A bus bar and a method of manufacturing the same may include a first metal portion made of a first metal material; and a second metal portion made of a second metal material different than the first metal portion. The first metal portion and the second metal portion are coupled by a rotation friction welding (RFW).

In this slit copper material, a purity of Cu is 99.96% by mass or greater, a ratio W/t of a plate width W to a plate thickness t is 10 or greater, an electrical conductivity is 97.0% IACS or greater, and an average value of orientation densities at φ2=5°, in a range of φ1=0° to 90°, and at Φ=0° in a plate center portion is 2.0 or greater and less than 30.0.

The present disclosure discloses a conductive film, including a flexible substrate, an optical adjustment layer, a weathering layer, and an electrical conduction layer sequentially from bottom to top. The electrical conduction layer includes metal and an oxide/nitride of the metal, and a thickness of the electrical conduction layer is less than or equal to 10 nm. The present disclosure solves the problem of a poor electrical conduction effect caused by an island structure of metal serving as an electrical conduction layer, and improves the light transmittance of the conductive film.

The invention relates to a solid composite material comprising copper and an amount by volume of silver of less than about 5% by volume, relative to the total volume of said material, a process for manufacturing said material, and the uses of said material in various applications.

A method for manufacturing modified electrically-conductive copper particles, includes introducing copper having an average diameter of 0.5 to 20 μm into a water bath. The water bath has no complexing agents and no organic buffer agents. The water bath includes at least one water-soluble metal salt with at least one metal cation, at least one phosphoric reducing agent and at least one surfactant. The method includes heating the water bath with the copper particles to a temperature from 30 to 99° C. within a time necessary for forming, on the surface of the copper particles, an epitaxial metal layer of a thickness from 1 to 5 nm.

This stabilizer material for superconductor includes a copper material, wherein the copper material contains one kind or two kinds or more of additive elements selected from Ca, La, and Ce for a total amount of 3 ppm by mass or more and 400 ppm by mass or less, with the remainder being Cu and unavoidable impurities, and the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or two kinds or more selected from CaS, CaSO.sub.4, LaS, La.sub.2SO.sub.2, CeS, and Ce.sub.2SO.sub.2 are present in the matrix.

A composite cable which makes it possible to improve disconnection resistance of a signal line. The composite cable includes a signal line part, a pair of power supply lines, and a sheath. The signal line part is composed of a first signal line and a second signal line twisted together. Each of the first signal line and the second signal line is composed of a pair of wires twisted together. The sheath covers an outer circumference of a wire bundle composed of the signal line part and a pair of power supply lines, the signal line part and the pair of power supply lines being twisted together. The signal line part is covered with a shield conductor formed of a conductive element wire spirally wound around the outer circumference of the signal line part.

The present disclosure relates generally to wires and more particularly to textured powder wires containing nanoscale metallic silver powder. The invention presents an improvement of the process of making compressed cores of textured-powder high-temperature superconductor previously using the micaceous high-temperature superconductor Bi-2212. Embodiments of the claimed methods are useful with the micaceous high-temperature superconductors, notably Bi2Sr2CaCu2O8+x (Bi-2212) and Bi2Sr2Ca2Cu3O10+x (Bi-2223) and rare earth barium copper oxide (REBCO).

This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.

Electrical connector includes a housing, signal contacts, and ground shields. The signal contacts are coupled to the housing and positioned for mating with mating signal contacts of a mating connector. The ground shields are coupled to the housing and at least partially surround the signal contacts to shield the signal contacts. The ground shields are plated with a ground-material composition along one or more contact segments of the ground shields that come into compression engagement with one or more other conductive members. The ground-material composition includes a tin-nickel (Sn/Ni) alloy plating layer. The signal contacts are plated with a signal-material composition that is different than the ground-material composition.