A method of manufacturing a display panel includes forming a unit panel which includes a display unit provided on a substrate. The substrate of the unit panel is cut out in a form of a closed loop having a straight line portion and a curve portion that are connected to each other. The cutting out of the substrate of the unit panel includes cutting the straight line portion by a first cutting process using a first tool and cutting the curve portion by a second cutting process using a second tool that is different from the first tool.

An organic-light-emitting-diode device and a fabricating method thereof, a displaying base plate and a displaying device, wherein the organic-light-emitting-diode device includes a substrate, and an anode layer, an organic functional layer and a cathode layer that are provided in stacking on one side of the substrate, wherein the organic functional layer includes a first functional layer, a second functional layer and a light emitting layer that are provided in stacking, and the first functional layer is provided closer to the anode layer; and a HOMO energy level of the second functional layer is deeper than both of a HOMO energy level of the first functional layer and a HOMO energy level of a host material of the light emitting layer.

The present disclosure provides a back plate for OLED display substrate, and a method for manufacturing the same. The back plate comprises a pixel definition layer comprising a body layer and an interface layer disposed on the surface of the body layer. The interface layer exhibits different lyophilic or lyophobic properties with respect to a functional layer of the OLED depending on the temperature of the interface layer. When the OLED display substrate is manufactured by using the back plate according the present disclosure, the cost can be reduced, and the device yield of the display substrate can be ensured.

A flexible display panel includes: a stretchable base film; an adhesive layer disposed on a surface of the stretchable base film; a flexible substrate including a plurality of display units and a plurality of connection units, every two adjacent display units being connected by at least one connection unit; and a plurality of first release agent films disposed between the plurality of connection units and the adhesive layer, the plurality of first release agent films and the plurality of connection units being in one-to-one correspondence. An orthographic projection of each connection unit on the stretchable base film is within an orthographic projection of a corresponding first release agent film on the stretchable base film. The plurality of display units are bonded to the adhesive layer.

A flexible display device is provided, including a flexible display panel which includes a display area, a bending area and a bonding area, wherein the bending area is located between the display area and the bonding area; a first backplate located on a non-display surface of the display area; and a second backplate located on a non-bonding surface of the bonding area; wherein at least one of the first backplate and the second backplate is defined as a backplate structure, the backplate structure comprises a supporting layer and a porous material layer, and the porous material layer is adhered to the flexible display panel at an end of the bending area.

A substrate, a method of manufacturing the same, and a display panel are provided. The substrate includes a base; a first conductive layer formed on the base and patterned to form a first metal line, wherein the first conductive layer has a multi-film layer structure composed of a first metal and a second metal, and the second metal is close to the base and is easily etched; an insulating layer; a second conductive layer patterned to form a second metal line and a first metal protection line, wherein the first metal protection line covers a side of the first metal line not covered by the insulating layer.

An electronic device may include a display and an optical sensor formed underneath the display. A pixel removal region on the display may at least partially overlap with the sensor. The pixel removal region may include a plurality of non-pixel regions each of which is devoid of thin-film transistors. The plurality of non-pixel regions is configured to increase the transmittance of light through the display to the sensor. In addition to removing thin-film transistors in the pixel removal region, additional layers in the display stack-up may be removed. In particular, a cathode layer, polyimide layer, and/or substrate in the display stack-up may be patterned to have an opening in the pixel removal region. A polarizer may be bleached in the pixel removal region for additional transmittance gains. The cathode layer may be removed using laser ablation with a spot laser or blanket illumination.

An electronic device including an electronic module, a sensing unit divided into a hole area overlapping the electronic module, an active area surrounding the hole area, and a peripheral area adjacent to the active area. A first sensing electrode and a second sensing electrode are disposed in the active area and insulated from each other. The first sensing electrode includes first main patterns, first neighboring patterns having a smaller area than the first main patterns, and a hole pattern connected to the adjacent first neighboring patterns. The second sensing electrode includes second main patterns, second neighboring patterns adjacent the hole area and having a smaller area than the second main patterns, second connection patterns connected to the second main patterns, and a routing pattern connected to the adjacent second neighboring patterns. The hole pattern is disposed in the hole area, and the routing pattern is disposed in the peripheral area.

Increasing transparency of one or more micro-displays. A method includes attaching a transparent cover to at least a portion of a semiconductor wafer. The at least a portion of the semiconductor wafer includes the one or more micro-displays. The one or more micro-displays include one or more active silicon areas. The method further includes, after the transparent cover has been attached to the at least a portion of the semiconductor wafer, removing silicon between one or more of the active silicon areas, causing the one or more micro-displays to have a transparency of at least 50%.

A multilayer diamond system includes an optically transparent substrate and an optically transparent intermediate layer deposited on the optically transparent substrate. A diamond layer is deposited on the optically transparent intermediate layer and formed from diamond having at least 50% of diamond grains sized between 2 nm and 500 nanometers.