A MEMS actuator includes a monolithic body of semiconductor material, with a supporting portion of semiconductor material, orientable with respect to a first and second rotation axes, transverse to each other. A first frame of semiconductor material is coupled to the supporting portion through first deformable elements configured to control a rotation of the supporting portion about the first rotation axis. A second frame of semiconductor material is coupled to the first frame by second deformable elements, which are coupled between the first and the second frames and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements carry respective piezoelectric actuation elements.

A method for processing a wafer includes subjecting the wafer to a reduction treatment with heat and a reducing agent that has a melting point of lower than 600 C. The wafer is made of a material selected from the group consisting of lithium tantalate, lithium niobate, and a combination thereof. The wafer and the reducing agent are spaced apart from each other so that the reducing agent indirectly interacts with the wafer during the reduction treatment. Also disclosed is a processed wafer obtained by the method.

A method of manufacturing surface acoustic wave device chips includes grinding a reverse side of a wafer with a surface acoustic wave device formed in each area demarcated by a plurality of crossing projected dicing lines on a face side of the wafer; before or after grinding, applying a laser beam to the reverse side of the wafer such that the laser beam is focused at a position within the wafer, the position being closer to the face side of the wafer than a position corresponding to a reverse side of each of the surface acoustic wave device chips to be produced from the wafer, thereby forming a modified layer for diffusing an acoustic wave; and after grinding and applying the laser beam, dividing the wafer along the projected dicing lines into a plurality of the surface acoustic wave device chips.

A magnetoelectric energy harvester having excellent power generation performance and a manufacturing method thereof are provided. The magnetoelectric energy harvester includes a magnetostrictive material portion including a magnetostrictive material which generates a mechanical deformation when being magnetized. The magnetoelectric energy harvester also includes a piezoelectric material portion which has a bending vibration mode and includes a piezoelectric material which produces power by receiving a mechanical deformation force from the magnetostrictive material portion.

Disclosed are a triboelectric power generating device and a manufacturing method thereof, which does not require a physical space to generate friction motions unlike conventional pressured induced electric power generating devices, maximizes a surface area by the junction friction portion of a friction material composite that is inexpensive and easy to mass-produce, thereby improving the durability of a generating device, and effectively producing electricity. The triboelectric power generating device includes a triboelectric generation layer (300) including a friction portion having a junction structure which is located at a central portion and made of two or more different polymers, a first electrode (100) which is located to face one surface of the triboelectric generation layer (300), and a second electrode (200) which is located to face the other surface of the triboelectric generation layer (300).

In an electronic component, electrodes defining functional portions are provided on a piezoelectric substrate. In order to define a hollow portion which the functional portions face, there are provided a first support with a frame shape, and second supports on the piezoelectric substrate in an inner side region surrounded by the first support. A cover is laminated on the first support as well as on the second supports to define the hollow portion. A height of each of the second supports is higher than a height of the first support.

A vibration transducer module for detecting a vibratory signal, comprising a base, a spring connected to the base at a first location, a mass mechanically coupled to the spring at a second location remote from the first location, and a wall configured to position a first wall electrode and a second wall electrode a selected distance from the first location, the conductive element positioned and sized to contact the first wall electrode and the second wall electrode. The mass comprises a conductive element, and an energy harvester to provide a first voltage signal. The energy harvester may comprise a piezoelectric material or be construct as a SAW device. The module may be combined with a rectifier and an oscillator to form a vibration sensor.

A process for fabricating a micro-electro-mechanical system, includes the following steps: production of a stack on the surface of a temporary substrate so as to produce a first assembly, comprising: at least depositing a piezoelectric material or a ferroelectric material to produce a layer of piezoelectric material or of ferroelectric material; producing a first bonding layer; production of a second assembly comprising at least producing a second bonding layer on the surface of a host substrate; production of at least one acoustic isolation structure in at least one of the two assemblies; production of at least one electrode level containing one or more electrodes in at least one of the two assemblies; bonding the two assemblies via the two bonding layers, before or after the production of the at least one electrode level in at least one of the two assemblies; removing the temporary substrate.

An actuator device (AV) including a main body (10) with a base body (10a) and a buildup body (10b) a plurality of actuators which are formed of actuator bodies comprising a piezoelectric or electrostrictive material and actuation electrodes and a printed circuit board (100) which extends in the longitudinal direction (X) of the actuator device (AV) over at least sections of actuator connection coatings, wherein conductive paths thereof are in electrical contact with the actuator connection coatings and wherein in the connection area segment (S0b, S1b, S2b, S3b) of the respective recess (S0, S1, S2, S3) at least in sections a connection layer (V) made of a resin reinforcement material with bismaleimide is disposed such that the connection layer (V) at least in sections contacts side surfaces (AS1, AS2) which respectively delimit a connection area segment (S0b, S1b, S2b, S3b) and which are opposed to each other.

Techniques and structures are provided for manufacturing a flexible PMUT array. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.