A free grounding film and a manufacturing method therefor, and a shielding circuit board including the free grounding film and a grounding method. The free grounding film includes at least one conductor layer. The shielding circuit board including the free grounding film is formed in a manner that an electromagnetic wave shielding film is arranged on a printed circuit board, and the upper surface of the electromagnetic wave shielding film is provided with the free grounding film. The grounding method for the shielding circuit board adopts one of three modes.

An aluminum alloy wire rod having a composition comprising Mg: 0.1-1.0 mass %, Si: 0.1-1.2 mass %, Fe: 0.10-1.40 mass %, Ti: 0-0.100 mass %, B: 0-0.030 mass %, Cu: 0-1.00 mass %, Ag: 0-0.50 mass %, Au: 0-0.50 mass %, Mn: 0-1.00 mass %, Cr: 0-1.00 mass %, Zr: 0-0.50 mass %, Hf: 0-0.50 mass %, V: 0-0.50 mass %, Sc: 0-0.50 mass %, Co: 0-0.50 mass %, Ni: 0-0.50 mass %, and the balance: Al and inevitable impurities, wherein a number of compound particles present on a surface and having a diameter of greater than or equal to 1 μm in terms of equivalent circle diameter is less than or equal to one per 100 μm.sup.2, and a tensile strength is greater than or equal to 200 MPa.

An aluminum alloy wire rod having a composition including Mg: 0.10-1.00 mass %, Si: 0.10-1.00 mass %, Fe:0.01-1.40 mass %, Ti:0-0.100 mass %, B: 0-0.030 mass %, Cu: 0-1.00 mass %, Ag: 0-0.50 mass %, Au: 0-0.50 mass %, Mn: 0-1.00 mass %, Cr: 0-1.00 mass %, Zr: 0-0.50 mass %, Hf: 0-0.50 mass %, V: 0-0.50 mass %, Sc: 0-0.50 mass %, Sn: 0-0.50 mass %, Co: 0-0.50 mass %, Ni: 0-0.50 mass %, and the balance: Al and inevitable impurities, wherein a ratio of (standard deviation of crystal grain size of the aluminum alloy wire rod)/(average crystal grain size of the aluminum alloy wire rod) is less than or equal to 0.57, and a ratio of (diameter of the aluminum alloy wire rod)/(average crystal grain size of the aluminum alloy wire rod) is greater than or equal to 10.

A cover for an electrical connector comprises a cylindrical disc including a first cover surface, an opposite second cover surface, and a barrel surface extending between the first cover surface and the second cover surface. The first cover surface has a convex form. In a state in which the cover is mounted on the electrical connector, the first cover surface forms a portion of an outer surface of the electrical connector and the second cover surface faces an inner side of the electrical connector.

An aluminum alloy electrical wire includes an aluminum alloy strand that is composed of an aluminum alloy including: magnesium in a range of 0.11 to 1.03 atom %; silicon in a range of 0.10 to 0.90 atom %; nickel in a range of 0.005 to 0.25 atom %; and the balance being aluminum and inevitable impurities. The aluminum alloy strand has tensile strength of 230 MPa or greater, electrical conductivity of 44% IACS or greater, and elongation of 10% or greater. A wire harness includes the aluminum alloy electrical wire.

A lead-free solder alloy having a low melting temperature and low yield strength is disclosed. The solder alloy includes 5.0-20.0 wt. % of indium (In), 1.0-5.0 wt. % of silver (Ag), 0.25-2.0 wt. % of copper (Cu), 0.1-0.5 wt. % of zinc (Zn), and a remainder of tin (Sn). In implementations, a sulfur compound may be included in a concentration of 100 ppm to 500 ppm in the alloy to prevent oxidation of zinc and indium on the surface of the alloy. The solder alloy is particularly useful for but not limited to solder on pad applications in first level interconnect semiconductor device packaging.

Provided is an aluminum member for electrodes capable of stably maintaining a low electric resistance state, and a method of producing an aluminum member for electrodes. An aluminum member for electrodes includes an aluminum substrate and an oxide film that is laminated on at least one main surface of the aluminum substrate, and the oxide film has a density of 2.7 to 4.1 g/cm.sup.3 and a thickness of 5 nm or less.

A catalyst-free synthesis method for the formation of a metalorganic compound comprising a desired (first) metal may include, for example, selecting another (second) metal and an organic solvent, with the second metal being selected to (i) be more reactive with respect to the organic solvent than the first metal and (ii) form, upon exposure of the second metal to the organic solvent, a reaction by-product that is more soluble in the organic solvent than the metalorganic compound. An alloy comprising the first metal and the second metal may be first produced (e.g., formed or otherwise obtained) and then treated with the organic solvent in a liquid phase or a vapor phase to form a mixture comprising (i) the reaction by-product comprising the second metal and (ii) the metalorganic compound comprising the first metal. The metalorganic compound may then be separated from the mixture in the form of a solid.

A flat routing material includes a flat conductive material and an insulating coating covering the conductive material. The routing material includes a bent portion as a part bending in an edgewise direction at a predetermined angle or more, and one or more folds extending toward the outer peripheral side of the bent portion are provided on at least the inner peripheral side of the bent portion. The folds are manufactured by press working.

A method for producing an aluminum wire that has high strength and high conductivity even when reduced in diameter while having excellent elongation and improved in productivity. A method for producing an aluminum wire includes a solution step of subjecting a heat-treatable aluminum alloy material to a solution treatment, a wire-drawing step of subjecting the solution-treated aluminum alloy material to wire-drawing processing, a softening step of subjecting the wire-drawing processed aluminum alloy material to a softening treatment in a short time within 10 seconds, and an aging step of subjecting the softening-treated aluminum alloy material to an aging treatment.