A method for manufacturing a semiconductor device having an organic semiconductor material is provided. The method includes performing a large-area solution shearing step to form a monolayer (1L) or bi-layer (2L) C.sub.10-DNTT crystals with low shearing speed and forming Au electrodes by thermal evaporation on a wafer. The large-area solution shearing step is performed at a temperature in a range between about 60° C. and about 65° C. and with a shearing speed in a range between about 2 μm/sand about 3 μm/s. The 1L or 2L crystals have single-crystalline domains extending over several millimeters. An organic field-effect transistor (OFET) comprising an active layer that comprises a monolayer (1L) or bi-layer (2L) C.sub.10-DNTT crystals formed according to the method is also provided.

An opto-electronic device includes: a first electrode; an organic layer disposed over the first electrode; a nucleation promoting coating disposed over the organic layer; a nucleation inhibiting coating covering a first region of the opto-electronic device; and a conductive coating covering a second region of the opto-electronic device.

A display device includes a bank including an opening exposing a surface of a base. The bank further includes side surfaces adjacent to an upper surface. The side surfaces slope downward from the upper surface toward an opening in an organic film pattern. A plurality of fine holes is formed on the upper surface and the side surfaces, the bank may also include a plurality of inner holes.

A manufacturing method of OLED microcavity structure is provided. The manufacturing method includes: forming a reflective anode on a substrate; forming a transparent conductive film layer having a thickness corresponding to a required pixel on the reflective anode; patterning the transparent conductive film layer and the reflective anode with a pixel mask corresponding to the required pixel to form a pattern of the required pixel; and repeating the above steps on a resultant structure surface according to display requirements until a pixel display structure required by a display device is obtained.

The present application discloses an organic light emitting diode array substrate having a subpixel region and an inter-subpixel region. The organic light emitting diode array substrate in the inter-subpixel region includes a first base substrate; a pixel definition layer on the first base substrate for defining a plurality of subpixels; a spacer layer on a side of the pixel definition layer distal to the first base substrate; an auxiliary electrode layer on a side of the spacer layer distal to the pixel definition layer; and a second electrode layer on a side of the auxiliary electrode layer distal to the spacer layer and is electrically connected to the auxiliary electrode layer.

A display substrate having a transparent electrode and manufacturing method thereof includes a transparent substrate, and a patterned channel is disposed on the transparent substrate; a transparent electrode including a composite material of MXene material and polyvinylpyrrolidone, and the transparent electrode is filled in the patterned channel. The transparent electrode of embodiments of the present disclosure has advantages of high transmittance, high conductivity, great machinability, great substrate affinity, great ductility, etc.

A photoelectric conversion device in an embodiment includes a first photoelectric conversion part including a first transparent electrode, a first photoelectric conversion layer, and a first counter electrode and a second photoelectric conversion part including a second transparent electrode, a second photoelectric conversion layer, and a second counter electrode, the first photoelectric conversion part and the second photoelectric conversion part being provided on a transparent substrate. The first counter electrode and the second transparent electrode are electrically connected by a connection part. As for the first photoelectric conversion layer and the second photoelectric conversion layer, adjacent portions of the adjacent first and second photoelectric conversion layers are electrically separated by an inactive region having electrical resistance higher than that of the first and second photoelectric conversion layers.

The present invention relates to a dye-sensitized solar cell (DSC) comprising a porous isolating substrate (30) having a first surface and a second surface, a first porous layer (14) comprising conducting particles printed on the first surface of the porous isolating substrate to form a conductive porous layer, a second porous layer (16) comprising conducting particles printed on the second surface of the porous isolating substrate to form a conductive porous layer, whereby the porous isolating substrate is disposed between the first and second porous layers, a third porous layer (18) comprising light absorbing dye molecules deposited on the first porous layer, and a charge transfer medium for transferring charges between the third and first porous layers. Each of the porous layers comprise a printed pattern including at least one non-transparent portion (24, 25, 26) and at least one transparent portion (20, 21, 22) and the porous isolating substrate comprises at least one transparent portion (32), whereby said transparent portions of the porous layers and said transparent portion of the porous isolating substrate are positioned relative to each other so they form at least one continuous transparent pathway through the solar cell.

A method of fabricating microstructures of polar elastomers includes coating a substrate with a dielectric material including a polar elastomer, coating the dielectric material with a photoresist, exposing the photoresist to ultraviolet (UV) light through a photomask to define a pattern on the photoresist, developing the photoresist to form the pattern on the photoresist, etching the dielectric material to transfer the pattern from the photoresist to the dielectric material, and removing the photoresist from the patterned dielectric material.

A device includes: (1) a substrate; (2) a patterning coating covering at least a portion of the substrate, the patterning coating including a first region and a second region; and (3) a conductive coating covering the second region of the patterning coating, wherein the first region has a first initial sticking probability for a material of the conductive coating, the second region has a second initial sticking probability for the material of the conductive coating, and the second initial sticking probability is different from the first initial sticking probability.