There is provided a more versatile technique that is useful for enhancing the sintering delay property of a metal powder. A metal powder surface-treated with at least one coupling agent comprising Si, Ti, Al or Zr, wherein a total adhesion amount of Si, Ti, Al and Zr is 200 to 10,000 μg with respect to 1 g of the surface-treated metal powder, wherein a 1% by mass aqueous solution of the coupling agent indicates a pH of 7 or less, and wherein a sintering starting temperature is 500° C. or higher.

A contact area structure including an organic substrate, an inorganic conductive layer, an organic adhesive layer, and a transparent conductive layer is provided. The organic substrate includes at least one contact pad area including a first block and a second block adjacent to the first block. The inorganic conductive layer is disposed on the organic substrate, in which the inorganic conductive layer is partially disposed on the first block, and a portion of an upper surface of the organic substrate is exposed at the second block. The inorganic conductive layer and the upper surface of the organic substrate are covered by the organic adhesive layer. The transparent conductive layer is disposed on the organic adhesive layer, so that the adhesive strength between the transparent layer and the inorganic conductive layer can be enhanced.

A transparent conductive film (10) that has a substrate (14) having a surface (14a, 14b), a nanowire layer (12, 12a) over one or more portions of the surface (14a, 14b) of the substrate (14), and a conductive layer (16, 16a) on the portions comprising the nanowire layer (12, 12a), the conductive layer (16, 16a) comprising carbon nanotubes (CNT) and a binder.

The present invention discloses a method for creating spin-affected electric currents passively and feeding them into electric devices. The invention can be realized as either a rectangular black box incorporating coatings on top of and on the bottom of a conducting volume of material, or by coating a round-shaped wire or thread(s) of a cable. This is obtained by using a specific coating material on the conducting piece of material. The material may be piezoelectric, such as silicon dioxide (i.e. quartz) but also silicon carbide (SiC) may be used. Also, mixtures and composite arrangements are possible in order to create a coating. The manufactured add-on unit, when supplied with the input power or input signal, will act as an electron spin feeding device to the electric device because the electrons will be moving strongly within the interface area of the coating and the conducting material with aligned spins. The resulting effect also lasts longer within the electric device than just the time when the add-on unit is connected to the electric device.

An insulated wire includes: a copper alloy conductor; and at least one resin layer directly or indirectly coated on an outer peripheral face of the copper alloy conductor, in which the copper alloy conductor has a composition where a total content of metal components selected from Al, Be, Cd, Mg, Pb, Ni, P, Sn, and Cr is from 0.1 to 2.0 ppm and content of copper is 99.96 mass % or higher, and has a specific texture where an average orientation density in an area where φ2=0 degrees, φ1=0 degrees, and Φ=from 0 degrees to 90 degrees is from 3.0 to less than 35.0, and a maximum orientation density in an area where φ2=35 degrees, φ1=from 45 degrees to 55 degrees, and Φ=from 65 degrees to 80 degrees is from 1.0 to less than 30.0.

A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.1% by weight or less of oxygen and wherein the particle diameter (D50 diameter) corresponding to 50% of accumulation in volume-based cumulative distribution of the silver powder, which is measured by means of a laser diffraction particle size analyzer, is in the range of from 1 μm to 15 μm, the average particle diameter (SEM diameter) of single particles being in the range of from 1 μm to 8 μm when it is measured by means of a field emission scanning electron microscope (SEM), the ratio (SEM diameter/D50 diameter) of the SEM diameter to the D50 diameter being in the range of from 0.3 to 1.0.

A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 μm or more.

A copper alloy trolley wire is formed of a composition containing Mg in a range of 0.15% by mass or more and 0.50% by mass or less, Cr in a range of 0.25% by mass or more and 1.0% by mass or less, and a Cu balance containing inevitable impurities, in which a tensile strength is 600 MPa or higher and an electrical conductivity is 60% IACS or higher.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.