An ink printing process employs per-nozzle droplet volume measurement and processing software that plans droplet combinations to reach specific aggregate ink fills per target region, guaranteeing compliance with minimum and maximum ink fills set by specification. In various embodiments, different droplet combinations are produced through different print head/substrate scan offsets, offsets between print heads, the use of different nozzle drive waveforms, and/or other techniques. Optionally, patterns of fill variation can be introduced so as to mitigate observable line effects in a finished display device. The disclosed techniques have many other possible applications.

An element manufacturing method and apparatus for efficiently manufacturing an element such as an organic semiconductor element. First, an intermediate product that includes a substrate and a protrusion extending in a normal direction of the substrate is provided. Next, in a stacking chamber conditioned to a vacuum environment, a stacked structure is formed by continuously stacking a lid member on the intermediate product at a side where the protrusion is provided. After this operation, the stacked structure is transported from the stacking chamber to a first pressure chamber coupled to the stacking chamber and conditioned to a first pressure higher than the pressure in the vacuum environment. Next, the stacked structure is further transported from the first pressure chamber to a separation chamber coupled to the first pressure chamber and conditioned to a vacuum environment, and then the stacked structure is separated into the intermediate product and the lid member.

To provide an organic photoelectric conversion element, imaging device, and optical sensor having low dark currents, and a method of manufacturing a photoelectric conversion element. Provided is a photoelectric conversion element, including: a first electrode; an organic photoelectric conversion layer disposed in a layer upper than the first electrode, the organic photoelectric conversion layer including one or two or more organic semiconductor materials; a buffer layer disposed in a layer upper than the organic photoelectric conversion layer, the buffer layer including an amorphous inorganic material and having an energy level of 7.7 to 8.0 eV and a difference in a HOMO energy level from the organic photoelectric conversion layer of 2 eV or more; and a second electrode disposed in a layer upper than the buffer layer.

Provided is an organic thin film forming apparatus, an organic thin film forming method, and a method of manufacturing an organic thin film device using the same, in which an organic light-emitting layer (photoactive layer) and/or an electron transport layer can be formed on a substrate when an organic light emitting diode (OLED) or an organic solar cell is manufactured. The organic thin film forming apparatus includes: a solution spray unit for spraying a solution on a substrate; and a hot gas spray unit for spraying a hot gas onto fine liquid droplets that have been sprayed from the solution spray unit and that are in flight, to thereby evaporate a solvent contained in the fine liquid droplets.

A system and method for continuous atomic layer deposition. The system and method includes a housing, a moving bed which passes through the housing, a plurality of precursor gases and associated input ports and the amount of precursor gases, position of the input ports, and relative velocity of the moving bed and carrier gases enabling exhaustion of the precursor gases at available reaction sites.

A solar cell according to one aspect of the present disclosure includes: a first electrode; an electron transport layer on the first electrode; a light-absorbing layer located on the electron transport layer and containing a perovskite type compound; a second electrode on the light-absorbing layer; and a sealing body sealing at least a part of the first electrode, the electron transport layer, the light-absorbing layer, and at least a part of the second electrode. A gas containing oxygen is present between the sealing body and each of the at least a part of the first electrode, the electron transport layer, the light-absorbing layer, and the at least a part of the second electrode. The concentration of the oxygen is 5% or more, and the concentration of water is 300 ppm or less on a volume fraction basis.

A mask frame assembly including a frame including a first frame, a second frame, and a bonding layer disposed therebetween to couple the first frame to the second frame, a mask disposed on the frame, first and second ends of the mask overlapping the frame, and a welding unit penetrating the mask and the second frame to couple the mask to the second frame.

A method for manufacturing an organic semiconductor element including applying an organic semiconductor solution to a base is provided. The method includes, before the applying, bringing a pressure of an inert gas close to an ambient pressure while varying the pressure of the inert gas between a negative pressure and a positive pressure with respect to the ambient pressure. The inert gas is contained in a sealed container together with the organic semiconductor solution. The ambient pressure is a pressure of surroundings of the organic semiconductor solution in the applying.

A mask plate, a method for packaging an OLED device and an OLED device are disclosed, the mask plate includes at least one opening for forming a pattern of a package layer; the side of the mask plate close to the OLED device to be packaged has an etching layer which is used to etch the material of a package layer.

The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.