A display panel, a display device, and a method for manufacturing the display panel are provided. The display panel includes two electrode layers and a luminous functional layer stacked between the two electrode layers. Each electrode layer has a first surface and a second surface opposite to each other in a thickness direction thereof. The first surface of each electrode layer is attached to and in contact with the luminous functional layer. Each electrode layer includes at least one insulation section and at least one electrode section integrated as a single body. A material of the electrode section is a conductively modified form of a material of the insulation section. The electrode section is in contact with the luminous functional layer and is in a conductive state at least at the first surface. The electrode layer in the present disclosure has no conductive pattern and will not cause optical disturbance.

An opto-electronic device includes: (1) a substrate including a first region and a second region; and (2) a conductive coating covering the second region of the substrate. The first region of the substrate is exposed from the conductive coating, and an edge the conductive coating adjacent to the first region of the substrate has a contact angle that is greater than about 20 degrees.

A display panel has a display area including a light-transmissive area. The display panel includes a substrate, and a plurality of shielding patterns, a plurality of light-emitting layers and a plurality of cathodes that are disposed in the light-transmissive area and on the substrate. Orthogonal projections of the plurality of shielding patterns on the substrate are separated from each other. Each light-emitting layer and a respective cathode constitute a portion of a light-emitting device. The light-emitting device has an active light-emitting area. An orthogonal projection of the active light-emitting area on the substrate is located within an orthogonal projection of a cathode of the light-emitting device on the substrate. The plurality of cathode is located at a side of a respective shielding patterns away from the substrate. An orthogonal projection of the shielding pattern on the substrate covers the orthogonal projection of the cathode on the substrate.

A manufacturing method of a display device includes: stacking a release layer over a first substrate; forming a conductor pattern over the release layer; forming a sacrificial layer over the conductor pattern; forming a second substrate including a polymer layer over the sacrificial layer; forming an electronic element including a conductor over the second substrate; forming a pattern corresponding to the conductor pattern in the sacrificial layer; transferring the conductor pattern from the release layer to a surface of the second substrate; and removing the first substrate, the release layer, and the sacrificial layer.

Provided are a display apparatus and a method of manufacturing the same. The display apparatus includes a substrate, a first conductive layer disposed on the substrate, and a first insulating pattern disposed on the first conductive layer. The first insulating pattern includes a fluorine compound and a nitrogen compound. The nitrogen compound is represented by Formula 1:
NR.sub.1R.sub.2R.sub.3OH  <Formula 1> wherein in Formula 1, R.sub.1 to R.sub.3 are each independently selected from hydrogen, a substituted or unsubstituted C.sub.1-C.sub.20 alkyl group, a substituted or unsubstituted C.sub.6-C.sub.30 aryl group, and a substituted or unsubstituted C.sub.7-C.sub.30 aralkyl group.

An organic light-emitting diode (OLED) device includes a substrate, a well structure on the substrate with the well structure having a recess with side walls and a floor, a lower metal layer covering the floor and side-walls of the well, an upper conductive layer on the lower metal layer covering the floor of the well and contacting the lower metal layer, the upper conductive layer having outer edges at about an intersection of the side walls and the floor, a dielectric layer formed of an oxide of the lower metal layer covering the side walls of the well without covering the upper conductive layer, a stack of OLED layers covering at least the floor of the well, the upper conductive layer providing an electrode for the stack of OLED layers, and a light extraction layer (LEL) in the well over the stack of OLED layers and the dielectric layer.

Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The sub-pixel circuit includes a plurality of contact overhangs. The plurality of contact overhangs are disposed between adjacent sub-pixels of a sub-pixel circuit to be formed. The contact overhangs are formed over a metal grid exposed through a PDL structure. A cathode is deposited via evaporation deposition to be in contact with the contact overhang. The metal grid is perpendicular to a plurality of metal layers disposed on the substrate.

Disclosed are a solar cell cutting and passivation integrated processing method and a solar cell prepared using the method. The solar cell includes a substrate (1), a front electrode layer (2), a light absorption layer (3) and a back electrode layer (4) from bottom to top. Before laser structured cutting is performed for the back electrode layer (4), a protective layer (5) is disposed on a surface of the back electrode layer (4), and then laser structured cutting is performed for the back electrode layer (4), or the back electrode layer (4) and the light absorption layer (3) simultaneously through the protective layer (5) to obtain a corresponding structured trench (P3) while the protective layer (5) is kept from being cut by laser, and a material of the protective layer (5) is partially molten due to a localized high temperature generated by the laser processing in a laser structured cutting process and infiltrates into an underlying corresponding structured trench (P3). In this method, at the time of performing laser cutting processing, passivation is performed for newly-processed trench at the same time, reducing production costs, saving processing time. Further, the trench edges after cutting are repaired to improve the morphology of the processed trench, improving the stability of the cell and extending the service life of the cell.

One aspect of the present invention provides a light-transmitting electroconductive film 10 comprising a light-transmitting base material 11 and an electroconductive part 13 provided on one surface of the light-transmitting base material 11, wherein the electroconductive part 13 includes a light-transmitting resin 15 and plural electroconductive fibers 16 incorporated in the light-transmitting resin 15, and the electroconductive part 13 can conduct electricity from the surface 13A of the electroconductive part 13, and the electroconductive fibers 16 as a whole are unevenly distributed on the light-transmitting base material side than the position HL, which is located at half the film thickness of the electroconductive part 13 in the electroconductive part 13, and the electroconductive part 13 has a surface resistance value of 200 Ω/□ or less, and the electroconductive film 10 has a haze value of 5% or less.

A method for manufacturing a display device includes a pixel circuit formed on a substrate, wherein a manufacturing process of the pixel circuit includes a patterning step of a metal film performed in the following procedures (a) to (e): (a) forming the metal film on the substrate; (b) forming a first resist pattern on the metal film by a photolithographic method; (c) etching the metal film with the first resist pattern to form a first metal pattern; (d) forming by the photolithographic method on the metal film formed in the first metal pattern, a second resist pattern including a pattern shape smaller than a pattern shape of the first resist pattern; and (e) etching the metal film with the second resist pattern to form a second metal pattern.