A thermotactile stimulation prosthesis includes a prosthesis extremity having a prosthesis interface configured for attachment to a human limb, and a thermoelectric actuator array coupled to the prosthesis interface and configured to establish a noninvasive thermoneural human-machine interface capable of providing sensations of temperature to the human limb.

Method for generation of electrical power within a three-dimensional integrated structure comprising several elements electrically interconnected by a link device, the method comprising the production of a temperature gradient in at least one region of the link device resulting from the operation of at least one of the said elements, and the production of electrical power using at least one thermo-electric generator comprising at least one assembly of thermocouples electrically connected in series and thermally connected in parallel and contained within the said region subjected to the said temperature gradient.

A photodetector comprising a photoabsorber, comprising a doped semiconductor, a contact layer comprising a doped semiconductor and a barrier layer comprising a charge carrier compensated semiconductor, the barrier layer compensated by doping impurities such that it exhibits a valence band energy level substantially equal to the valence band energy level of the photo absorbing layer and a conduction band energy level exhibiting a significant band gap in relation to the conduction band of the photo absorbing layer, the barrier layer disposed between the photoabsorber and contact layers. The relationship between the photo absorbing layer and contact layer valence and conduction band energies and the barrier layer conduction and valance band energies is selected to facilitate minority carrier current flow while inhibiting majority carrier current flow between the contact and photo absorbing layers.

Micro-scale thermoelectric devices having high thermal resistance and efficiency for use in cooling and energy harvesting applications and relating fabricating methods are disclosed. The thermoelectric devices include first substrates substantially parallel with second substrates. Scaffold members are deposited between the first and second substrate. The scaffold members include a plurality of cavities having sidewalls. The scaffold members may be formed from the second substrate. The sidewalls are substantially vertical with respect to the second substrate. The sidewalls may be substantially parallel. Thermoelectric materials are deposited on the sidewalls.

A cross-plane flexible micro-TEG with hundreds of pairs of thermoelectric pillars formed via electroplating, microfabrication, and substrate transferring processes is provided herein. Typically, fabrication is conducted on a Si substrate, which can be easily realized by commercial production line. The fabricated micro-TEG transferred to the flexible layer from the Si substrate. Fabrication methods provided herein allow fabrication of main TEG components including bottom interconnectors, thermoelectric pillars, and top interconnectors by electroplating. Such flexible micro-TEGs provide high output power density due to high density of thermoelectric pillars and very low internal resistance of electroplated components. The flexible micro-TEG can achieve a power per unit area of 4.5 mW cm.sup.−2 at a temperature difference of ˜50 K, which is comparable to performance of flexible TEGs developed by screen printing. The power per unit weight of flexible TEGs described herein is as high as 60 mW g.sup.−1, which is advantageous for wearable applications.

A housing for a thermoelectric module can stably protect individual elements of the thermoelectric module such as thermoelectric elements, electrodes, and insulating boards, while maintaining power generation performance of the thermoelectric module. The housing for a thermoelectric module includes: a housing enveloping at least one thermoelectric module; and a heat barrier unit configured to prevent a flow of heat from being transferred through a sidewall of the housing.

A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom. The control unit is configured and operable to carry out at least one of the following: (i) operating said second heat pumping assembly to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly is either desirably low or by a certain value lower than temperature of the heat source of said first heat pumping assembly; and (ii) operating said second heat pumping assembly to maintain predetermined temperature of said thermal interface.

A thermoelectric module includes a low temperature-side wiring line, a high temperature-side wiring line, a low temperature-side member, a plurality of low temperature-side thermoelectric conversion elements made of a BiTe-based material, a high temperature-side member, a plurality of high temperature-side thermoelectric conversion elements made of a material different from the BiTe-based material, an insulating member, a radiant heat blocking plate, a low temperature-side electrode, and a high temperature-side electrode. The radiant heat blocking plate is arranged on the side of the high temperature-side member with respect to the low temperature-side wiring line and the high temperature-side wiring line. A thermoelectric module that can restrain burning of wiring lines, as well as a thermoelectric power generating apparatus and a thermoelectric generator including the same can thereby be obtained.

A method for converting heat to electric energy is described which involves thermally cycling an electrically polarizable material sandwiched between electrodes. The material is heated by extracting thermal energy from a gas to condense the gas into a liquid and transferring the thermal energy to the electrically polarizable material. An apparatus is also described which includes an electrically polarizable material sandwiched between electrodes and a heat exchanger for heating the material in thermal communication with a heat source, wherein the heat source is a condenser. An apparatus is also described which comprises a chamber, one or more conduits inside the chamber for conveying a cooling fluid and an electrically polarizable material sandwiched between electrodes on an outer surface of the conduit. A gas introduced into the chamber condenses on the conduits and thermal energy is thereby transferred from the gas to the electrically polarizable material.

A system for recapturing energy may include a thermoelectric generator (TEG) assembly for thermally attaching to a surface heated by plasma or ionization heating. The TEG assembly may include a first level thermoelectric generator module (TEM). The first level TEM may include a hot side that is thermally attached to the surface, a cold side and a plurality of TEG devices disposed between the hot side and the cold side. A second level TEM may be stacked on the first level TEM. A hot side of the second level TEM may be thermally attached to the cold side of the first level TEM. The plurality of TEG devices generate an electric current based on a temperature differential across the TEG devices. The TEG assembly may also include an electrical wiring system that electrically connects the TEMs and supplies the electric current generated to an electrical power apparatus.