Patent classifications
H10K71/80
DISPLAY PANEL AND DISPLAY PANEL PREPARATION METHOD
A display panel and a display panel preparation method thereof are provided. A first buffer layer and a barrier layer are formed on a support base board, and then a second buffer layer is prepared on the barrier layer. In addition, the first buffer layer is illuminated by a mask process, so that an adhesive force between the first buffer layer and the barrier layer is reduced. The second buffer layer continues to be prepared, and the second buffer layer is a transparent film layer. Therefore, light transmitting performance and the display effect of the panel are effectively improved.
DISPLAY PANEL AND DISPLAY PANEL PREPARATION METHOD
A display panel and a display panel preparation method thereof are provided. A first buffer layer and a barrier layer are formed on a support base board, and then a second buffer layer is prepared on the barrier layer. In addition, the first buffer layer is illuminated by a mask process, so that an adhesive force between the first buffer layer and the barrier layer is reduced. The second buffer layer continues to be prepared, and the second buffer layer is a transparent film layer. Therefore, light transmitting performance and the display effect of the panel are effectively improved.
Display substrate with adhesion-enhancing layers, manufacturing method thereof, and display device
The display substrate includes: the flexible base substrate and the trace layer, a first adhesion-enhancing layer, and a first insulating layer that are stacked on the flexible base substrate, wherein the first adhesion-enhancing layer is between the first insulating layer and the trace layer, and the first adhesion-enhancing layer is bonded to the first insulating layer and the trace layer respectively. The flexible base substrate is provided with a bending area, and an overlapping area is present between an area which an orthographic projection of the first adhesion-enhancing layer on the flexible base substrate is within and the bending area, and an orthographic projection of the signal trace in the trace layer on the flexible base substrate falls in the bending area.
Display device, module, and electronic device
The display defects of a display device are reduced. The display quality of the display device is improved. The display device includes a display panel and a first conductive layer. The display panel includes a display element including a pair of electrodes. An electrode of the pair of electrodes which is closer to one surface of the display panel is supplied with a constant potential. A constant potential is supplied to the first conductive layer. The second conductive layer provided on the other surface of the display panel is in contact with the first conductive layer, whereby the second conductive layer is also supplied with the constant potential. The second conductive layer includes a portion not fixed to the first conductive layer.
Display device, module, and electronic device
The display defects of a display device are reduced. The display quality of the display device is improved. The display device includes a display panel and a first conductive layer. The display panel includes a display element including a pair of electrodes. An electrode of the pair of electrodes which is closer to one surface of the display panel is supplied with a constant potential. A constant potential is supplied to the first conductive layer. The second conductive layer provided on the other surface of the display panel is in contact with the first conductive layer, whereby the second conductive layer is also supplied with the constant potential. The second conductive layer includes a portion not fixed to the first conductive layer.
Display panel, manufacturing method and stretchable display device
Disclosed are a display panel, a manufacturing method and a stretchable display device. The display panel includes a rigid substrate; a flexible substrate and an encapsulation layer. The flexible substrate includes a plurality of through-groove structures and at least one through-groove structure includes a non-fixed region and a fixed region surrounding the non-fixed region. A portion of the encapsulation layer located in the at least one through-groove structure includes a first sub-portion located in the fixed region and attached to the rigid substrate and a second sub-portion located in the non-fixed region and attached to the rigid substrate by an organic separation layer, the second sub-portion is configured to be separated from the rigid substrate in a case of gasification of the organic separation layer, and the first sub-portion is configured to be lifted off from the flexible substrate together with the rigid substrate under an external force.
Display panel and fabrication method thereof, and display device
A display panel includes a first flexible substrate, and a metal wiring layer located on the first flexible substrate. The metal wiring layer includes at least one first power-supply line. At least one binding region is disposed on the side of the first flexible substrate away from the metal wiring layer. The display panel also includes a thin-film transistor layer, located on the side of the metal wiring layer away from the first flexible substrate and including a plurality of first thin-film transistors. Each first thin-film transistor includes a first electrode electrically connected to the first power-supply line. The display panel further includes a first conductive layer, including a plurality of conductive sections. The plurality of conductive sections is located in the binding region, and the first power-supply line is electrically connected to at least one conductive section of the plurality of conductive sections.
SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE
A solid-state imaging device according to an embodiment of the present disclosure includes: a plurality of photoelectric converters that is stacked on a semiconductor substrate, and has wavelength selectivities different from each other; and a wiring line that is formed on the semiconductor substrate, and is electrically coupled to the plurality of photoelectric converters. Each of the photoelectric converters includes a photoelectric conversion film, and a first electrode and a second electrode that are disposed with the photoelectric conversion film interposed therebetween. The wiring line extends in a direction normal to the semiconductor substrate, and includes a vertical wiring line formed in contact with the second electrode of each of the photoelectric converters.
Display substrate, manufacturing method thereof, display device
A display substrate, a manufacturing method thereof, and a display device are provided. The display substrate includes a base substrate, a pixel defining layer, and a first electrode layer between the base substrate and the pixel defining layer. The pixel defining layer defines a plurality of sub-pixels on the base substrate, the first electrode layer comprises a plurality of first electrodes, and the plurality of first electrodes being separated from each other by gaps, and an orthographic projection of the pixel defining layer on the base substrate covers an orthographic projection of the gap on the base substrate.
Display panel having circuits on opposing sides of insulating substrate connected by tapered through hole and pad, manufacturing method thereof, and display device
A display panel, a manufacturing method of the display panel, and a display device including the display panel are provided. The display panel includes an insulating substrate; a first circuit at a first side of the insulating substrate; and a second circuit at a second side of the insulating substrate. The first side and the second side of the insulating substrate are opposite to each other in a first direction perpendicular to a display surface, and the first circuit and the second circuit on opposing sides of the insulating substrate are electrically connected by tapered through hole and tapered pad.