The present invention provides a manufacturing technique of a semiconductor device and a display device using a peeling process, in which a transfer process can be conducted with a good state in which a shape and property of an element before peeling are kept. Further, the present invention provides a manufacturing technique of more highly reliable semiconductor devices and display devices with high yield without complicating the apparatus and the process for manufacturing. According to the present invention, an organic compound layer including a photocatalyst substance is formed over a first substrate having a light-transmitting property, an element layer is formed over the organic compound layer including a photocatalyst substance, the organic compound layer including a photocatalyst substance is irradiated with light which has passed through the first substrate, and the element layer is peeled from the first substrate.

It is an object to provide a flexible light-emitting device with long lifetime in a simple way and to provide an inexpensive electronic device with long lifetime using the flexible light-emitting device. A flexible light-emitting device is provided, which includes a substrate having flexibility and a light-transmitting property with respect to visible light; a first adhesive layer over the substrate; an insulating film containing nitrogen and silicon over the first adhesive layer; a light-emitting element including a first electrode, a second electrode facing the first electrode, and an EL layer between the first electrode and the second electrode; a second adhesive layer over the second electrode; and a metal substrate over the second adhesive layer, wherein the thickness of the metal substrate is 10 μm to 200 μm inclusive. Further, an electronic device using the flexible light-emitting device is provided.

A method for producing flexible, nanoparticle-polymer composite electrodes is described. Conductive nanoparticles, preferably metal nanowires or nanotubes, are deposited on a smooth surface of a platform to produce a porous conductive layer. A second application of conductive nanoparticles or a mixture of nanoparticles can also be deposited to form a porous conductive layer. The conductive layer is then coated with at least one coating of monomers that is polymerized to form a conductive layer-polymer composite film. Optionally, a protective coating can be applied to the top of the composite film. In one embodiment, the monomer coating includes light transducing particles to reduce the total internal reflection of light through the composite film or pigments that absorb light at one wavelength and re-emit light at a longer wavelength. The resulting composite film has an active side that is smooth with surface height variations of 100 nm or less.

A display device includes a flexible substrate, and a display region having a plurality of pixels on the flexible substrate. The substrate includes a resin layer, a first inorganic insulating layer provided on the first resin layer, and a second resin layer provided on the first insulating layer. A thickness of the second resin layer is larger than a thickness of the first resin layer, and the first resin layer is a resin layer baked at a higher baking temperature than the second resin layer.

The present invention provides a slim-bezel flexible display device and a manufacturing method thereof. A through hole is formed in a first base plate of a lower substrate in an area adjacent to an edge thereof. A conductive connection body is mounted in the through hole. The conductive connection body is connected to a circuit layout layer and a flexible connection circuit that is connected to a drive circuit board so as to have the drive circuit board and the circuit layout layer connected. Compared to the prior art, the present invention provides an arrangement that makes it not necessary for the side of the lower substrate associated with the circuit layout layer to provide an additional connection zone for connection with the flexible connection circuit so that an effective display zone of a flexible display device can be enlarged and a bezel area can be reduced. Further, the flexible connection circuit is completely arranged at one side of the lower substrate so that the flexible connection circuit curving around an edge of the lower substrate required in the prior art can be prevented thereby eliminating the issue of a lateral side space of the lower substrate being undesirably occupied, allowing further reduction of the bezel area for achieving slim-bezel displaying.

A flexible display device substrate and a preparation method thereof are provided. The flexible display device substrate includes a first flexible substrate, a toughening layer, a second flexible substrate, and an interweaved structure layer. The second flexible substrate is disposed on the first flexible substrate. The interweaving structure layer is disposed between the first flexible substrate and the second flexible substrate, wherein the interweaving structure layer is formed by a part of the first flexible substrate and a part of the second flexible substrate penetrating and interweaving with each other. The toughening layer is disposed at intervals between the first flexible substrate and the second flexible substrate, and the toughening layer and the interweaved structure layer are disposed alternately.

A display apparatus includes a substrate, a display unit on a first surface of the substrate, and a protection film on a second surface, opposite the first surface, of the substrate. The protection film includes a first adhesive layer having a first surface that faces the second surface of the substrate; a protection film base having a first surface that faces a second surface, opposite the first surface, of the first adhesive layer; and a light blocking layer having a first surface that faces a second surface, opposite the first surface of the protection film base.

Power consumption of a display device is reduced. The display quality of the display device is improved. A high-quality image is displayed regardless of a usage environment. A light-weight and non-breakable display device is provided. In the display device, a first display panel and a second display panel are bonded to each other with an adhesive layer. The first display panel includes first pixels that include reflective liquid crystal elements. The second display panel includes second pixels that include light-emitting elements. The first display panel includes a first resin layer positioned closest to the adhesive layer. The second display panel includes a second resin layer positioned closest to the adhesive layer. The thickness of each of the first resin layer and the second resin layer is 0.1 μm or more and 3 μm or less.

A peeling method at low cost with high mass productivity is provided. An oxide layer is formed over a formation substrate, a first layer is formed over the oxide layer using a photosensitive material, an opening is formed in a portion of the first layer that overlaps with the oxide layer by a photolithography method and the first layer is heated to form a resin layer having an opening, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, a conductive layer is formed to overlap with the opening of the resin layer and the oxide layer, the oxide layer is irradiated with light using a laser, and the transistor and the formation substrate are separated from each other.

Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an adhesive layer on the top side of the structure. Aspects also include depositing a release layer and a glass layer on the top side of the structure. Aspects also include reducing a thickness of the silicon substrate on the bottom side of the structure.