A method of manufacturing a patterned crystal structure for includes depositing an amorphous material. The amorphous material is modified such that a first portion of the amorphous thin-film layer has a first height/volume and a second portion of the amorphous thin-film layer has a second height/volume greater than the first portion. The amorphous material is annealed to induce crystallization, wherein crystallization is induced in the second portion first due to the greater height/volume of the second portion relative to the first portion to form patterned crystal structures.

A manufacturing method for an LED display panel is disclosed. The method includes: forming a first electrode on a substrate; forming a function layer in the first electrode; through a nanoimprint method, forming multiple grooves on a surface of the function layer away from the first electrode; filling a luminescent solution in the multiple grooves in order to form an organic light-emitting layer; and forming a second electrode on the organic light-emitting layer. According to the manufacturing method for an LED display panel of the present invention, the manufacturing process can be simplified, the production cost can be decreased and the production yield can be effectively improved. The present invention also provides an LED display panel.

A display device, which includes a plurality of unit pixels, includes a plurality of first electrodes respectively corresponding to the plurality of unit pixels, an insulating layer which includes a plurality of through holes, a light emitting element layer, and a second electrode. Each of the plurality of through holes have inner surfaces including a forwardly tapered surface, which is inclined in a direction of enlarging the apertures toward a light emitting direction, and a reversely tapered surface, which is inclined in a direction of reducing the apertures toward the light emitting direction. The forwardly tapered surface is formed between the unit pixels arranged side by side in the first direction. The reversely tapered surface is formed between the unit pixels arranged side by side in the second direction.

The present disclosure provides an OLED display device and its manufacturing method. The OLED display device includes an organic light-emitting layer and a plurality of elements arranged one on another at a light-exiting side of the organic light-emitting layer. At least one transparent light extraction layer is arranged between the elements, and/or between the organic light-emitting layer and the element adjacent to the organic light-emitting layer, and/or at a light-exiting surface of the element farthest away from the organic light-emitting layer. A refractive index of the organic light-emitting layer and/or a refractive index of the element adjacent to the light extraction layer, and a refractive index of the light extraction layer decrease successively in a light emergent direction, and the refractive index of the light extraction layer is greater than a refractive index of air.

An example provides a method for forming an apparatus including a substrate imprinted with a pattern for forming isolated device regions. A method may include imprinting an unpatterned area of a substrate with a pattern to form a patterned substrate having a plurality of recessed regions at a first level and a plurality of elevated regions at a second level, and depositing a first layer of conductive material over the patterned substrate with a plurality of breaks to form a plurality of bottom electrodes. The method may include depositing a layer of an active stack, with a second layer of conductive material, over the plurality of bottom electrodes to form a plurality of devices on the plurality of recessed regions isolated from each other by the plurality of elevated regions.

The invention relates to a method for manufacturing an optoelectronic component substrate (12) comprising a stack of layers, the method comprising a step of: preforming a substrate (12) comprising a face which has a pattern with at least one zone made of a first material and one zone made of a second material, the two materials being thermosetting or thermoplastic materials, the first material being an electrically conductive material and the second material being an electrically insulating material, and molding by compression the face of the substrate (12) with a face of a reference element (22) having a surface roughness less than or equal to 50 nanometers.

A method of fabricating a light emitting device comprises providing a mold having an unpolished surface with an arithmetic mean roughness R.sub.a in a range from 0.1 m to 10 m, depositing a thin polymer film over the surface of the mold, wherein the film has a thickness in a range from 1 m to 100 m, positioning a light emitting body onto the thin polymer film, wherein the light emitting body includes an anode, a cathode, and a light emitting layer positioned between the anode and the cathode, and separating the thin polymer film with the light emitting body from the mold. A light emitting device is also described.

A display device, which includes a plurality of unit pixels, includes a plurality of first electrodes respectively corresponding to the plurality of unit pixels, an insulating layer which includes a plurality of through holes, a light emitting element layer, and a second electrode. Each of the plurality of through holes have inner surfaces including a forwardly tapered surface, which is inclined in a direction of enlarging the apertures toward a light emitting direction, and a reversely tapered surface, which is inclined in a direction of reducing the apertures toward the light emitting direction. The forwardly tapered surface is formed between the unit pixels arranged side by side in the first direction. The reversely tapered surface is formed between the unit pixels arranged side by side in the second direction.

The present disclosure provides an OLED display device and its manufacturing method. The OLED display device includes an organic light-emitting layer and a plurality of elements arranged one on another at a light-exiting side of the organic light-emitting layer. At least one transparent light extraction layer is arranged between the elements, and/or between the organic light-emitting layer and the element adjacent to the organic light-emitting layer, and/or at a light-exiting surface of the element farthest away from the organic light-emitting layer. A refractive index of the organic light-emitting layer and/or a refractive index of the element adjacent to the light extraction layer, and a refractive index of the light extraction layer decrease successively in a light emergent direction, and the refractive index of the light extraction layer is greater than a refractive index of air.

The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.