A contact area structure including an organic substrate, an inorganic conductive layer, an organic adhesive layer, and a transparent conductive layer is provided. The organic substrate includes at least one contact pad area including a first block and a second block adjacent to the first block. The inorganic conductive layer is disposed on the organic substrate, in which the inorganic conductive layer is partially disposed on the first block, and a portion of an upper surface of the organic substrate is exposed at the second block. The inorganic conductive layer and the upper surface of the organic substrate are covered by the organic adhesive layer. The transparent conductive layer is disposed on the organic adhesive layer, so that the adhesive strength between the transparent layer and the inorganic conductive layer can be enhanced.

A method of fabricating a conductor includes preparing an aramid nanofiber solution in which a matrix of aramid nanofibers is dispersed, preparing a dispersion of copper nanoparticles, each copper nanoparticle of the dispersion of cooper nanoparticles having an organic capping ligand attached to the copper nanoparticle, and incorporating copper nanoparticles of the dispersion of copper nanoparticles into the matrix of aramid nanofibers such that each incorporated copper nanoparticle is bonded to a respective aramid nanofiber of the matrix of aramid nanofibers via the organic capping ligand to which the copper nanoparticle is attached. The organic capping ligand may include a mercaptocarboxyiic acid.

A cable includes an inner conductor; a dielectric arranged around the inner conductor; an outer conductor annularly arranged around the dielectric; a plurality of tapes around the outer conductor, each tape providing a successive layer over and circumferentially surrounding an underlying tape or the outer conductor, wherein one of the tapes is a conductor; and a jacket encasing the plurality of tapes.

One object of the present invention is to provide copper fine particles which have sufficient dispersibility when made into a paste and can be sintered at 150° C. or lower, the present invention provides copper fine particles, wherein the copper fine particles have a coating film containing copper carbonate and cuprous oxide on at least a part of the surface thereof, and a ratio between the following Db and the following Dv (Db/Dv) is in a range of 0.50˜0.90, Dv: an average value (nm) of the area equivalent circle diameter of the copper fine particles obtained by acquiring SEM images for 500 or more copper fine particles using a scanning electron microscope, and calculating by image analysis software, Db: a particle size (nm) of the copper fine particles obtained by measuring a specific surface area (SSA (m.sup.2/g)) of the copper fine particles using a specific surface area meter, and calculating by the following formula (1), Db=6/(SSA×ρ)×10.sup.9 . . . (1) in the formula (1), ρ is a density of copper (g/m.sup.3).

A copper alloy for electronic and electrical equipment is provided, including: 0.15 mass % or greater and less than 0.35 mass % of Mg; 0.0005 mass % or greater and less than 0.01 mass % of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, a content [Mg] (mass %) of Mg and a content [P] (mass %) of P satisfy a relational expression of [Mg]+20×[P]<0.5, and a content of H is 10 mass ppm or less, a content of O is 100 mass ppm or less, a content of S is 50 mass ppm or less, and a content of C is 10 mass ppm or less.

An electric current supply system (20) is designed to be at least partially submerged in an electrically conductive liquid during operation thereof, and having at least one electrically conductive component (21, 22, 23, 24) enveloped in liquid-tight material (40). The component (21, 22, 23, 24) has a sacrificial material that is capable of reacting electrochemically with the liquid. Further, the component (21, 22, 23, 24) has at least one gas trap portion (50) at which the sacrificial material occupies a space in the liquid-tight material (40) that is thereby defined with a gas trapping shape. If, in case of damage to the system (20) in an actual submerged state thereof, the component (21, 22, 23, 24) gets exposed to the liquid, it is achieved that an electrochemical reaction occurring at the exposed area of the component (21, 22, 23, 24) and an outflow of electric current to the liquid are stopped.

This copper alloy contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise: 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater. The half-softening temperature ratio T.sub.LD/T.sub.TD is greater than 0.95 and less than 1.08. The half-softening temperature T.sub.LD is 210° C. or higher.

A method for producing fine copper particles includes producing fine copper particles having a coating film containing cuprous oxide on a surface by heating copper or a copper compound in a reducing flame formed by a burner. The fine copper particles are produced by adjusting a mixing ratio between a combustible gas and a combustion supporting gas which form the reducing flame such that a volume ratio of CO/CO.sub.2 is in a range of 1.5 to 2.4.

A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a strand of a plurality of copper alloy wires: composed of a copper alloy containing Fe in an amount of 0.2% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.4% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, with the balance being Cu and impurities, and having a mass ratio of Fe/P of 4.0 or more; and having a wire diameter of 0.5 mm or less.

A weld nugget portion that is obtained by welding a central conductor of a wire and a receiving portion of a metal terminal is formed on the receiving portion that receives an end portion of the wire with the weld nugget portion expanding from a surface of the receiving portion along which the wire is disposed. An area ratio of a blowhole to a section of the weld nugget portion that is along an imaginary cut plane that is perpendicular to the surface of the receiving portion along which the wire is disposed is no less than 0% and no more than 8.4% (i.e., from 0% to 8.4%), preferably no less than 0% and no more than 1.3% (i.e., from 0% to 1.3%). A central axis of the central conductor of the wire in the weld nugget portion extends along the imaginary cut plane.