H10N52/80

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device includes pair of active devices, composite spin Hall electrode, and a magnetic tunnel junction. Composite spin Hall electrode is electrically connected to pair of active devices. Magnetic tunnel junction is disposed on opposite side of composite spin hall electrode with respect to pair of active devices. Spin Hall electrode includes pair of heavy metal layers, and spacer layer disposed in between pair of heavy metal layers. Pair of heavy metal layers is made of a heavy metal in a metastable state. Spacer layer comprises first material different from the pair of heavy metal layers.

SEMICONDUCTOR DEVICE
20230225221 · 2023-07-13 · ·

A semiconductor device for internet of things (IoT) device includes a substrate having an array region defined thereon and a ring of dummy pattern surrounding the array region. Preferably, the ring of dummy pattern includes a plurality of magnetic tunneling junctions (MTJs) and a ring of metal interconnect pattern overlapping the MTJs and surrounding the array region. The semiconductor device further includes a gap between the array region and the ring of dummy pattern.

ARTIFICIAL ANTIFERROMAGNETIC STRUCTURE AND STORAGE ELEMENT
20230010525 · 2023-01-12 ·

Disclosed are an artificial antiferromagnetic structure and a storage element. The artificial antiferromagnetic structure includes a first metal layer, an artificially synthesized antiferromagnetic layer and a second metal layer that are stacked in sequence, wherein there is an interfacial DM (Dzyaloshinskii-Moriya) interaction at an interface between the metal layer and the artificially synthesized antiferromagnetic layer, such that there is a first interfacial DM interaction between the first metal layer and the artificially synthesized antiferromagnetic layer, there is a second interfacial DM interaction between the second metal layer and the artificially synthesized antiferromagnetic layer, and the first interfacial DM interaction is different from the second interfacial DM interaction. The artificially synthesized antiferromagnetic layer forms a stable chiral Néel magnetic domain wall due to a strong interfacial DM interaction.

SOT-MRAM with shared selector

A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a shared selector layer coupled to the first terminal.

SOT-MRAM with shared selector

A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a shared selector layer coupled to the first terminal.

HALL EFFECT SENSOR WITH LOW OFFSET AND HIGH LEVEL OF STABILITY
20230217838 · 2023-07-06 ·

A magnetic field magnetic field sensor and method of making the sensor. The sensor and method of making the sensor may comprise a material or structure that prevents the admission of light in certain wavelengths to enhance the stability of the magnetic field sensor over a period of time. The sensor and method of making the sensor may comprise an adsorption prevention layer which protects the semiconductor portion of the magnetic. The sensor may also comprise an insulating layer formed between semiconductor layers and a substrate layer.

HALL EFFECT SENSOR WITH LOW OFFSET AND HIGH LEVEL OF STABILITY
20230217838 · 2023-07-06 ·

A magnetic field magnetic field sensor and method of making the sensor. The sensor and method of making the sensor may comprise a material or structure that prevents the admission of light in certain wavelengths to enhance the stability of the magnetic field sensor over a period of time. The sensor and method of making the sensor may comprise an adsorption prevention layer which protects the semiconductor portion of the magnetic. The sensor may also comprise an insulating layer formed between semiconductor layers and a substrate layer.

BiSb topological insulator with novel buffer layer that promotes a BiSb (012) orientation

A spin-orbit torque (SOT) magnetic tunnel junction (MTJ) device includes a substrate, a buffer layer formed over the substrate, and a bismuth antimony (BiSb) layer formed over the buffer layer, the BiSb layer having a (012) orientation. In certain embodiments, the SOT MTJ device is part of a microwave assisted magnetic recording (MAMR) write head. In certain embodiments, the SOT MTJ device is part of a magnetoresistive random access memory (MRAM) device.

BiSb topological insulator with novel buffer layer that promotes a BiSb (012) orientation

A spin-orbit torque (SOT) magnetic tunnel junction (MTJ) device includes a substrate, a buffer layer formed over the substrate, and a bismuth antimony (BiSb) layer formed over the buffer layer, the BiSb layer having a (012) orientation. In certain embodiments, the SOT MTJ device is part of a microwave assisted magnetic recording (MAMR) write head. In certain embodiments, the SOT MTJ device is part of a magnetoresistive random access memory (MRAM) device.

Temperature control for Hall bar sensor correction
11693064 · 2023-07-04 · ·

Systems and methods for eliminating or mitigating T-effects on Hall sensors. A system may comprise a magnet-coil arrangement for providing a relative movement therebetween to obtain a relative position, a Hall sensor for sensing the relative movement, a temperature sensor located in proximity of the Hall sensor for providing temperature sensing, and a controller having two or more channels coupled to Hall sensor and to the temperature sensor and configured to control the relative movement and to provide, based on the temperature sensing, a temperature correction input to the Hall sensor for compensating a temperature effect on the Hall sensor sensing.