A device, system and method for measuring the temperature at the center of a normal hotspot and the heat escape time in superconducting filament or nanowire toward the substrate. The device includes structured layers; a superconducting filament is implemented as an active layer where an electrical current pulse or single photon radiation generates a hot spot; a sensitive semiconductor layer of germanium serves as a temperature sensor (thermometer); and a thin layer of insulating silicon oxide is intercalated between the superconducting layer and the germanium having a thickness in the range of 2-10 nm and width 5-100 μm. This device provides a direct measurement of the temperature at the center of a hot spot and determination of the heat escape time toward a substrate; and can be used to determine the sensitivity of a superconducting single photon detector device to a next upcoming photon.

Among other things, an apparatus comprises quantum units; and couplers among the quantum units. Each coupler is configured to couple a pair of quantum units according to a quantum Hamiltonian characterizing the quantum units and the couplers. The quantum Hamiltonian includes quantum annealer Hamiltonian and a quantum governor Hamiltonian. The quantum annealer Hamiltonian includes information bearing degrees of freedom. The quantum governor Hamiltonian includes non-information bearing degrees of freedom that are engineered to steer the dissipative dynamics of information bearing degrees of freedom.

According to one embodiment, a particle detector is disclosed. The particle detector includes a substrate, and detection regions provided on the substrate and insulated from the substrate. Each of the detection regions includes superconducting strips having a longitudinal direction and configured for detecting a particle, and the superconducting strips are arranged in arrangement directions differing between the detection regions. The numbers of particles detected by the respective detection regions are used to generate accumulated detection number profiles of particles in the arrangement directions of the superconducting strips of the respective detection regions, and each of the accumulated detection number profiles includes a profile obtained by accumulating the numbers of particles detected by the respective superconducting strips along the longitudinal direction.

A printed circuit board for transmitting electrical energy and for signal transmission includes electrical conductor tracks coupled to the printed circuit board wherein the electrical conductor tracks include a first electrical conductor track with a superconducting material. The first electrical conductor track is designed to provide electrical energy directly to a power electronics system. The electrical conductor tracks include a second electrical conductor track which is designed to provide a signal transmission to a signal electronics system. A system is disclosed having such a printed circuit board.

Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.

An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

Devices, systems, methods, and/or computer-implemented methods that can facilitate a qubit device comprising a superconducting circuit provided on an encapsulated vacuum cavity are provided. According to an embodiment, a device can comprise a substrate having an encapsulated vacuum cavity provided on the substrate. The device can further comprise a superconducting circuit provided on the encapsulated vacuum cavity.

Addressing a superconducting flux storage device may include applying a bias current, a low-frequency flux bias, and a high-frequency flux bias in combination to cause a combined address signal level to exceed a defined address signal latching level for the superconducting flux storage device. A bias current that, in combination with a low-frequency flux bias and a high-frequency flux bias, causes a combined address signal level to exceed a defined address signal latching level for a superconducting flux storage device is at least reduced by an asymmetry in the Josephson junctions of the CJJ. A low-frequency flux bias that, in combination with a bias current and a high-frequency flux bias, causes a combined address signal level to exceed a defined address signal latching level for a superconducting flux storage device is at least reduced by an asymmetry in the Josephson junctions of the CJJ.

A solid state cooler device is disclosed that comprises a first normal metal pad, a first aluminum layer and a second aluminum layer disposed on the first normal metal pad and separated from one another by a gap, a first aluminum oxide layer formed on the first aluminum layer, and a second aluminum oxide layer formed on the second aluminum layer, and a first superconductor pad disposed on the first aluminum oxide layer and a second superconductor pad disposed on the second aluminum oxide layer. The device further comprises a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad, wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.

A superconducting quantum interference apparatus comprising a planar array of loops where each loop constitutes a superconducting quantum interference device, and a magnetic shield disposed over part of one of the loops so to protect the covered part of the loop from exposure to a magnetic field.