The present application provides a display panel and a method for manufacturing the display panel. The display panel includes a substrate, at least one raised structure, a film encapsulation layer, and a planarization layer. The raised structure is disposed on the substrate. The film encapsulation layer covers the substrate, the raised structure, and a space sidewall of the space. The planarization layer is disposed on the film encapsulation layer. The planarization layer includes hexamethyldisiloxane.

A display terminal and a display panel applied in the display terminal are disclosed in the present application. Widths of the non-display areas of the display panel are elongated to fix the non-display areas to a non-display surface of the display terminal, to achieve a bezel-free display effect on two sides of the display terminal in an unfolded state, and a seamless surround display effect and a bezel-free display effect on the two sides of the display terminal in a folded state.

The present disclosure relates to a support structure provided on one side of a flexible display panel, comprising a bendable region, a non-bendable region and a transitional region between the bendable region and the non-bendable region; the bendable region is provided with a first hollowed-out pattern, and the first hollowed-out pattern comprises a plurality of first hollowed-out holes; the transitional region is provided with a second hollowed-out pattern, and the second hollowed-out pattern comprises a plurality of second hollowed-out holes; the density of the plurality of first hollowed-out holes is greater than the density of the plurality of second hollowed-out holes. The present disclosure also relates to a flexible display apparatus.

A display apparatus having a connection electrode which crosses a bending area may be provided. The connection electrode may be disposed on a device substrate including a bending area between a display area and a pad area. The connection electrode may connect the display area and the pad area across the bending area. The connection electrode may have a stacked structure of the lower connecting electrode and the upper connecting electrode. A light-emitting device, an encapsulating element and a touch electrode may be sequentially stacked on the display area of the device substrate. The upper connecting electrode may include the same material as the touch electrode. Thus, in the display apparatus, the disconnection of the connection electrode due to bending stress and external impact may be reduced.

High-performance perovskite solar cell (PSC) devices, arrays thereof, and modules manufactured on flexible and stretchable substrates using roll-to-roll high throughput manufacturing techniques. The flexible cells can be cut into strips and are connected via flexible and/or stretchable interconnects. The interconnect can be a layer deposited on a wavy surface of the stretchable substrate, a coiled or hinged wire, or a conductive paste that can be deformed prior to curing. The highly deformable solar modules can conform to complex organic contours and shapes, such as those that are common in vehicle designs. Such shapes typically require at least one axis of flex and at least one axis of stretch.

One embodiment illustrated herein includes an optical device. The optical device includes a stacked device, formed in a single semiconductor chip, configured to be coupled in an overlapping fashion to an underlying device. The stacked device includes a plurality of optical output pixels. Each of the output pixels includes a plurality of subpixels. Each subpixel is configured to output a color of light. Each pixel is configured to output a plurality of colors of light. The optical device further includes one or more detectors, configured to detect light, interleaved with the subpixels of the pixels. The stacked device comprises a plurality of transparent regions formed in the stacked device between the pixels. The plurality of transparent regions are transparent, according to a first transmission efficiency, to light in a first spectrum. The underlying device emits light in the first spectrum.

One embodiment illustrated herein includes an optical device. The optical device includes a stacked device, formed in a single semiconductor chip, configured to be coupled in an overlapping fashion to an underlying device. The stacked device includes a plurality of optical output pixels. Each of the output pixels includes a plurality of subpixels. Each subpixel is configured to output a color of light. Each pixel is configured to output a plurality of colors of light. The optical device further includes one or more detectors, configured to detect light, interleaved with the subpixels of the pixels. The stacked device comprises a plurality of transparent regions formed in the stacked device between the pixels. The plurality of transparent regions are transparent, according to a first transmission efficiency, to light in a first spectrum. The underlying device emits light in the first spectrum.

A display device includes a first glass substrate including a first side surface which is partially inclined, a second glass substrate including a second side surface which is partially inclined, the second glass substrate being apart from the first glass substrate, a display layer including a first area on the first glass substrate, a light-emitting device in the first area, a bending area extending from the first area, and a second area extending from the bending area and on the second glass substrate, and an encapsulation layer on the display layer, the encapsulation layer including an inorganic encapsulation layer and an organic encapsulation layer. Each of the first side surface and the second side surface is adjacent to the bending area.

In order to achieve the above-described objects, according to an aspect of the present disclosure, a display device includes a substrate which includes an active area and a non-active area extending from the active area and including a pad area and is formed of any one of a transparent conducting oxide and an oxide semiconductor; a plurality of inorganic insulating layers disposed on the substrate; a dam member having one end disposed on the pad area and the other end disposed at the outside of the substrate; and a plurality of flexible films which is disposed to cover the dam member and has one end disposed in the pad area. Accordingly, the dam member which covers the pad area is formed to minimize the crack of the plurality of inorganic insulating layers at the edge of the substrate.

A display substrate and a display panel, the display substrate includes a display region and a peripheral region surrounding the display region, the peripheral region has a first linear edge portion extending in a first direction, a second linear edge portion extending in a second direction and a corner edge portion connecting the first linear edge portion and the second linear edge portion, the first direction and the second direction intersect to each other, and a minimum distance between at least a portion of the corner edge portion and an adjacent edge of the display region is smaller than a minimum distance between the first linear edge portion and/or the second linear edge portion and an adjacent edge of the display region, so as to form a concave portion in the corner edge portion towards the display region.