Techniques and devices are provided for attaching a die to a metal manifold. A metal-containing ink is used to deposit a metal trace on the die and thereby to form a gasket, after which the die is compressed against the manifold to form a sealed connection between the two.

The present disclosure provides a manufacturing method for thin film transistors and a display panel, in which a semiconductor channel layer is formed by embossing on a semiconductor solution material directly by using an embossing template having a semiconductor channel layer pattern, thus it does not need to form a photoresist layer on the semiconductor solution material to form a semiconductor channel layer, the erosion of the semiconductor channel layer caused by the photoresist can be avoided, thereby the product quality and the device performance are improved.

An example provides a method for forming an apparatus including a substrate imprinted with a pattern for forming isolated device regions. A method may include imprinting an unpatterned area of a substrate with a pattern to form a patterned substrate having a plurality of recessed regions at a first level and a plurality of elevated regions at a second level, and depositing a first layer of conductive material over the patterned substrate with a plurality of breaks to form a plurality of bottom electrodes. The method may include depositing a layer of an active stack, with a second layer of conductive material, over the plurality of bottom electrodes to form a plurality of devices on the plurality of recessed regions isolated from each other by the plurality of elevated regions.

The present application discloses a method of fabricating a light extraction layer having a corrugated surface. The method includes forming a transparent optical material layer using a transparent optical material; and forming a plurality of convex portions on a surface of the transparent optical material layer using a molding plate having a plurality of concave portions on a surface of the molding plate; the plurality of convex portions respectively substantially complementary to the plurality of concave portions.

A semiconductor device and method of fabricating the same are provided. The semiconductor device includes a substrate having a trench and an etching stop layer. The etching stop layer is disposed in the substrate and surrounds the bottom surface and a portion of a sidewall of the trench.

A method of fabricating a light emitting device comprises providing a mold having an unpolished surface with an arithmetic mean roughness R.sub.a in a range from 0.1 ?m to 10 ?m, depositing a thin polymer film over the surface of the mold, wherein the film has a thickness in a range from 1 ?m to 100 ?m, positioning a light emitting body onto the thin polymer film, wherein the light emitting body includes an anode, a cathode, and a light emitting layer positioned between the anode and the cathode, and separating the thin polymer film with the light emitting body from the mold. A light emitting device is also described.

An OLED is provided that includes a substrate; and an anode, a P-type organic semiconductor layer, an N-type organic semiconductor layer, and a cathode that are successively laminated on the substrate. An interface between the P-type organic semiconductor layer and the N-type organic semiconductor layer is a curved surface structure.

The present disclosure provides a manufacturing method for thin film transistors and a display panel, in which a semiconductor channel layer is formed by embossing on a semiconductor solution material directly by using an embossing template having a semiconductor channel layer pattern, thus it does not need to form a photoresist layer on the semiconductor solution material to form a semiconductor channel layer, the erosion of the semiconductor channel layer caused by the photoresist can be avoided, thereby the product quality and the device performance are improved.

The present application discloses a method of fabricating a light extraction layer having a corrugated surface. The method includes forming a transparent optical material layer using a trans optical material; and forming a plurality of convex portions on a surface of the transparent optical material layer using a molding plate having a plurality of concave portions on a surface of the molding plate; the plurality of convex portions respectively substantially complementary to the plurality of concave portions.

A method is provided for depositing textured wide bandgap materials, such as polymers or perovskites, on a textured transparent conducting oxide on inorganic thin-film, which serves as a recombination layer, or interfacial conducting layer (ICL), for tandem or multi junction solar cells.