A method for producing an organic light-emitting component is disclosed with providing a carrier, forming a first electrode over the carrier, forming an organic functional layer structure over the first electrode, and forming a second electrode over the functional layer structure. The first and second electrodes and the functional layer structure overlap in an optically active region which extends in the lateral direction and is embodied to generate light. In an optically inactive region extending over the carrier in the lateral direction, an electrically conductive contact layer is formed over the carrier, so that it is in direct physical and electrical contact with the first electrode and/or the second electrode. A first contact section and at least one second contact section of the layer are separated from one another by a lithographic process, so that they are electrically insulated from one another. The layer is structured by a laser beam.

The present disclosure provides a manufacturing method of a display substrate, a display substrate and a display device, belongs to the field of display technology, and can at least partially solve a problem of residual sand in the display substrate. The manufacturing method of the display substrate includes: providing a base; forming a passivation layer on a surface of the base; forming an amorphous oxide conductive material layer on a surface of the passivation layer facing away from the base; forming a photoresist pattern on the oxide conductive material layer, the photoresist pattern having an exposure region; etching a portion of the oxide conductive material layer in the exposure region of the photoresist pattern to form a hollow position exposing a portion of the passivation layer; and removing a certain thickness material of the portion of the passivation layer exposed through the hollow position.

An organic light emitting display device may include a substrate, a first pixel electrode on the substrate, a pixel defining layer on the substrate, the pixel defining layer having an opening exposing a portion of the first pixel electrode, a second pixel electrode on the portion of the first pixel electrode exposed by the opening, a hole injection layer on the second pixel electrode, the hole injection layer including a metal oxide, an organic light emitting layer on the hole injection layer; and a common electrode on the organic light emitting layer.

A display apparatus including a substrate, a display portion disposed on an active area defined at the substrate, a buffer layer disposed on the active area and a pad area defined at the substrate, a touch sensing portion disposed on the buffer layer, and a pad portion disposed between the pad area and the buffer layer. The touch sensing portion includes a first pad pattern, a middle layer disposed on the first pad pattern, and a second pad pattern disposed on the middle layer. The first pad pattern is connected to the pad portion through a first contact hole defined on the pad portion in the buffer layer. The second pad pattern is connected to the first pad pattern through a second contact hole defined on the first contact hole in the middle layer.

The disclosure provides a method of manufacturing an organic electronic device, including providing a layered device structure, the layered device structure including a plurality of electrodes and an electronically active region, said providing of the layered device structure including steps of providing an organic semiconducting layer, applying a structuring layer to the organic semiconducting layer, the structuring layer having a first region and a second region, the first region being covered by a layer material, applying a contact improving layer to the structuring layer by depositing at least one of an organic dopant material and an organic dopant-matrix material at least in the first region, depositing a layer material on the contact improving layer at least in the first region, and removing the structuring layer at least in the second region. Furthermore, an organic electronic device is provided.

The fabrication and characterization of large scale inverted organic solar array fabricated using all-spray process is disclosed. Solar illumination has been demonstrated to improve transparent solar photovoltaic devices. The technology using SAM has potential to revolute current silicon-based photovoltaic technology by providing a complete solution processable manufacturing process. The semi-transparent property of the solar module allows for applications on windows and windshields. The inventive modules are more efficient than silicon solar cells in artificial light environments. This significantly expands their use in indoor applications. Additionally, these modules can be integrated into soft fabric substances such as tents, military back-packs or combat uniforms, providing a highly portable renewable power supply for deployed military forces.

Provided in the present disclosure are a display substrate, a fabrication method therefor, and a display apparatus. The method comprises: forming a pixel defining layer on the surface of one side of a substrate, said layer defining an opening; forming a light-emitting layer in the opening; forming a sacrificial layer and a photoresist layer on the surface of the light-emitting layer away from the substrate, the orthographic projection of the sacrificial layer on the substrate at least partially overlapping the orthographic projection of the opening on the substrate, and the photoresist layer being located on the surface of the sacrificial layer away from the substrate; forming a first metal layer on the surfaces of the pixel defining layer and the photoresist layer away from the substrate; removing the sacrificial layer, the photoresist layer, and the first metal layer located on the surface of the photoresist layer away from the substrate, and exposing the opening; and forming a second metal layer in the opening and on the surface of the first metal layer away from the substrate. A cathode of the display substrate fabricated by using the described method is thinner in the opening and thicker on the surface of the pixel defining layer. The light-emitting efficiency is high, and the voltage drop is relatively low. The display effect is good, and costs are low.

A display panel includes: a substrate including an opening area, a display area, and a non-display area, the display area surrounding the opening area, and the non-display area being between the opening area and the display area; a plurality of display elements at the display area of the substrate, each of the display elements including a pixel electrode, an emission layer on the pixel electrode, and an opposite electrode on the emission layer; a thin-film encapsulation layer covering the plurality of display elements; a dam at the non-display area, and protruding from a top surface of a first insulating layer; and a recess between the opening area and the dam, and recessed in a depth direction of the first insulating layer. A lateral wall of the dam meets a first lateral wall from among lateral walls of the recess, the first lateral wall being adjacent to the display area.

Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The sub-pixel circuit includes a plurality of contact overhangs. The plurality of contact overhangs are disposed between adjacent sub-pixels of a sub-pixel circuit to be formed. The contact overhangs are formed over a metal grid exposed through a PDL structure. A cathode is deposited via evaporation deposition to be in contact with the contact overhang. The metal grid is perpendicular to a plurality of metal layers disposed on the substrate.

Described herein are devices and methods related to fabrication of organic electroluminescent devices and related components. In certain embodiments, devices and methods for fabricating OLED panels on substrates with non-uniform reflection or un-even surfaces require that the non-uniform features are arranged in a way such that they are not presented in the region where photolithography features are needed. In certain embodiments, where precision processing such as photolithography features are needed, the substrate is designed to be flat.