Disclosed is a display device configured such that a mixture of a transition metal and an organic material is used as a cathode, whereby the cathode exhibits low resistance, high transmittance, high reliability, and high performance in the state in which the cathode is thin.

Provided are a window cover film, a method of manufacturing the same, and a flexible display panel including the same. A window cover film has an excellent interlayer binding force between each layer to have significantly improved wear resistance, scratch resistance, fingerprint wipeability, and the like, while also having excellent surface properties such as a sense of touch and slip properties, a method of manufacturing the same, and a flexible display panel including the same are provided.

A display device comprises a display panel substrate and a glass substrate over said display panel substrate, wherein said display panel substrate comprises multiple contact pads, a display area, a first boundary, a second boundary, a third boundary and a fourth boundary, wherein said display area comprises a first edge, a second edge, a third edge and a fourth edge, wherein said first boundary is parallel to said third boundary and said first and third edges, wherein said second boundary is parallel to said fourth boundary and said second and fourth edges, wherein a first least distance between said first boundary and said first edge, wherein a second least distance between said second boundary and said second edge, a third least distance between said third boundary and said third edge, a fourth distance between said fourth boundary and said fourth edge, and wherein said first, second, third and fourth least distances are smaller than 100 micrometers, and wherein said glass substrate comprising multiple metal conductors through in said glass substrate and multiple metal bumps are between said glass substrate and said display panel substrate, wherein said one of said metal conductors is connected to one of said contact pads through one of said metal bumps.

A display apparatus includes a display area, a non-display area surrounding the display area, and a bending area formed in at least one side of the non-display area. The display apparatus includes a first glass substrate provided in the display area, a second glass substrate provided in the non-display area, an anti-etching member provided to overlap the bending area, and a link line portion formed on the anti-etching member and formed to overlap the non-display area.

A display device includes a display panel having a display region and a pad region adjacent to the display region, and a circuit board electrically connected to the display panel, in which the display panel includes: a base substrate having an upper surface and a lower surface opposing the upper surface, the base substrate including a plurality of recessed patterns recessed from the lower surface; and a plurality of display pads disposed in the pad region and arranged in a first direction, and wherein at least one of the plurality of recessed patterns overlaps the pad region.

Disclosed is a method for manufacturing ultra-thin glass. The method includes: patterning, on a mother glass substrate comprising a plurality of display cells and a dummy area surrounding the display cells, a cutting line having a shape corresponding to the display cells; forming a mother glass protective film on the mother glass substrate; forming a through-hole which corresponds to the cutting line by etching the mother glass substrate; and cutting bridges which are formed by the mother glass substrate and connect the through-holes.

A display device includes a first substrate having a display area and a peripheral area, the first substrate including a first inclined surface disposed at an outer portion of the peripheral area and being angled relative to the first substrate in the display area; a pixel structure disposed on the first substrate in the display area; a second substrate disposed on the pixel structure; a first electrode disposed on the first inclined surface and between the first substrate and the second substrate; and a second electrode disposed on sides of the first and second substrates, the second electrode being in contact with the first electrode.

Disclosed are an array substrate, a method for fabricating the same, a display panel, and a display device, and the array substrate includes: an underlying substrate, and gate lines and data lines located on the underlying substrate, and intersecting with each other, a layer where the gate lines are located is between a layer where the data lines are located, and the underlying substrate; and the array substrate further includes a buffer layer located between the underlying substrate and the layer where the gate lines are located; and the buffer layer includes a plurality of through-holes, where orthographical projections of the through-holes onto the underlying substrate cover orthographical projections of the areas where the gate lines intersect with the data lines, onto the underlying substrate.

Embodiments herein relate to integrating FIVR switching circuitry into a substrate that has a first side and a second side opposite the first side, where the first side of the substrate to electrically couple with a die and to provide voltage to the die and the second side of the substrate is to couple with an input voltage source. In embodiments, the FIVR switching circuitry may be printed onto the substrate using OFET, CNT, or other transistor technology, or may be included in a separate die that is incorporated within the substrate.

A display device may include a substrate in which an opening is defined, a first disconnected line disposed on the substrate, the first disconnected line extending along a first direction and including a first disconnected portion and a second disconnected portion, and the first disconnected portion and the second disconnected portion being disconnected from each other by the opening, and a first bypass line disposed on the substrate in a different layer from the first disconnected line, the first bypass line bypassing the opening and connecting the first disconnected portion and the second disconnected portion to each other.