the two layers together via a bonded coupling agent by bonding at least one of the nanostructured surface or the treated inorganic layer. In addition, the present disclosure provides an optical element including the article. The nanostructured surface of the article is protected from damage and contamination by the inorganic layer.

The present application discloses an organic light emitting diode display panel having a plurality of subpixels. The organic light emitting diode display panel includes an array substrate; and a counter substrate facing the array substrate. The counter substrate includes a plurality of organic light emitting diodes. The array substrate includes a first base substrate and a plurality of thin film transistors on the first base substrate for driving light emission of the plurality of organic light emitting diodes in the counter substrate.

Methods of manufacturing a heterojunction bipolar transistor are described herein. An exemplary method can include providing a base/emitter stack, the base/emitter stack comprising a substrate, an etch stop layer over the substrate, an emitter contact layer over the etch stop layer, an emitter over the emitter contact layer, and/or a base over the emitter. The exemplary method further can include forming a collector. The exemplary method also can include wafer bonding the base to the collector. Other embodiments are also disclosed herein.

A display device includes a display area, a test pad, a plurality of first test transistors, and at least one outline. The display area includes pixels coupled to data lines and scan lines. The test pad receives a test signal. The first test transistors are coupled between the data lines of the display area and the test pad. The at least one outline is coupled between one of the first test transistors and the test pad. The at least one outline is located in a non-display area outside the display area.

An organic light emitting diode display panel is provided, including a first substrate, a second substrate opposite to the first substrate, at least one first light emitting layer on a side of the first substrate facing the second substrate, at least one second light emitting layer on the side of the first substrate facing the second substrate, the at least one second light emitting layer being separated from the at least one first light emitting layer, and at least two third light emitting layers on a side of the second substrate facing the first substrate. The at least one first light emitting layer and the at least one second light emitting layer are aligned with corresponding ones of the at least two third light emitting layers.

A photosensitive device including a microlens substrate, a photosensitive element substrate, and an optical glue is provided. The microlens substrate includes a first substrate and microlenses. The first substrate has a first side and a second side opposite to the first side. The microlenses are located on the first side of the first substrate. The photosensitive element substrate includes a second substrate, active components, first electrodes, a second electrode, and an organic photosensitive material layer. The second substrate has a third side and a fourth side opposite to the third side. The second side of the first substrate faces the third side of the second substrate. The active components are located on the fourth side of the second substrate. The first electrodes are respectively electrically connected to the active components. The organic photosensitive material layer is located between the first electrodes and the second electrode.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

An apparatus for manufacturing a display device includes: a stage where a display panel is arranged; a vision unit configured to capture images of an alignment mark of the display panel and an alignment mark of a film member; a fixing unit configured to transfer the film member and change a location of the film member based on the images captured by the vision unit such that an end of the film member is arranged on a pad portion of the display panel; and a loading unit connected to the fixing unit and configured to press the film member by selectively contacting the end of the film member.