The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Systems, methods, and devices of the various embodiments provide for microfabrication of devices, such as semiconductors, thermoelectric devices, etc. Various embodiments may include a method for fabricating a device, such as a semiconductor (e.g., a silicon (Si)-based complementary metal-oxide-semiconductor (CMOS), etc.), thermoelectric device, etc., using a mask. In some embodiments, the mask may be configured to allow molecules in a deposition plume to pass through one or more holes in the mask. In some embodiments, molecules in a deposition plume may pass around the mask. Various embodiments may provide thermoelectric devices having metallic junctions. Various embodiments may provide thermoelectric devices having metallic junctions rather than junctions formed from semiconductors.

A thermoelectric flexible mat may include a first large surface and a second large surface. The mat may also include a plurality of p-doped elements and a plurality of n-doped elements disposed in an alternating manner with one another and electrically interconnected to a series circuit via a plurality of electrically conductive conductor bridges. The plurality of conductor bridges of the series circuit may be assigned, at least in regions, to the first large surface and the second large surface such that the first large surface defines a hot side and the second large surface defines a cold side. An absorptive absorption structure may connect the hot side and the cold side. The absorption structure may be structured and arranged such that any liquid present on the cold side is absorbable into the absorption structure and transportable to the hot side via the absorption structure.

The present disclosure is related to thermoelectric panels and their use in cooling and heating systems. The cooling/heating systems may include a plurality of thermoelectric panels. The panels may include thermoelectric devices embedded between a housing formed by heat conductive layers and edge structures for preserve a low thermal conductivity volume.

An electric generator device is provided that includes a thermoelectric array, a base plate, and an electric power output. The thermoelectric array may include a hot side portion and a cold side portion. The base plate may be configured to receive heat from a heat source to be transferred to the hot side portion of the thermoelectric array. The electric power output may be electrically coupled to the thermoelectric array. The thermoelectric array may be configured to convert a temperature differential into an electric voltage for output to the electric power output. The power generation housing may be configured to hold a heat rejection substance that absorbs heat from the cold side portion of the thermoelectric array to facilitate generation of the temperature differential between the hot side portion and the cold side portion of the thermoelectric array.

A thermoelectric energy harvesting device including a first thermal-coupling interface, a second thermal-coupling interface, and a membrane. The membrane arranged between the first thermal-coupling interface and the second thermal-coupling interface and connected to the first thermal-coupling interface by a supporting frame. A thermal bridge between the second thermal-coupling interface and a thermal-coupling portion of the membrane. A thermoelectric converter on the membrane configured to supply an electrical quantity as a function of a temperature difference between the thermal-coupling portion of the membrane and the supporting frame.

Disclosed is a thermoelectric cell having thermoelectric tracks of alternating conductivity types connected in series by metallic connections, including a platform suspended over a substrate by arms, the platform and the arms being parts of the same thermally and electrically insulating layer, and each arm supporting a thermoelectric track.

A first thermoelectric component (TEC) includes a top surface and a bottom surface. The first TEC is configured to concurrently increase temperature of the top surface and decrease temperature of the bottom surface or vice versa to transfer thermal energy between the top surface and the bottom surface based on a voltage potential applied to the first TEC. A thermal transfer component includes a top surface and a bottom surface. The bottom surface of the thermal transfer component is coupled to the top surface of the first TEC. The thermal transfer component is tapered such that the bottom surface is smaller than the top surface. A second TEC includes a top surface and a bottom surface. The bottom surface of the second TEC is coupled to the top surface of the thermal transfer component. The second TEC is larger than the first TEC.

A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.

In a known method in which a cooling pipe that is fixed and rigid is used, variation in a distance from the center of an exhaust heat pipe to the outer surface of a thermoelectric conversion module, variation in the radius of curvature of the curved surface of a cooling pipe, and other factors produce a gap between the outer surface of the thermoelectric conversion module and the inside surface of the cooling pipe. The gap prevents the achievement of desired cooling performance and the improvement of power generation efficiency. A thermoelectric conversion module of the present invention includes two flexible substrates each made of a thin resin film and having mounting lands formed thereon, and a plurality of thermoelectric elements mounted on the mounting lands at high density, wherein one of the two flexible substrate has a plurality of slits to make the module easy to bend.