Provided are a display motherboard, a preparation method thereof, a display substrate and a display device. The display motherboard includes a plurality of display substrate regions and a cutting region located at a periphery of each of the plurality of display substrate regions; the display motherboard includes a driving structure layer arranged in each of the plurality of display substrate regions and a marking structure layer arranged in each cutting region, wherein the marking structure layer includes a cutting mark layer; and a planarization layer arranged on the driving structure layer and the marking structure layer, and covering the marking structure layer.

Simple and high-precision processing, and narrowing of the frame are to be facilitated at the time of preparing display panels by multiple formation. After bonding a first substrate layer in which a plurality of element substrates is formed on a support plate and a second substrate layer in which a plurality of counter substrates is formed on a support plate, these substrate layers are divided into a plurality of display panels. Ridge-like ribs of a covalently or ionically bonding inorganic material are formed along edges of the element substrate and the counter substrate. The dividing includes scribing the support plates along the ribs, and flexing and breaking the support plates.

A single display panel and an electronic device are provided. The single display panel comprises an upper substrate; a lower substrate including a display area and a stepped area; and a frame adhesive disposed between the upper substrate and the to a substrate, and surrounding the display area, wherein there is no blank area around the display panel. The single display panel is obtained from an array substrate comprising OLED display panels to be separated from each other through a cutting, wherein the display panel includes a display area, at least two adjacent display panels are connected through the frame adhesive disposed at an edge frame surrounding the display area but not covering the display area, and there is no cutting headroom between at least one side of the at least two adjacent display panels.

A display device includes a first substrate having a first step part formed in a frame area on a periphery of a display area, a second substrate arranged facing the first substrate, and a filler material filled between the first substrate in one part of the display area and the frame area, and the second substrate, a periphery edge part being located in a range from the first step part to an end part of the first substrate and the second substrate.

A display device includes a first substrate, a second substrate comprising a pixel portion configured to display an image, and a dummy portion spaced from the pixel portion, a side of the dummy portion being exposed to the outside, and an interlayer between the first substrate and the second substrate, wherein the pixel portion and the dummy portion each include multiple layers, and at least one layer of the pixel portion and at least one layer of the dummy portion include a same material.

A manufacturing method of a display device in an embodiment according to the present invention, the method includes forming a terminal electrode in a terminal part of a first substrate, forming a pixel electrode corresponding to each pixel in a pixel part of the first substrate, forming a first intermediate layer in a region including the terminal electrode of the terminal part, forming an organic layer above the pixel electrode in the pixel part, forming a counter electrode layer above the first substrate including the pixel part and the terminal part, forming a passivation layer above the counter electrode layer, arranging a second substrate opposing the pixel part and bonding the first substrate and the second substrate using a sealing member enclosing the pixel part, and removing the first intermediate layer, the counter electrode layer and the passivation layer in the terminal part.

OLED panels and techniques for fabricating OLED panels are provided. Multiple cuts may be made in an OLED panel to define a desired shape, as well as the location and shape of external electrical contacts. The panel may be encapsulated before or after being cut to a desired shape, allowing for greater flexibility and efficiency during manufacture.

An organic light-emitting diode provides a substrate having a top side and one or a plurality of substrate side surfaces running transversely to the top side and connected thereto via a substrate edge; and an organic layer sequence applied to the top side with an emitter layer, which generates electromagnetic radiation coupled out from the diode via a luminous surface during intended operation of the diode. In a plan view of the luminous surface, the sequence adjoins at least a partial region of substrate edge(s), and in the region the luminous surface extends at least as far as the corresponding edge. An encapsulation formed in an uninterrupted and continuous fashion is applied to the sequence. The encapsulation, at least in the region of the edge adjoining the sequence, is led onto the associated substrate side surface, at least partly covers the latter and is in direct contact with the surface.

A display apparatus includes a substrate having a first area, a second area, and a bending area disposed therebetween. The substrate is bent at the bending area about a bending axis. An inorganic insulating layer is disposed over the substrate and includes an opening or groove corresponding to the bending area. An organic material layer fills the opening or groove. A first conductive layer extends from the first area to the second area through the bending area. The first conductive layer is disposed over the organic material layer and includes a multipath portion having a plurality of through holes. A length of the multipath portion, in a direction from the first area to the second area, is greater than a width of the opening or groove, in the direction from the first area to the second area.

A peeling method of one embodiment of the present invention includes a first step of forming a first insulating layer over a substrate; a second step of forming a second insulating layer over the first insulating layer; a third step of forming a peeling layer over the second insulating layer; a fourth step of performing plasma treatment on a surface of the peeling layer; a fifth step of forming a third insulating layer over the peeling layer; a sixth step of performing heat treatment; and a seventh step of separating the peeling layer and the third insulating layer from each other. The first insulating layer and the third insulating layer each have a function of blocking hydrogen and for example, include a silicon nitride film or the like. The second insulating layer has a function of releasing hydrogen by heating and for example, includes a silicon oxide film.