A cable intended for use in a nuclear environment includes one or more conductors, a longitudinally applied corrugated shield surrounding the one or more conductors, and a cross-linked polyolefin jacket layer surrounding the longitudinally applied corrugated shield. The cable conducts about 5,000 volts to about 68,000 volts in use and is radiation resistant and heat resistant. The cable comprises a life span of about 40 years or more when measured in accordance with IEEE 323. Methods for making a cable and a nuclear reactor utilizing such a cable are also provided.

A coating liquid for forming a conductive layer according to the present invention is a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersant, and a dispersion medium. In the coating liquid for forming a conductive layer, the fine metal particles contain copper or a copper alloy as a main component, the dispersant is a polyethyleneimine-polyethylene oxide graft copolymer, a polyethyleneimine moiety in the graft copolymer has a weight-average molecular weight of 300 or more and 1,000 or less, a molar ratio of polyethylene oxide chains to nitrogen atoms in the polyethyleneimine moiety is 10 or more and 50 or less, and the graft copolymer has a weight-average molecular weight of 3,000 or more and 54,000 or less.

To provide a lead wire for narrow space insertion that is easily inserted into an elongated small-diameter pipe or small-diameter tube such as an ultrasonic probe or an electrode catheter. The above-described problem is solved by a lead wire for narrow space insertion including a copper alloy wire having a conductor diameter within a range of 0.015 to 0.18 mm, and an insulating layer provided to an outer periphery of the copper alloy wire. A friction coefficient of an outermost surface layer of the insulating layer is within a range of 0.05 to 0.3, a tensile strength of the lead wire is within a range of 700 to 1,500 MPa, and a conductivity of the copper alloy wire is within a range of 60 to 90% IACS.

The present invention provides a Cu alloy bonding wire for a semiconductor device, where the bonding wire can satisfy requirements of high-density LSI applications. In the Cu alloy bonding wire for a semiconductor device, the abundance ratio of a crystal orientation <110> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis to crystal orientations on a wire surface is 25% or more and 70% or less in average area percentage.

A high-strength and high-conductivity copper alloy and applications of the alloy as a material of a contact line of a high-speed railway allowing a speed higher than 400 kilometers per hour. The copper alloy has the following characteristics: (1) constituents of the copper alloy are in the form of CuXY, X is one or more selected from Ag, Nb and Ta, and Y is one of more selected from Cr, Zr and Si; (2) at a room temperature, the element X in the copper alloy exists in the form of a pure phase and solid solution atoms, the element Y exists in the form of a pure phase and solid solution atoms or a CuY compound and solid solution atoms, the content of the element X existing in the form of the solid solution atoms is lower than 0.5%, and the content of the element Y existing in the form of the solid solution atoms is lower than 0.1%; and (3) the copper alloy exists in the form of long strip rods or lines, the element X in the form of the pure phase is embedded in the copper alloy in the form of fibers disposed in parallel approximately, and the axial direction of the fibers is approximately in parallel with the axial direction of the copper alloy rods or lines; and the element Y existing in the copper alloy in the form of the pure phase or the CuY compound is embedded in the copper alloy in the form of particles. The copper alloy is suitable for being used as a material of a contact line of a high-speed railway allowing a speed higher than 400 kilometers per hour.

A wire-drawing method comprises providing a rod comprising a wrapped sheet, wherein the sheet comprises a plurality of copper layers and a plurality of graphene layers; extracting an inner layer of the wrapped sheet from the rod to form a spiral; and forming a wire by feeding the spiral through an opening of a die unit.

Provided is a method of manufacturing a downhole cable, the method including, forming a helical shape in an outer circumferential surface of a metal tube, the metal tube having a fiber element housed therein, and stranding a copper element in a helical space formed by the metallic tube. Also provided is a downhole cable including, a metallic tube having a helical space in an outer circumferential surface thereof, wherein the metallic tube has a fiber element housed therein, and a copper element disposed in a helical space formed by the steel tube. Double-tube and multi-tube configurations of the downhole cable are also provided.

The present invention relates to use of an enhanced performance ultraconductive copper composite cylindrical conduit. The ultraconductive copper composite cylindrical conduit has enhanced RF conductivity.

The present invention relates to an enhanced performance ultraconductive copper composite structure. The ultraconductive copper composite structure comprises at least two composite layers in which the interface between the two composite layers is sufficiently close to the surface of the ultraconductive copper composite so as to enhance the RF conductivity of the ultraconductive copper composite. The present invention also provides for method of forming such a ultraconductive copper composite structure.

The present invention relates to metallic structure with desired combinations of mechanical and electrical characteristics formed of a higher electrical conductivity element with a mechanically stronger element