H10N60/01

Longitudinally joined superconducting resonating cavities
11723142 · 2023-08-08 · ·

A system and method for fabricating accelerator cavities comprises forming at least two half cavities and joining the half cavities with a longitudinal seal. The half cavities can comprise at least one of aluminum, copper, tin, and copper alloys. The half cavities can be coated with a superconductor or combination of materials configured to form a superconductor coating.

High temperature superconductor (HTS) cables and method of manufacture

A high temperature superconductor (HTS) cable comprising at least one coil form comprising a helical channel formed on an exterior surface of the coil form and the helical channel extending at least partially along an axial length of the coil form and a plurality of high temperature superconductor (HTS) tape layers positioned within the helical channel of the coil form. A method for operating a winding machine to produce a high temperature superconductor (HTS) cable comprising a plurality of coil forms comprising a helical channel formed on an exterior surface of the coil form.

High temperature superconductor (HTS) cables and method of manufacture

A high temperature superconductor (HTS) cable comprising at least one coil form comprising a helical channel formed on an exterior surface of the coil form and the helical channel extending at least partially along an axial length of the coil form and a plurality of high temperature superconductor (HTS) tape layers positioned within the helical channel of the coil form. A method for operating a winding machine to produce a high temperature superconductor (HTS) cable comprising a plurality of coil forms comprising a helical channel formed on an exterior surface of the coil form.

High temperature superconducting films and methods for modifying and creating same
11316092 · 2022-04-26 · ·

Operational characteristics of an high temperature superconducting (“HTS”) film comprised of an HTS material may be improved by depositing a modifying material onto appropriate surfaces of the HTS film to create a modified HTS film. In some implementations of the invention, the HTS film may be in the form of a “c-film.” In some implementations of the invention, the HTS film may be in the form of an “a-b film,” an “a-film” or a “b-film.” The modified HTS film has improved operational characteristics over the HTS film alone or without the modifying material. Such operational characteristics may include operating in a superconducting state at increased temperatures, carrying additional electrical charge, operating with improved magnetic properties, operating with improved mechanic properties or other improved operational characteristics. In some implementations of the invention, the HTS material is a mixed-valence copper-oxide perovskite, such as, but not limited to YBCO. In some implementations of the invention, the modifying material is a conductive material that bonds easily to oxygen, such as, but not limited to, chromium.

Methods and systems for manufacturing superconductor devices
11719653 · 2023-08-08 · ·

The various embodiments described herein include methods for manufacturing superconductor devices. In some embodiments, a method of manufacturing a superconductor includes: (1) manufacturing a first superconductor device; (2) characterizing the first superconductor device, including: (a) obtaining x-ray diffraction spectra of the first superconductor device; and (b) identifying a ratio of a first cubic phase peak to a second cubic phase peak in the x-ray diffraction spectra; (3) adjusting a manufacturing parameter based on the identified ratio; and (4) manufacturing a second superconductor device with the adjusted manufacturing parameter.

Ion implant defined nanorod in a suspended Majorana fermion device

Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a suspended Majorana fermion device comprising an ion implant defined nanorod in a semiconducting device are provided. According to an embodiment, a quantum computing device can comprise a Majorana fermion device coupled to an ion implanted region. The quantum computing device can further comprise an encapsulation film coupled to the ion implanted region and a substrate layer. The encapsulation film suspends the Majorana fermion device in the quantum computing device.

SUPERCONDUCTOR-SEMICONDUCTOR FABRICATION

A mixed semiconductor-superconductor platform is fabricated in phases. In a masking phase, a dielectric mask is formed on a substrate, such that the dielectric mask leaves one or more regions of the substrate exposed. In a selective area growth phase, a semiconductor material is selectively grown on the substrate in the one or more exposed regions. In a superconductor growth phase, a layer of superconducting material is formed, at least part of which is in direct contact with the selectively grown semiconductor material. The mixed semiconductor-superconductor platform comprises the selectively grown semiconductor material and the superconducting material in direct contact with the selectively grown semiconductor material.

SUPERCONDUCTOR-SEMICONDUCTOR FABRICATION

A mixed semiconductor-superconductor platform is fabricated in phases. In a masking phase, a dielectric mask is formed on a substrate, such that the dielectric mask leaves one or more regions of the substrate exposed. In a selective area growth phase, a semiconductor material is selectively grown on the substrate in the one or more exposed regions. In a superconductor growth phase, a layer of superconducting material is formed, at least part of which is in direct contact with the selectively grown semiconductor material. The mixed semiconductor-superconductor platform comprises the selectively grown semiconductor material and the superconducting material in direct contact with the selectively grown semiconductor material.

COMBINED DOLAN BRIDGE AND QUANTUM DOT JOSEPHSON JUNCTION IN SERIES

A method of producing a quantum circuit includes forming a mask on a substrate to cover a first portion of the substrate, implanting a second portion of the substrate with ions, and removing the mask, thereby providing a nanowire. The method further includes forming a first lead and a second lead, the first lead and the second lead each partially overlapping the nanowire. In operation, a portion of the nanowire between the first and second leads forms a quantum dot, thereby providing a quantum dot Josephson junction. The method further includes forming a third lead and a fourth lead, one of the third and fourth leads partially overlapping the nanowire, wherein the third lead is separated from the fourth lead by a dielectric layer, thereby providing a Dolan bridge Josephson junction. The nanowire is configured to connect the quantum dot Josephson junction and the Dolan bridge Josephson junction in series.

Microwave integrated quantum circuits with cap wafers and their methods of manufacture

In a general aspect, an integrated quantum circuit includes a first substrate and a second substrate. The first substrate includes a first surface and a recess formed in the first substrate along the first surface. The recess has a recess surface and is configured to enclose a quantum circuit element. The first substrate includes a first electrically-conductive layer disposed on the first surface and covering at least a portion of the recess surface. The first electrically-conductive layer includes a first superconducting material. The second substrate includes a second surface and a quantum circuit element. The second substrate includes a second electrically-conductive layer on the second surface that includes a second superconducting material. The first substrate is adjacent the second substrate to enclose the quantum circuit device within the recess. The first electrically-conductive layer of the first substrate is electrically-coupled to the second electrically-coupled layer of the second substrate.