A semiconductor device including a magnetic tunnel junction (MTJ) stack, a dielectric encapsulation layer surrounding vertical side surfaces of the MTJ stack, a metal encapsulation layer surrounding an upper horizontal surface and a portion of a vertical side surface of the dielectric encapsulation layer, and a dielectric surrounding a remaining portion of the vertical side surface of the dielectric encapsulation layer. A method including method includes forming a magnetic tunnel junction (MTJ) stack, forming a dielectric encapsulation layer surrounding vertical side surfaces of a top electrode, a free layer, a tunneling barrier, a reference layer and a bottom electrode of the MTJ stack, and forming a metal encapsulation layer surrounding an upper horizontal surface and a portion of a vertical side surface of the dielectric encapsulation layer.

A semiconductor device including a magnetic tunnel junction (MTJ) stack, a dielectric encapsulation layer surrounding vertical side surfaces of the MTJ stack, a metal encapsulation layer surrounding an upper horizontal surface and a portion of a vertical side surface of the dielectric encapsulation layer, and a dielectric surrounding a remaining portion of the vertical side surface of the dielectric encapsulation layer. A method including method includes forming a magnetic tunnel junction (MTJ) stack, forming a dielectric encapsulation layer surrounding vertical side surfaces of a top electrode, a free layer, a tunneling barrier, a reference layer and a bottom electrode of the MTJ stack, and forming a metal encapsulation layer surrounding an upper horizontal surface and a portion of a vertical side surface of the dielectric encapsulation layer.

According to one embodiment, a magnetic memory device includes a switching element; a magnetoresistive effect element; and an electrode provided between the switching element and the magnetoresistive effect element, wherein the electrode includes a first sub-electrode in contact with the switching element, a second sub-electrode in contact with the magnetoresistive effect element, and a third sub-electrode provided between the first sub-electrode and the second sub-electrode, wherein the first sub-electrode and the second sub-electrode includes at least one of C and CN, and wherein the third sub-electrode includes at least one of a high melting point metal element and a compound of the high melting point metal element.

According to one embodiment, a magnetic memory device includes a switching element; a magnetoresistive effect element; and an electrode provided between the switching element and the magnetoresistive effect element, wherein the electrode includes a first sub-electrode in contact with the switching element, a second sub-electrode in contact with the magnetoresistive effect element, and a third sub-electrode provided between the first sub-electrode and the second sub-electrode, wherein the first sub-electrode and the second sub-electrode includes at least one of C and CN, and wherein the third sub-electrode includes at least one of a high melting point metal element and a compound of the high melting point metal element.

A method for fabricating a semiconductor device includes the steps of first forming an inter-metal dielectric (IMD) layer on a substrate, forming a first trench in the IMD layer, forming a metal layer in the first trench, planarizing the metal layer to form a first metal interconnection in the IMD layer and a first recess atop the first metal interconnection, and then forming a first bottom electrode (BE) in the first recess.

A method for fabricating a semiconductor device includes the steps of first forming an inter-metal dielectric (IMD) layer on a substrate, forming a first trench in the IMD layer, forming a metal layer in the first trench, planarizing the metal layer to form a first metal interconnection in the IMD layer and a first recess atop the first metal interconnection, and then forming a first bottom electrode (BE) in the first recess.

The present disclosure provides an SOT-MRAM memory cell, including: a bottom electrode; a magnetic tunnel junction layer located on the bottom electrode; an orbital Hall effect layer located on the magnetic tunnel junction layer; a first transistor, a drain of which is connected to the orbital Hall effect layer; and a second transistor, a drain of which is connected to the bottom electrode. The present disclosure further provides an SOT-MRAM memory, an operation method, and an SOT-MRAM memory array.

The present disclosure provides an SOT-MRAM memory cell, including: a bottom electrode; a magnetic tunnel junction layer located on the bottom electrode; an orbital Hall effect layer located on the magnetic tunnel junction layer; a first transistor, a drain of which is connected to the orbital Hall effect layer; and a second transistor, a drain of which is connected to the bottom electrode. The present disclosure further provides an SOT-MRAM memory, an operation method, and an SOT-MRAM memory array.

Provided are a method for coupling any two qubits from among multiple superconducting qubits and a system thereof, which are applied to an occasion provided with a multi-superconducting-qubit array and a magnetic film material capable of implementing spin waves. The method includes: disposing a magnetic film material below a multi-superconducting-qubit array; forming, through a combination of magnetization directions of magnetic domains in the magnetic film material, multiple channels through which the spin waves pass; disposing multiple qubits of the multi-superconducting-qubit array above the multiple channels through which the spin waves pass correspondingly to implement a coupling between each qubit and the spin waves; and disposing at least two qubits above one spin wave channel and implementing a coupling between the at least two qubits through the coupling between each qubit and the spin waves.

A magnetic memory device may include a substrate including a first region and a second region, a first interlayer insulating layer on the substrate, a first capping layer on the first interlayer insulating layer, the first capping layer covering the first and second regions of the substrate, a second interlayer insulating layer on a portion of the first capping layer covering the first region of the substrate, a bottom electrode contact included in the second interlayer insulating layer, a magnetic tunnel junction pattern on the bottom electrode contact, and a second capping layer on the second interlayer insulating layer, the second capping layer being in contact with the first capping layer on the second region of the substrate.