The present invention includes a server system that uses an airflow source that can be external to the computer that the airflow source cools. The computer may be sealed such that the conduits are the primary source of fluid ingress and egress. The airflow source can be positioned in a case of the computer, support members affixing the computer to a rack stand, the rack stand, or beyond conduit that conducts fluid to the rack stand.

A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects. Additional aspects include a thermal pad wrap and a thermally conductive liquid system for heat/cool distribution.

A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

A thermoelectric thin film material including an organic-inorganic hybrid perovskite doped with an organic dopant represented by the general expression ABX.sub.3 where A is an A-site cation, B is a B-site cation, and X is a halide anion. A method of making a thermoelectric thin film material including forming an organic-inorganic hybrid perovskite doped with an organic dopant represented by the general expression ABX.sub.3 where A is an A-site cation, B is a B-site cation, and X is a halide anion. A thermoelectric device comprising a thermoelectric thin film material.

A thermoelectric thin film material including an organic-inorganic hybrid perovskite doped with an organic dopant represented by the general expression ABX.sub.3 where A is an A-site cation, B is a B-site cation, and X is a halide anion. A method of making a thermoelectric thin film material including forming an organic-inorganic hybrid perovskite doped with an organic dopant represented by the general expression ABX.sub.3 where A is an A-site cation, B is a B-site cation, and X is a halide anion. A thermoelectric device comprising a thermoelectric thin film material.

A nano gas pump for generating gas flow, gas compression and gas rarefication is disclosed, which provides up to several orders of magnitude pressure difference, operates over a wide range of pressure from several millitorr to several atmospheres, and with pumping speeds from several nano liters to several liters per minute. The nano gas pump does not require any moving parts and generate gas flow using steep temperature gradients of more than 100 milli Kelvin over a mean free path of the local gas in the direction of the gas flow. Temperature gradients are created and restricted mostly to the gas doing the work, through an arrangement of PNP, NPN, PP, NN thermoelectric segments together with conductive interconnects. Contact resistance which drastically reduces the efficiency of a nanoscale thermoelectric heat pump is mitigated by overlapping thermoelectric segments and electric connections. Several exemplary embodiments are described based on linear (straight) and non-linear (turn) gas flow paths. Various staging configurations are also described.

A nano gas pump for generating gas flow, gas compression and gas rarefication is disclosed, which provides up to several orders of magnitude pressure difference, operates over a wide range of pressure from several millitorr to several atmospheres, and with pumping speeds from several nano liters to several liters per minute. The nano gas pump does not require any moving parts and generate gas flow using steep temperature gradients of more than 100 milli Kelvin over a mean free path of the local gas in the direction of the gas flow. Temperature gradients are created and restricted mostly to the gas doing the work, through an arrangement of PNP, NPN, PP, NN thermoelectric segments together with conductive interconnects. Contact resistance which drastically reduces the efficiency of a nanoscale thermoelectric heat pump is mitigated by overlapping thermoelectric segments and electric connections. Several exemplary embodiments are described based on linear (straight) and non-linear (turn) gas flow paths. Various staging configurations are also described.

Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment. The rack stand includes a hollow body that may be formed of cartridges. Gas from an airflow source is guided into the rack stand body and then into a sealed case of the computer equipment. Air flow is then guided out of the computer equipment for recirculation, exhaust, or other purpose.

Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment. When multiple instances of computer equipment are managed from a central authority, cooling, heating, and/or cessation of either can be controlled in a way that enhances efficiency. Impediments that control access channels and interior access to computer equipment is toggled by the present invention.