Patent classifications
H01B1/026
CABLING APPARATUS FOR HIGH RESISTANCE APPLICATIONS
A telecommunications cable for making high resistance measurements comprising a plurality of bundles, each comprising a twisted pair of Category 6a copper conductors and a metal foil shield, one of said copper conductors in each twisted pair serving as a signal wire and the other of said copper conductors in each twisted pair being grounded to thereby serve as a noise ground; a braided grounded metal sheath surrounding said plurality of bundles of twisted pairs; and a grounded shield used as an outer sleeve, whereby said cable is triple grounded.
ELECTRIC WIRE CONDUCTOR, COVERED ELECTRIC WIRE, AND WIRING HARNESS
Provided are an electric wire conductor having both flexibility and a space-saving property, a covered electric wire, and a wiring harness containing such an electric wire conductor. The electric wire conductor contains a plurality of elemental wires, and has a flat portion in which a cross-section intersecting an axial direction of the wire strand has a flat shape. Deformation ratios of the elemental wires at peripheral end parts in a width direction are 70% or lower of deformation ratios of the elemental wires at center parts. Further, a covered electric wire contains the electric wire conductor and an insulator covering the electric wire conductor.
METALLIC MATERIAL AND CONNECTION TERMINAL
A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.
Method for manufacturing a conductive wire
A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
COVERED ELECTRICAL WIRE, TERMINAL-EQUIPPED ELECTRICAL WIRE, AND TWISTED WIRE
A covered electrical wire including a conductor and an insulating coating layer covering the outer periphery of the conductor, in which the conductor is a twisted wire obtained by twisting together a plurality of elemental wires constituted by copper or a copper alloy, and the covered electrical wire includes a metallically bonded portion where the elemental wires that are adjacent to each other are metallically bonded to each other.
INSULATED WIRE MATERIAL AND METHOD OF MANUFACTURING THE SAME, AND COIL AND ELECTRICAL/ELECTRONIC EQUIPMENT
Provided are an insulated wire material including: a conductor including a single core conductor or a plurality of divided conductors placed in parallel to each other or helically placed; a peripheral insulating layer with which a periphery of the conductor is coated; and a welding member provided at at least one end portion of the conductor and joined, via a welded portion welded to the single core conductor or divided conductors, to at least a peripheral surface of the welded portion, a manufacturing method thereof, a coil including the insulated wire material, and electrical/electronic equipment including the coil.
Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder
Provided is a copper powder which can be suitably utilized in applications such as an electrically conductive paste and an electromagnetic wave shield. A copper powder according to the present invention has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 m to 5.0 m to be determined by scanning electron microscopic SEM observation gather, the average particle diameter D50 of the copper powder is from 1.0 m to 100 m, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRIC-WIRE TERMINAL STRUCTURE
Provided is a tin-plated copper terminal material, a terminal formed from the terminal material, and an electric-wire terminal structure using the terminal: the terminal material has a substrate of copper or a copper alloy; an intermediate zinc layer of a zinc alloy that is formed on the substrate and has a thickness of 0.10 m to 5.00 m; and a tin layer of tin or a tin alloy that is formed on the intermediate zinc layer and in which the length proportion occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed.
Method of interconnecting nanowires and transparent conductive electrode
According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.
Method for electrically connecting an electronic module and electronic assembly
An electronic assembly has an electronic module and an electric part. The electronic module has an electric terminal having a press-fit section. The press-fit section includes at least one of the following CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg. The electric part has a contact hole. The electronic assembly includes a press-fit connection between the press-fit section and the electric part. In that press-fit connection, the press-fit section both mechanically and electrically contacts the electric part.