Provided is a Pd coated Cu bonding wire for a semiconductor device capable of sufficiently obtaining bonding reliability of a ball bonded portion in a high temperature environment of 175° C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases. The bonding wire for a semiconductor device comprises a Cu alloy core material; and a Pd coating layer formed on a surface of the Cu alloy core material; and contains 0.03 to 2% by mass in total of one or more elements selected from Ni, Rh, Ir and Pd in the bonding wire and further 0.002 to 3% by mass in total of one or more elements selected from Li, Sb, Fe, Cr, Co, Zn, Ca, Mg, Pt, Sc and Y. The bonding wire can be sufficiently obtained bonding reliability of a ball bonded portion in a high temperature environment of 175° C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases by being used.

A multilayer electrically conductive wire includes a central support core, and a set of pairs of layers each including at least one intercalary layer made of a non-carbon material, wherein the first layer of the first pair of layers is deposited on the outer surface of the central core and the first layer of the N+1 pair of layers is deposited on the second layer of the N pair of layers such that each graphene layer of each N pair is separated from another graphene layer of another pair of layers by an intercalary layer of another non-carbon based material.

A manufacturing of wires with optimized insulation properties, providing an insulating wire and the wire drawing process for producing it. The wire enamel has three layers: base layer (2), middle layer (3) and top layer (4), wherein these layers wrap around the conducting wire (1) in this order. The wire drawing process is carried out by a) Primary drawing; b) Final drawing and c) Enameling process carried out in line, wherein the enameling is conducted preferably with a specific number of dies for each layer. The process and composition conditions of the wire allowed to provide a triple layer wire that presents high resistance to partial discharges, high thermal class and high resistance to abrasion, thus, increasing the service lifetime of the wire in demanding motor applications when high thermal, high mechanical and high electrical resistance are required.

Embodiments of the present disclosure generally relate to a unitary electrical conduit that includes a central conductor, a socket coupled to a first end of the central conductor, a male insert coupled to a second end of the central conductor a dielectric sheath surrounding the central conductor, and an outer conductor surrounding the dielectric sheath, wherein a substantially 90 degree bend is formed along a length thereof.

Provided is a copper alloy plate consisting of 0.1 to 0.6% by mass of Cr, and from 0.01 to 0.30% by mass in total of one or more of Zr and Ti, the balance being copper and unavoidable impurities. In the copper alloy plate, a difference between a Schmidt factor when tensile stress is applied in a direction parallel to a rolling parallel direction (RD) with respect to a peak orientation of integrated intensity in an inverse pole figure in the RD, as obtained from XRD measurement, and a Schmidt factor when tensile stress is applied in a direction parallel to a rolling perpendicular direction (TD) with respect to a peak orientation of integrated intensity in an inverse pole figure in the TD, as obtained from XRD measurement, is 0.05 or less.

Various embodiments relate to an electrical feedthrough assembly an elongate conductor and a collar at least partially surrounding the elongate conductor along a portion of a length of the elongate conductor. The collar can be composed of a material having a thermal conductivity of at least 170 W/(m-K). A shell can be disposed around the collar. At one or more operating frequencies, at least a portion of a length of the electrical feedthrough assembly can be selected to provide at least one quarter wave transform.

To provide a film which is excellent in heat resistance, which is less likely to be warped and which has high adhesion, a method for producing it, and a metal-clad laminate and a coated metal conductor, using the film.

The film of the present invention comprises an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.

A copper alloy plate material, having a chemical composition comprising, in mass %, Ni: 10.0 to 30.0%, Al: 1.00 to 6.50%, Ag: 0 to 0.50%, B: 0 to 0.1%, Co: 0 to 2.0%, Cr: 0 to 0.5%, Fe: 0 to 2.0%, Ga: 0 to 0.5%, Ge: 0 to 0.5%, In: 0 to 0.5%, Mg: 0 to 2.0%, Mn: 0 to 2.0%, P: 0 to 0.2%, Si: 0 to 2.0%, Sn: 0 to 2.0%, Ti: 0 to 2.0%, Zn: 0 to 2.0%, and Zr: 0 to 0.3%, with the balance of Cu and unavoidable impurities, and satisfying Ni/Al≤9.0, wherein a Cu concentration X.sub.Cu, in a precipitate represented by X.sub.Cu (mass %)=[Cu/(Cu+Ni+Al)]×100 is 15 to 50 mass %, and a Vickers hardness is 300 HV or more.

Methods for producing a conductive element precursor and a conductive element, such as a tape or wire, are provided. The methods comprise growing a plurality of carbon nanotubes on a metallic substrate and coating carbon nanotubes of the plurality of carbon nanotubes on the metallic substrate with a metallic material.

A copper alloy has a composition including: 70 mass ppm or more and 400 mass ppm or less of Mg; 5 mass ppm or more and 20 mass ppm or less of Ag; less than 3.0 mass ppm of P; and a Cu balance containing inevitable impurities. In the copper alloy, the electrical conductivity is 90% IACS or more, and the average value of KAM values is 3.0 or less.