A method of making a temperature-compensated resonator is presented. The method comprises the steps of: (a) providing a substrate including a device layer; (b) replacing material from the device layer with material having an opposite temperature coefficient of elasticity (TCE) along a pre-determined region of high strain energy density for the resonator; (c) depositing a capping layer over the replacement material; and (d) etch-releasing the resonator from the substrate. The resonator may be a part of a micro electromechanical system (MEMS).

A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.

Embodiments of the present disclosure provide a flexible acoustic-electric substrate and a preparation method thereof, and a flexible acoustic-electric device. The preparation method of a flexible acoustic-electric substrate includes: forming a flexible substrate; forming a plurality of piezoelectric components on the flexible substrate; and forming a plurality of chambers on the flexible substrate in a one-to-one correspondence relationship with the plurality of piezoelectric components, and the plurality of chambers are located on a side of the flexible substrate away from the plurality of piezoelectric components.

A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

A method for the quality inspection of an ultrasonic transducer and an ultrasonic sensor comprising an ultrasonic transducer and carrying out the quality inspection method are described. The ultrasonic transducer comprises a housing having an electrically conductive layer extending at least over an inner surface of a housing wall of the housing, and a piezoelectric transducer arranged in the housing, the end face of which equipped with an electrode is connected to the electrically conductive layer by means of a dielectric coupling layer. According to the method, at least one quality inspection of the ultrasonic transducer is carried out, in which a capacitance of a capacitor comprising the electrode, the electrically conductive layer serving as the counter electrode, and the dielectric coupling layer as a dielectric is measured and a quality defect of the ultrasonic transducer is determined if the measured capacitance is outside a specified capacitance range.

A frequency adjustment method of a vibrator element includes preparing a vibrator element that has a vibrating arm, a first weight placed on one principal surface of the vibrating arm, and a second weight placed on the other principal surface of the vibrating arm, in which the first weight has a non-overlapping region which does not overlap the second weight in a plan view in a normal direction of the principal surface, preparing a substrate including a wiring portion, and fixing the vibrator element to the substrate by causing the other principal surface side of the vibrator element to face the substrate side, and irradiating the non-overlapping region of the first weight with an energy ray from one principal surface side, removing a portion of the non-overlapping region of the first weight, and adjusting a resonance frequency of the vibrating arm.

An apparatus may include a one- or two-dimensional array of micromechanical ultrasonic transducer (PMUT) elements positioned below, beside, with, on, or above a backplane of a visual display. The backplane may be a thin-film transistor (TFT) backplane. The array of PMUT elements may be a piezoelectric micromechanical ultrasonic transducer (PMUT) array or a capacitive micromechanical ultrasonic transducer (CMUT) array. The PMUT array may be configurable to operate in modes corresponding to multiple frequency ranges. When operating in the low-frequency mode, the apparatus may be capable of gesture detection. A high-frequency mode may include a fingerprint sensor mode or a stylus detection mode.

This disclosure provides methods of fabricating a transducer array. The methods can included creating a lens shaped depression in a backing material, printing an electrode, printing a thick layer of lead zirconate titanate material, printing a ground electrode, and placing a plurality of equally spaced cuts into the depression.

Provided is a method of manufacturing an ultrasound probe. The method includes: preparing a backing layer having first and second surfaces with different heights due to forming a groove in the backing layer, wherein first and second electrodes are exposed on the first and second surfaces, respectively; forming a third electrode that is in contact with the first electrode; forming a base piezoelectric unit on the third electrode, the base piezoelectric unit including a piezoelectric layer; forming a piezoelectric unit by removing an upper region of the base piezoelectric unit; and forming a fourth electrode on the backing layer and the piezoelectric unit.

A fluidic device includes a base structure including at least one bulk acoustic wave (BAW) resonator structure having a fluidic passage containing at least one functionalized active region overlaid with functionalization material suitable to bind an analyte. One or more of a wall structure, a cover structure, or a portion of the base structure defining the fluidic passage includes additional functionalization material to form at least one absorber configured to bind at least one analyte. The dynamic measurement range of a BAW resonator structure is increased when the at least one absorber is placed upstream of the at least one functionalized active region.