Disclosed is a thermo-mechanical actuator (100) comprising a piezo¬electric module (110), the piezo-electric module comprising at least one piezo-electric element (120), wherein the thermo-mechanical actuator is configured to: receive a thermal actuation signal (132) for controlling a thermal behaviour of the piezo-electric module, or provide a thermal sensing signal (132) representative of a thermal state of the piezo-electric module, and, wherein the thermo-mechanical actuator is configured to: receive a mechanical actuation (134) signal for controlling a mechanical behaviour of the piezo-electric module, or provide a mechanical sensing signal (134) representative of a mechanical state of the piezo-electric module.

A wafer-level integrated thermal detector comprises a first wafer and a second wafer (W1, W2) bonded together. The first wafer (W1) includes a dielectric or semiconducting substrate (100), a dielectric sacrificial layer (102) deposited on the substrate, a support layer (104) deposited on the sacrificial layer or the substrate, a suspended active element (108) provided within an opening (106) in the support layer, a first vacuum-sealed cavity (110) and a second vacuum-sealed cavity (106) on opposite sides of the suspended active element. The first vacuum-sealed cavity (110) extends into the sacrificial layer (102) at the location of the suspended active element (108). The second vacuum-sealed cavity (106) comprises the opening of the support layer (104) closed by the bonded second wafer. The thermal detector further comprises front optics (120) for entrance of radiation from outside into one of the first and second vacuum-sealed cavities, aback reflector (112) arranged to reflect radiation back into the other one of the first and second vacuum-sealed cavities, and electrical connections (114) for connecting the suspended active element to a readout circuit (118).

A semiconductor device comprises a first doped semiconductor layer, a second doped semiconductor layer, an oxide layer covering the first doped semiconductor layer and the second doped semiconductor layer, and an interconnect. The first doped semiconductor layer is electrically connected with the second doped semiconductor layer by means of the interconnect which crosses over a sidewall of the second doped semiconductor layer. The interconnect comprises a metal filled slit in the oxide layer. At least one electronic component is formed in the first and/or second semiconductor layer. The semiconductor device moreover comprises a passivation layer which covers the first and second doped semiconductor layers and the oxide layer.

TTFields are applied using transducer arrays made from a plurality of individual electrode elements. The temperatures of those electrode elements can be normalized by positioning respective regions of pyroelectric material in thermal contact with the electrode elements, and subsequently applying an AC signal to each of the electrode elements at respective duty cycles so that an alternating electric field is induced within the subject. For each of the regions of the pyroelectric material, an electrical characteristic that is related to temperature is measured after the AC signal turns off. The duty cycles of the AC signals that are applied to the electrode elements is adjusted until the measured electrical characteristics indicate that the temperatures of all the regions of the pyroelectric material have equalized to within 1° C.

A semiconductor device capable of retaining a signal sensed by a sensor element is provided. The semiconductor device includes a sensor element, a first transistor, a second transistor, and a third transistor. One electrode of the sensor element is electrically connected to a first gate. The first gate is electrically connected to one of a source and a drain of the third transistor. One of a source and a drain of the first transistor is electrically connected to a gate of the second transistor. A semiconductor layer includes a metal oxide.

A process for fabricating a component includes an operation of transferring at least one layer of one or more piezoelectric or pyroelectric or ferroelectric materials forming part of a donor substrate to a final substrate, the process comprising a prior step of joining the layer to a temporary substrate via production of a fragile separating region between the donor substrate of single-crystal piezoelectric or pyroelectric or ferroelectric material and the temporary substrate, the region comprising at least two layers of different materials in order to ensure two compounds apt to generate an interdiffusion of one or more constituent elements of at least one of the two compounds make contact, the fragile region allowing the temporary substrate to be separated.

An antibacterial yarn that includes a core yarn including a functional polymer that generates a charge by external energy and a first sheath yarn higher in hygroscopicity than the core yarn, the first sheath yarn covering at least a part of a periphery of the core yarn across an axial direction of the core yarn.

A system and a method for an energy harvesting and storage apparatus including a flexible substrate, an energy harvesting device disposed on the flexible substrate, the energy harvesting device is configured to convert mechanical energy into electrical energy, an energy storage device disposed on the flexible substrate and in electrical communication with the energy harvesting device and configured to receive and store the electrical energy from the energy harvesting device.

An infrared sensor comprises a base substrate including a recess, a bolometer infrared ray receiver, and a Peltier device. The bolometer infrared ray receiver comprises a resistance variable layer, a bolometer first beam, and a bolometer second beam. The Peltier device comprises a Peltier first beam formed of a p-type semiconductor material and a Peltier second beam formed of an n-type semiconductor material. The Peltier device is in contact with a back surface of the bolometer infrared ray receiver. One end of each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam is connected to the base substrate. The bolometer infrared ray receiver and the Peltier device are suspended above the base substrate. Each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam has a phononic crystal structure including a plurality of through holes arranged regularly.

The invention relates to a microsystem (1) comprising a substrate (12), a bottom electrode (3) arranged on the substrate (12), a ferroelectric layer (4) arranged on the bottom electrode (3), a top electrode (5) arranged on the ferroelectric layer (4) and an isolation layer (6) that is electrically isolating, that is arranged on the top electrode (5), that extends from the top electrode (5) to the substrate (12) so that the isolation layer (6) covers the bottom electrode (3), the ferroelectric layer (4) and the substrate (12) in a region around the complete circumference of the bottom electrode (3), and the isolation layer (6) has the shape of a ring that confines in its centre a through hole (11) that is arranged in the region of the top electrode (5).